nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Advances in automated wire and die bonding
|
|
|
1984 |
15 |
4 |
p. 59- 1 p. |
artikel |
2 |
Advances in contamination control of processing chemicals in VLSI
|
|
|
1984 |
15 |
4 |
p. 62- 1 p. |
artikel |
3 |
An approach to ensure stability of precision laser trimmed thick film resistors
|
|
|
1984 |
15 |
4 |
p. 60-61 2 p. |
artikel |
4 |
An automated, low power, high speed complementary PLA design system for VLSI applications
|
Powell, S. |
|
1984 |
15 |
4 |
p. 47-54 8 p. |
artikel |
5 |
A new failure mechanism in thin gold films at elevated temperatures
|
|
|
1984 |
15 |
4 |
p. 63- 1 p. |
artikel |
6 |
Applications of ellipsometry to in situ study of the growth of hydrogenated amorphous films
|
|
|
1984 |
15 |
4 |
p. 63-64 2 p. |
artikel |
7 |
A simulative approach to electron conduction is thick-film resistors
|
|
|
1984 |
15 |
4 |
p. 60- 1 p. |
artikel |
8 |
A single-chip CMOS analog front-end for high-speed modems
|
Fotouhi, B. |
|
1984 |
15 |
4 |
p. 5-19 15 p. |
artikel |
9 |
Assembley equipment users speak out
|
|
|
1984 |
15 |
4 |
p. 63- 1 p. |
artikel |
10 |
Back-contact resistor network pares wire count in ECL hybrids
|
|
|
1984 |
15 |
4 |
p. 60- 1 p. |
artikel |
11 |
Ceramic on metal substrates produced by plasma spraying for thick film technology
|
|
|
1984 |
15 |
4 |
p. 64- 1 p. |
artikel |
12 |
Chip-carriers change their course
|
|
|
1984 |
15 |
4 |
p. 60- 1 p. |
artikel |
13 |
CMOS single-chip digital signal processor
|
Hara, Hideo |
|
1984 |
15 |
4 |
p. 20-28 9 p. |
artikel |
14 |
Combinatorial reliability analysis of multiprocessor computers
|
|
|
1984 |
15 |
4 |
p. 58- 1 p. |
artikel |
15 |
Current noise is thick and thin film resistors
|
|
|
1984 |
15 |
4 |
p. 60- 1 p. |
artikel |
16 |
Density upgrading in tape automated bonding
|
|
|
1984 |
15 |
4 |
p. 59-60 2 p. |
artikel |
17 |
Developments in crystal growth from high-temperature solutions
|
|
|
1984 |
15 |
4 |
p. 64- 1 p. |
artikel |
18 |
Device modeling
|
|
|
1984 |
15 |
4 |
p. 59- 1 p. |
artikel |
19 |
Diffusion of zinc into ion-implanted gallium arsenide
|
|
|
1984 |
15 |
4 |
p. 63- 1 p. |
artikel |
20 |
Editorial
|
Butcher, John |
|
1984 |
15 |
4 |
p. 3- 1 p. |
artikel |
21 |
Effects of MBE growth conditions on carbon contamination in GaAs
|
|
|
1984 |
15 |
4 |
p. 63- 1 p. |
artikel |
22 |
Evaluation of Du Pont copper-compatible resistor system
|
|
|
1984 |
15 |
4 |
p. 61- 1 p. |
artikel |
23 |
Experience with polymer thick film technology
|
|
|
1984 |
15 |
4 |
p. 60- 1 p. |
artikel |
24 |
Failure modes induced in TTL-LS bipolar logics by negative inputs
|
|
|
1984 |
15 |
4 |
p. 58- 1 p. |
artikel |
25 |
Float-zoning of semiconductor silicon: a perspective
|
|
|
1984 |
15 |
4 |
p. 62- 1 p. |
artikel |
26 |
Integrable tunable dual-function integrator/differentiator network with extremely low value grounded capacitor
|
Nandi, S. |
|
1984 |
15 |
4 |
p. 41-46 6 p. |
artikel |
27 |
Ion beam etching with reactive gases
|
|
|
1984 |
15 |
4 |
p. 64- 1 p. |
artikel |
28 |
Ion projection microlithography
|
|
|
1984 |
15 |
4 |
p. 64- 1 p. |
artikel |
29 |
Minority carrier diffusion length in LPE InxGa1−xP:N layers (χ<0.01)
|
|
|
1984 |
15 |
4 |
p. 61- 1 p. |
artikel |
30 |
Model for transient and permanent error-detection and fault-isolation coverage
|
|
|
1984 |
15 |
4 |
p. 58-59 2 p. |
artikel |
31 |
Non-homogeneous electrical transport through silicon-on-sapphire thin films: evidence of the internal stress influence
|
|
|
1984 |
15 |
4 |
p. 61-62 2 p. |
artikel |
32 |
[No title]
|
Brazier, T. |
|
1984 |
15 |
4 |
p. 57- 1 p. |
artikel |
33 |
[No title]
|
Stoddart, R. |
|
1984 |
15 |
4 |
p. 55- 1 p. |
artikel |
34 |
[No title]
|
Bayford, Richard |
|
1984 |
15 |
4 |
p. 55-56 2 p. |
artikel |
35 |
[No title]
|
Bayford, Richard |
|
1984 |
15 |
4 |
p. 56-57 2 p. |
artikel |
36 |
On discrete hazard functions
|
|
|
1984 |
15 |
4 |
p. 61- 1 p. |
artikel |
37 |
Particle size analysis techniques for metal powders and frits used in thick-film pastes
|
|
|
1984 |
15 |
4 |
p. 62-63 2 p. |
artikel |
38 |
Parts control and reliability assurance of RF hybrids
|
|
|
1984 |
15 |
4 |
p. 59- 1 p. |
artikel |
39 |
Properties of digital microelectronic systems from the viewpoint of signal transmission
|
|
|
1984 |
15 |
4 |
p. 58- 1 p. |
artikel |
40 |
Self-consistent theory of diagonal and off-diogonal disorder in the screened impurity band of doped semiconductors
|
|
|
1984 |
15 |
4 |
p. 64- 1 p. |
artikel |
41 |
Temperature verification of hybrid microelectronic circuit design
|
|
|
1984 |
15 |
4 |
p. 59- 1 p. |
artikel |
42 |
The ageing behaviour of commercial thick-film resistors
|
|
|
1984 |
15 |
4 |
p. 61- 1 p. |
artikel |
43 |
The design of a truly random monolithic noise generator
|
Penzhorn, W.T. |
|
1984 |
15 |
4 |
p. 29-40 12 p. |
artikel |
44 |
The influence of hydrogen gas on the characteristics of amorphous silicon deposited by RF sputtering
|
|
|
1984 |
15 |
4 |
p. 62- 1 p. |
artikel |
45 |
The properties of thick-film resistors on dielectrics
|
|
|
1984 |
15 |
4 |
p. 62- 1 p. |
artikel |
46 |
Thermal analysis helps keep hybrid microcircuits cool
|
|
|
1984 |
15 |
4 |
p. 60- 1 p. |
artikel |
47 |
Thermal characteristics of a hybrid microcircuit
|
|
|
1984 |
15 |
4 |
p. 59- 1 p. |
artikel |
48 |
The use of hybrid microelectronics in the construction of ionselective electrodes
|
|
|
1984 |
15 |
4 |
p. 60- 1 p. |
artikel |
49 |
Thin-film systems for hybrid circuits—produced by plasmatron atomizers
|
|
|
1984 |
15 |
4 |
p. 60- 1 p. |
artikel |
50 |
Time-resolved optical transmission during pulsed-laser annealing of ion-implanted amorphous silico-on-sapphire
|
|
|
1984 |
15 |
4 |
p. 63- 1 p. |
artikel |
51 |
VLSI metallization using aluminium and its alloys. Part I
|
|
|
1984 |
15 |
4 |
p. 62- 1 p. |
artikel |
52 |
VLSI metallization using aluminium and its alloys. Part II
|
|
|
1984 |
15 |
4 |
p. 62- 1 p. |
artikel |
53 |
Wafer processing in the early 1980s
|
|
|
1984 |
15 |
4 |
p. 63- 1 p. |
artikel |