nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A ceramic capacitor substrate for high speed switching VLSI chips
|
|
|
1985 |
16 |
4 |
p. 40-41 2 p. |
artikel |
2 |
A CMOS process for VLSI instrumentation
|
|
|
1985 |
16 |
4 |
p. 44- 1 p. |
artikel |
3 |
Advances in VLSI plasma etching
|
|
|
1985 |
16 |
4 |
p. 43- 1 p. |
artikel |
4 |
An integrated LSI design aids system
|
Martin, G. |
|
1985 |
16 |
4 |
p. 38- 1 p. |
artikel |
5 |
A novel approach for higher yield in thick-film resistors
|
Matkari, A.K. |
|
1985 |
16 |
4 |
p. 42- 1 p. |
artikel |
6 |
Answer to the comment by Dzekov Tomislav and Arsov Goce in Microelectronics Journal Vol. 15 No 3 by B. L. Dokić (See page 32)
|
Dokić, Branko L. |
|
1985 |
16 |
4 |
p. 30-31 2 p. |
artikel |
7 |
A review of self-scanned image sensors
|
Beynon, J.D.E. |
|
1985 |
16 |
4 |
p. 39- 1 p. |
artikel |
8 |
A submicron CMOS/SOS process for VLSI
|
|
|
1985 |
16 |
4 |
p. 42-43 2 p. |
artikel |
9 |
A thick film conductive microline fabrication technique
|
Singh, Awatar |
|
1985 |
16 |
4 |
p. 17-21 5 p. |
artikel |
10 |
Bonding refractory sputtering targets
|
|
|
1985 |
16 |
4 |
p. 43- 1 p. |
artikel |
11 |
Comments on ‘Influence of series and parallel transistors on DC characteristics of CMOS logic circuits’
|
Tomislav, Dzekov |
|
1985 |
16 |
4 |
p. 32-33 2 p. |
artikel |
12 |
Comparison of new technologies for VLSI: possibilities and limitations
|
Nishi, Yoshio |
|
1985 |
16 |
4 |
p. 39- 1 p. |
artikel |
13 |
Controlled anisotropic etching of polysilicon
|
|
|
1985 |
16 |
4 |
p. 43- 1 p. |
artikel |
14 |
Copper impurity levels in silicon
|
|
|
1985 |
16 |
4 |
p. 41- 1 p. |
artikel |
15 |
DKG 160 photomask inspection equipment localizes defects in IC patterns
|
|
|
1985 |
16 |
4 |
p. 44- 1 p. |
artikel |
16 |
Editorial
|
Butcher, John |
|
1985 |
16 |
4 |
p. 3-4 2 p. |
artikel |
17 |
Evaluating the MIL-STD-883B alternate die visual screen for LSI
|
|
|
1985 |
16 |
4 |
p. 41- 1 p. |
artikel |
18 |
Forthcoming events
|
|
|
1985 |
16 |
4 |
p. 46-48 3 p. |
artikel |
19 |
How a new generation of microprocessors supports modular programming in high-level languages
|
Hartman, Alfred C. |
|
1985 |
16 |
4 |
p. 39- 1 p. |
artikel |
20 |
Ideal projection lithography using a multilayer resist process
|
|
|
1985 |
16 |
4 |
p. 42- 1 p. |
artikel |
21 |
Ion distribution near a mask edge with arbitrary shape for VLSI IC applications
|
Lutsch, A.G.K. |
|
1985 |
16 |
4 |
p. 5-16 12 p. |
artikel |
22 |
Isolation tecniques for very large scale integration
|
|
|
1985 |
16 |
4 |
p. 41- 1 p. |
artikel |
23 |
Laser processing cuts wider swath
|
|
|
1985 |
16 |
4 |
p. 44- 1 p. |
artikel |
24 |
Linewidth measurement on IC masks by diffraction from grating test patterns
|
|
|
1985 |
16 |
4 |
p. 44- 1 p. |
artikel |
25 |
Mechanical technology and quality assurance as applied to a video recorder drive mechanism
|
|
|
1985 |
16 |
4 |
p. 44- 1 p. |
artikel |
26 |
Metal migrations outside the package during accelerated life tests
|
|
|
1985 |
16 |
4 |
p. 43- 1 p. |
artikel |
27 |
Metrology in mask manufacturing
|
|
|
1985 |
16 |
4 |
p. 43- 1 p. |
artikel |
28 |
Multi-chamber dry etching system
|
|
|
1985 |
16 |
4 |
p. 43- 1 p. |
artikel |
29 |
Multi-chip module test and diagnostic methodology
|
|
|
1985 |
16 |
4 |
p. 44- 1 p. |
artikel |
30 |
New generation semiconductor C. W. laser packages with full herimeticity, integral power monitoring and direct fibre optic launching
|
Ashton, J.E.U. |
|
1985 |
16 |
4 |
p. 39-40 2 p. |
artikel |
31 |
New thick film multilayer interconnection technology using a Nd-YAG laser
|
|
|
1985 |
16 |
4 |
p. 40- 1 p. |
artikel |
32 |
[No title]
|
Arrowsmith, T. |
|
1985 |
16 |
4 |
p. 35- 1 p. |
artikel |
33 |
[No title]
|
Wilson, Kenneth F. |
|
1985 |
16 |
4 |
p. 36- 1 p. |
artikel |
34 |
[No title]
|
Arrowsmith, T. |
|
1985 |
16 |
4 |
p. 35- 1 p. |
artikel |
35 |
Novel insensitive minimal-grounded-element dual-polarity ratio-type function generation
|
Nandi, R. |
|
1985 |
16 |
4 |
p. 25-28 4 p. |
artikel |
36 |
Packaging reliability—how to define and measure it
|
|
|
1985 |
16 |
4 |
p. 41-42 2 p. |
artikel |
37 |
Pin-fet receivers for 1.3 micron fibre optic systems
|
Burges, J.W. |
|
1985 |
16 |
4 |
p. 40- 1 p. |
artikel |
38 |
Power semiconductor packaging
|
|
|
1985 |
16 |
4 |
p. 44- 1 p. |
artikel |
39 |
Semiconductor processing
|
|
|
1985 |
16 |
4 |
p. 43- 1 p. |
artikel |
40 |
Significant features of solder connections to gold-plated thin films
|
|
|
1985 |
16 |
4 |
p. 40- 1 p. |
artikel |
41 |
Silver migration in thick film conductors and chip attachment resins
|
Coleman, M.V. |
|
1985 |
16 |
4 |
p. 42- 1 p. |
artikel |
42 |
Some considerations for peripheral circuits for bubble memory
|
Okada, M. |
|
1985 |
16 |
4 |
p. 39- 1 p. |
artikel |
43 |
Specific contact resistance and noise in contacts on thin layers
|
|
|
1985 |
16 |
4 |
p. 44- 1 p. |
artikel |
44 |
The chemistry and stability of ruthenium-based resistors
|
|
|
1985 |
16 |
4 |
p. 41- 1 p. |
artikel |
45 |
The contiguous disk technology for high density bubble memories
|
Jouve, H. |
|
1985 |
16 |
4 |
p. 38-39 2 p. |
artikel |
46 |
The development of fibre optic systems for industrial applications
|
Harper, D.W. |
|
1985 |
16 |
4 |
p. 40- 1 p. |
artikel |
47 |
Thermal-wave microscopy
|
|
|
1985 |
16 |
4 |
p. 42- 1 p. |
artikel |
48 |
The role of transport in very small devices for VLSI
|
Ferry, D.K. |
|
1985 |
16 |
4 |
p. 38- 1 p. |
artikel |
49 |
The silicon process balancing act for VLSI
|
|
|
1985 |
16 |
4 |
p. 43- 1 p. |
artikel |
50 |
The use of molybdenum in semiconductor devices
|
|
|
1985 |
16 |
4 |
p. 41- 1 p. |
artikel |
51 |
Thick film materials and reliability
|
|
|
1985 |
16 |
4 |
p. 40- 1 p. |
artikel |
52 |
Trends in metallization materials
|
|
|
1985 |
16 |
4 |
p. 41- 1 p. |
artikel |
53 |
Use of PVC for front surface protection of wafers during electrolytic gold backing
|
Nieuwoudt, Michèl K. |
|
1985 |
16 |
4 |
p. 22-23 2 p. |
artikel |
54 |
Wafer steppers: considering the issues
|
|
|
1985 |
16 |
4 |
p. 42- 1 p. |
artikel |