| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies
|
Sarvar, Farhad
|
|
1998
|
30 |
1-2 |
p. 47-63
17 p.
|
artikel
|
| 2 |
Applications of FEM for multiple laminated structure in electronic packaging
|
Oda, Juhachi
|
|
1998
|
30 |
1-2 |
p. 147-162
16 p.
|
artikel
|
| 3 |
Design-of-experiment methods for computational parametric studies in electronic packaging
|
Dasgupta, Abhijit
|
|
1998
|
30 |
1-2 |
p. 125-146
22 p.
|
artikel
|
| 4 |
Effect of geometric parameters on popcorn cracking in plastic packages during VPS process
|
Lee, Kyung W.
|
|
1998
|
30 |
1-2 |
p. 81-96
16 p.
|
artikel
|
| 5 |
Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages
|
Yi, Sung
|
|
1998
|
30 |
1-2 |
p. 65-79
15 p.
|
artikel
|
| 6 |
Finite-element analysis of silicon condenser microphones with corrugated diaphragms
|
Ying, Ming
|
|
1998
|
30 |
1-2 |
p. 163-173
11 p.
|
artikel
|
| 7 |
Investigation of stress singularity fields and stress intensity factors for cracks
|
Amagai, Masazumi
|
|
1998
|
30 |
1-2 |
p. 97-124
28 p.
|
artikel
|
| 8 |
Process capability study and thermal fatigue life prediction of ceramic BGA solder joints
|
Xie, D.J
|
|
1998
|
30 |
1-2 |
p. 31-45
15 p.
|
artikel
|
| 9 |
Thermal-mechanical interface crack behaviour of a surface mount solder joint
|
Wu, C.M.L
|
|
1998
|
30 |
1-2 |
p. 19-30
12 p.
|
artikel
|
| 10 |
Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model
|
Fu, Chiayu
|
|
1998
|
30 |
1-2 |
p. 1-17
17 p.
|
artikel
|
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