| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
a-C:H Films deposited on crystalline silicon to masking it anisotropic etching by aqueous ethylenediamine solution
|
Fissore, A
|
|
2001
|
32 |
1 |
p. 49-51
3 p.
|
artikel
|
| 2 |
An analytical model of small-signal parameters for GaAs/AlGaAs inverted high electron mobility transistors
|
Liu, K.-W.
|
|
2001
|
32 |
1 |
p. 85-88
4 p.
|
artikel
|
| 3 |
Application of I DDQ test in failure analysis of micro-controller devices
|
Wong, M.W.T.
|
|
2001
|
32 |
1 |
p. 29-34
6 p.
|
artikel
|
| 4 |
A Si MEMS microbearing with integrated safety sensors for surgical applications
|
Horváth, I.
|
|
2001
|
32 |
1 |
p. 1-9
9 p.
|
artikel
|
| 5 |
Designing CMOS folded-cascode operational amplifier with flicker noise minimisation
|
Chan, P.K
|
|
2001
|
32 |
1 |
p. 69-73
5 p.
|
artikel
|
| 6 |
Device simulation of a n-DMOS cell with trench isolation
|
Kamoulakos, G
|
|
2001
|
32 |
1 |
p. 75-80
6 p.
|
artikel
|
| 7 |
Eliminating non-logical states from linear quantum-dot-cellular automata
|
Lusth, J.C.
|
|
2001
|
32 |
1 |
p. 81-84
4 p.
|
artikel
|
| 8 |
Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors
|
Bhattacharya, S.K
|
|
2001
|
32 |
1 |
p. 11-19
9 p.
|
artikel
|
| 9 |
Low-frequency generation–recombination noise in fully overlapped lightly doped drain MOSFETs
|
Kumar, A.
|
|
2001
|
32 |
1 |
p. 43-47
5 p.
|
artikel
|
| 10 |
Low-power flip-flops with reliable clock gating
|
Strollo, A.G.M
|
|
2001
|
32 |
1 |
p. 21-28
8 p.
|
artikel
|
| 11 |
Multi-Carrier Spread Spectrum and Related Topics
|
Saidane, A
|
|
2001
|
32 |
1 |
p. 89-90
2 p.
|
artikel
|
| 12 |
Novel approach to sputtered tantalum film resistors with controlled pre-defined resistance
|
Golan, G.
|
|
2001
|
32 |
1 |
p. 61-67
7 p.
|
artikel
|
| 13 |
Scaling embedded EEPROMs for the integration in deepsubmicron technologies
|
Duffy, R
|
|
2001
|
32 |
1 |
p. 35-42
8 p.
|
artikel
|
| 14 |
Stochastic simulation of electromigration failure of flip chip solder bumps
|
Tang, Z
|
|
2001
|
32 |
1 |
p. 53-60
8 p.
|
artikel
|
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