nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comparison of MOS processes for VLSI Part I
|
|
|
1987 |
18 |
5 |
p. 61- 1 p. |
artikel |
2 |
A comprehensive sequence for the electron beam exposure system
|
|
|
1987 |
18 |
5 |
p. 63- 1 p. |
artikel |
3 |
Ammonium persulfate as a stripping and cleaning oxidant
|
|
|
1987 |
18 |
5 |
p. 62- 1 p. |
artikel |
4 |
An approach to ensure stability of precision laser trimmed thick film resistors
|
|
|
1987 |
18 |
5 |
p. 64- 1 p. |
artikel |
5 |
A novel memory device for VLSI E2PROM
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
6 |
A simulative approach to electron conduction is thickfilm resistors
|
|
|
1987 |
18 |
5 |
p. 64- 1 p. |
artikel |
7 |
Bipolar device packaging-electrical, thermal, and mechanical stress considerations
|
|
|
1987 |
18 |
5 |
p. 61- 1 p. |
artikel |
8 |
Bipolar gate array delivers fast signal processing
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
9 |
Ceramic on metal substrates produced by plasma spraying for thick film technology
|
|
|
1987 |
18 |
5 |
p. 62- 1 p. |
artikel |
10 |
Compatibility in microcomputers
|
|
|
1987 |
18 |
5 |
p. 59- 1 p. |
artikel |
11 |
Computer power to the people: computer resource centres or home terminals? Two scenarios
|
|
|
1987 |
18 |
5 |
p. 61- 1 p. |
artikel |
12 |
Computers put you in the picture
|
|
|
1987 |
18 |
5 |
p. 59- 1 p. |
artikel |
13 |
Current noise is thick and thin film resistors
|
|
|
1987 |
18 |
5 |
p. 64- 1 p. |
artikel |
14 |
CV characteristics of MOS capacitors with two top capacitive contacts
|
McGillivray, I.G. |
|
1987 |
18 |
5 |
p. 25-27 3 p. |
artikel |
15 |
Data processing caught in the act
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
16 |
Design for testability—a survey
|
|
|
1987 |
18 |
5 |
p. 63- 1 p. |
artikel |
17 |
Design system for semicustom VLSI circuits
|
|
|
1987 |
18 |
5 |
p. 61- 1 p. |
artikel |
18 |
Design systems for VLSI circuits
|
|
|
1987 |
18 |
5 |
p. 47- 1 p. |
artikel |
19 |
Developments in crystal growth from high-temperature solutions
|
|
|
1987 |
18 |
5 |
p. 62- 1 p. |
artikel |
20 |
Editorial
|
Butcher, John B. |
|
1987 |
18 |
5 |
p. 3- 1 p. |
artikel |
21 |
Electrical properties of Si−SiO2 structures treated in helium plasma
|
Kassabov, J. |
|
1987 |
18 |
5 |
p. 5-12 8 p. |
artikel |
22 |
Evaluation of Du Pont copper-compatible resistor system
|
|
|
1987 |
18 |
5 |
p. 64- 1 p. |
artikel |
23 |
Failures induced by electromigration in ECL 100k devices
|
|
|
1987 |
18 |
5 |
p. 62- 1 p. |
artikel |
24 |
Fast CMOS logic bids for TTL sockets in most systems
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
25 |
Fifth generation computing promises optimistic outlook for 1990's
|
|
|
1987 |
18 |
5 |
p. 59- 1 p. |
artikel |
26 |
Forthcoming events
|
|
|
1987 |
18 |
5 |
p. 58- 1 p. |
artikel |
27 |
Handbook of Microelectronics Packaging and Interconnection Technologies
|
Pitt, Keith |
|
1987 |
18 |
5 |
p. 45-46 2 p. |
artikel |
28 |
Impact of custom VLSI technology
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
29 |
Improved planar isolation with buried-channel MOS-FETs
|
|
|
1987 |
18 |
5 |
p. 61- 1 p. |
artikel |
30 |
Interactive authoring system on a small personal computer
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
31 |
Investigation of thick film technology for microwave applications
|
Stennes, M.J. |
|
1987 |
18 |
5 |
p. 29-35 7 p. |
artikel |
32 |
It's still fast times for a hot industry
|
|
|
1987 |
18 |
5 |
p. 61- 1 p. |
artikel |
33 |
Metal migrations outside the package during accelerated life tests
|
|
|
1987 |
18 |
5 |
p. 63- 1 p. |
artikel |
34 |
Methodologies for full custom VLSI design
|
|
|
1987 |
18 |
5 |
p. 61- 1 p. |
artikel |
35 |
Modular approach to CMOS technology tailors process to application
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
36 |
[No title]
|
Shute, Malcolm |
|
1987 |
18 |
5 |
p. 45- 1 p. |
artikel |
37 |
On discrete hazard functions
|
|
|
1987 |
18 |
5 |
p. 63- 1 p. |
artikel |
38 |
Parliamentary report
|
|
|
1987 |
18 |
5 |
p. 49-51 3 p. |
artikel |
39 |
Personal computer graphics standards
|
|
|
1987 |
18 |
5 |
p. 59- 1 p. |
artikel |
40 |
Removal processes for damage and contamination after CF4/40%H2 reactive ion etching of silicon
|
Singh, Awatar |
|
1987 |
18 |
5 |
p. 13-24 12 p. |
artikel |
41 |
Research and Development
|
|
|
1987 |
18 |
5 |
p. 52-57 6 p. |
artikel |
42 |
Roop
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
43 |
Second generation' silicon compilers
|
Dlay, S.S. |
|
1987 |
18 |
5 |
p. 37-44 8 p. |
artikel |
44 |
Self-consistent theory of diagonal and off-diagonal disorder in the screened impurity band of doped semiconductors
|
|
|
1987 |
18 |
5 |
p. 62- 1 p. |
artikel |
45 |
Semiconductor processing
|
|
|
1987 |
18 |
5 |
p. 63- 1 p. |
artikel |
46 |
Solder pastes for microelectronics
|
|
|
1987 |
18 |
5 |
p. 62- 1 p. |
artikel |
47 |
Status and prospects for gallium arsenide technology
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
48 |
The ageing behaviour of commercial thick-film resistors
|
|
|
1987 |
18 |
5 |
p. 63-64 2 p. |
artikel |
49 |
The bubble is surfacing
|
|
|
1987 |
18 |
5 |
p. 59- 1 p. |
artikel |
50 |
The integrated office: its present and future
|
|
|
1987 |
18 |
5 |
p. 59-60 2 p. |
artikel |
51 |
Thermal Design of Electronic Circuit Boards and Packages
|
Pitt, Keith |
|
1987 |
18 |
5 |
p. 46- 1 p. |
artikel |
52 |
The role of inorganic materials in dry-processed resist technology
|
|
|
1987 |
18 |
5 |
p. 62- 1 p. |
artikel |
53 |
Transition to one micro technology: Part 2
|
|
|
1987 |
18 |
5 |
p. 61- 1 p. |
artikel |
54 |
Using micros to manage production
|
|
|
1987 |
18 |
5 |
p. 60- 1 p. |
artikel |
55 |
ZRM 20—an electron-beam mask and wafer measuring and inspection system
|
|
|
1987 |
18 |
5 |
p. 63- 1 p. |
artikel |