| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A continuous contact resistance monitoring during the temperature ramp of anisotropic conductive adhesive film joint
|
Uddin, M. A.
|
|
2004
|
33 |
1 |
p. 14-21
|
artikel
|
| 2 |
Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization
|
Kim, Hyoungjae
|
|
2004
|
33 |
1 |
p. 53-60
|
artikel
|
| 3 |
Fiber-alignment shifts in butterfly laser packaging by laser-welding technique: Measurement and finite-element method analysis
|
Hsu, Y. C.
|
|
2004
|
33 |
1 |
p. 40-47
|
artikel
|
| 4 |
Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film
|
Yim, Myung Jin
|
|
2004
|
33 |
1 |
p. 76-82
|
artikel
|
| 5 |
Indium- and tungsten-doped ZnGa2O4 phosphor
|
Yang, Su-Hua
|
|
2004
|
33 |
1 |
p. L1-L4
|
artikel
|
| 6 |
Kinetics of the Au-Ni-Sn ternary intermetallic layer redeposition at the solder/under-bump metallurgy interface during aging treatment
|
Lee, Jong-Hyun
|
|
2004
|
33 |
1 |
p. 28-33
|
artikel
|
| 7 |
Mechanical strength of Sn-3.5Ag-based solders and related bondings
|
Chuang, Chiang-Ming
|
|
2004
|
33 |
1 |
p. 1-6
|
artikel
|
| 8 |
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
|
Chuang, T. H.
|
|
2004
|
33 |
1 |
p. 22-27
|
artikel
|
| 9 |
Microstructure and strength of bump joints in photodiode packages
|
Kim, Kyung-Seob
|
|
2004
|
33 |
1 |
p. 70-75
|
artikel
|
| 10 |
Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad
|
Chiang, M. J.
|
|
2004
|
33 |
1 |
p. 34-39
|
artikel
|
| 11 |
Relationship between grain structures and texture of damascene Cu lines
|
Paik, Jong-Min
|
|
2004
|
33 |
1 |
p. 48-52
|
artikel
|
| 12 |
TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnections
|
Wang, H.
|
|
2004
|
33 |
1 |
p. L5
|
artikel
|
| 13 |
The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates
|
Chuang, Chiang-Ming
|
|
2004
|
33 |
1 |
p. 7-13
|
artikel
|
| 14 |
The microstructure characterization of ultrasmall eutectic Bi-Sn solder bumps on Au/Cu/Ti and Au/Ni/Ti under-bump metallization
|
Kang, Un-Byoung
|
|
2004
|
33 |
1 |
p. 61-69
|
artikel
|
| 15 |
Thermal effects in thin copper foil
|
Merchant, H. D.
|
|
2004
|
33 |
1 |
p. 83-88
|
artikel
|
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