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                             59 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A design for a 16 bit processor using only 600 transistors Shute, M.J.
 1984
 15 3 p. 5-11
7 p.
 artikel
2 A new technique for the evaluation of the temperatures arising from some geometrics which commonly occur in microelectronics 1984
 15 3 p. 44-
1 p.
 artikel
3 An experimental and theoretical study of polycrystalline thin film transistor 1984
 15 3 p. 45-
1 p.
 artikel
4 An integrated LSI design aids system 1984
 15 3 p. 40-
1 p.
 artikel
5 Anisotropy control in dry etching 1984
 15 3 p. 39-
1 p.
 artikel
6 Application of step stress to time dependent breakdown 1984
 15 3 p. 42-
1 p.
 artikel
7 Automated in-line puddle development of positive photoresists 1984
 15 3 p. 39-
1 p.
 artikel
8 Automating test generation closes the design loop 1984
 15 3 p. 44-
1 p.
 artikel
9 Can ATE be trusted by QC? 1984
 15 3 p. 45-
1 p.
 artikel
10 Chemiluminscence during photoresist stripping processes 1984
 15 3 p. 40-
1 p.
 artikel
11 Comments on “Influence of series and parallel transistors on DC characteristics of CMOS logic circuits” Tomislav, Dzekov
 1984
 15 3 p. 36-37
2 p.
 artikel
12 Comparison of new technologies for VLSI: possibilities and limitations 1984
 15 3 p. 38-
1 p.
 artikel
13 Condensation thermography – a novel approach for locating short circuits and determining surface temperatures in semiconductor die 1984
 15 3 p. 41-
1 p.
 artikel
14 Conductance of small semiconductor devices 1984
 15 3 p. 38-
1 p.
 artikel
15 Deep centres introduced by argon ion bombardment in n-type silicon 1984
 15 3 p. 39-
1 p.
 artikel
16 Desensitisation of the oscillation frequency of RC sub-audio sinewave generators with single resistor control Saha, A.R.
 1984
 15 3 p. 18-22
5 p.
 artikel
17 Dynamic measurement of the water vapour content of integrated circuit packages using derivative infrared diode laser spectroscopy 1984
 15 3 p. 45-
1 p.
 artikel
18 Economics of functional testing at selected levels 1984
 15 3 p. 44-
1 p.
 artikel
19 Editorial Butcher, John
 1984
 15 3 p. 3-
1 p.
 artikel
20 Effective logic analysis techniques for increased design productivity Blattner, J.D.
 1984
 15 3 p. 23-29
7 p.
 artikel
21 Electric measurement and modelling of the emitter base junction behaviour of VLSI silicon transistor 1984
 15 3 p. 43-
1 p.
 artikel
22 Electron microscopy and failure analysis 1984
 15 3 p. 40-
1 p.
 artikel
23 Electro-thermomigration in NMOS LSI devices 1984
 15 3 p. 45-
1 p.
 artikel
24 Evaluation of critical surface cleanliness by secondary ion mass spectroscopy 1984
 15 3 p. 40-
1 p.
 artikel
25 Failure modes in GaAs power FETs: Ohmic contact electromigration and formation of refractory oxides 1984
 15 3 p. 43-
1 p.
 artikel
26 Forthcoming events 1984
 15 3 p. 46-48
3 p.
 artikel
27 High density packaging technology 1984
 15 3 p. 38-
1 p.
 artikel
28 High speed SOS and GaAs IC testing in the 1980s 1984
 15 3 p. 43-
1 p.
 artikel
29 Infrared firing of thick film compositions 1984
 15 3 p. 39-
1 p.
 artikel
30 Ion-assisted plasma etching of silicon-oxides in a multifacet system 1984
 15 3 p. 40-
1 p.
 artikel
31 Ion implantation in wafer fabrication 1984
 15 3 p. 41-
1 p.
 artikel
32 Large scale integration and packaging technologies for telecommunication equipment 1984
 15 3 p. 40-
1 p.
 artikel
33 Laser annealing 1984
 15 3 p. 38-
1 p.
 artikel
34 Laser-patterned Ta2N resistors for thin film circuits 1984
 15 3 p. 41-
1 p.
 artikel
35 Low-value nickel resistors electroless-plated on ‘IMST’ substrate for power hybrid ICs 1984
 15 3 p. 39-
1 p.
 artikel
36 Manufacturing high-density memory chips 1984
 15 3 p. 41-
1 p.
 artikel
37 Memory retention life at various environmental and life tests 1984
 15 3 p. 42-
1 p.
 artikel
38 Microelectronic test chips in integrated circuit manufacturing 1984
 15 3 p. 39-
1 p.
 artikel
39 Multilayer resist systems for lithography 1984
 15 3 p. 40-
1 p.
 artikel
40 Nondestructive infrared inspection of hybrid microcircuit substrate-to-package thermal adhesive bonds 1984
 15 3 p. 44-
1 p.
 artikel
41 Novel design of the output stage for four-phase dynamic VLSI logic Patel, D.C.
 1984
 15 3 p. 12-17
6 p.
 artikel
42 On built-in test techniques in reliable computer systems 1984
 15 3 p. 44-
1 p.
 artikel
43 Optical requirements for projection lithography 1984
 15 3 p. 40-
1 p.
 artikel
44 Optimisation of access points for automatic test program generation and fault location in large analogue circuits and systems 1984
 15 3 p. 41-
1 p.
 artikel
45 Processing considerations of thick film devices with multi-layered resistors 1984
 15 3 p. 39-
1 p.
 artikel
46 Process modeling of integrated circuit device technology 1984
 15 3 p. 41-
1 p.
 artikel
47 Recent trends in ion implantation 1984
 15 3 p. 41-
1 p.
 artikel
48 Reliability problems in TTL-LS devices 1984
 15 3 p. 44-45
2 p.
 artikel
49 SEM/EDAX analysis of PIND test failures 1984
 15 3 p. 42-43
2 p.
 artikel
50 Software aids to microcomputer system reliability 1984
 15 3 p. 44-
1 p.
 artikel
51 Software maintainability — what it means and how to achieve it 1984
 15 3 p. 42-
1 p.
 artikel
52 Temperature accelerated estimation of MNOS memory reliability 1984
 15 3 p. 43-
1 p.
 artikel
53 Temperature dependent defect level for an ionic failure mechanism 1984
 15 3 p. 38-
1 p.
 artikel
54 Testing and reliability of throughplatings in thin film hybrid circuits 1984
 15 3 p. 42-
1 p.
 artikel
55 Testing of properties for soldered leadless chip carrier assemblies 1984
 15 3 p. 43-
1 p.
 artikel
56 The density of platinum and palladium powders for thick film pastes Anjard Sr, Roland P.
 1984
 15 3 p. 30-35
6 p.
 artikel
57 Thin film metallisation studies and device lifetime prediction using Al-Si and Al-Cu-Si conductor test bars 1984
 15 3 p. 41-
1 p.
 artikel
58 Thin film technology used in Bell System telecommunication circuits 1984
 15 3 p. 45-
1 p.
 artikel
59 Vacuum operated mercury probe for CV plotting and profiling 1984
 15 3 p. 42-
1 p.
 artikel
                             59 gevonden resultaten
 
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