nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A high speed and low power CMOS/SOS multiplier-accumulator
|
Iwamura, Jun |
|
1983 |
14 |
6 |
p. 49-57 9 p. |
artikel |
2 |
A low-leakage VLSI CMOS/SOS process with thin epi layers
|
Lee, J.Y. |
|
1983 |
14 |
6 |
p. 5-12 8 p. |
artikel |
3 |
Analysis of leakage currents in CMOS/SOS devices
|
Vasudev, K. |
|
1983 |
14 |
6 |
p. 45-48 4 p. |
artikel |
4 |
A new method of SOS epitaxial growth with amorphous Si buffer layer
|
Ishida, M. |
|
1983 |
14 |
6 |
p. 114-115 2 p. |
artikel |
5 |
An experimental and theoretical study of polycrystalline thin film transistor
|
|
|
1983 |
14 |
6 |
p. 123- 1 p. |
artikel |
6 |
An ion milled coplanar SOS technology
|
Sharp, Alan C. |
|
1983 |
14 |
6 |
p. 13-21 9 p. |
artikel |
7 |
Applications of infrared spectroscopy to the annealing of silicon
|
|
|
1983 |
14 |
6 |
p. 122- 1 p. |
artikel |
8 |
A thick film hybrid IC amplifier for industrial use
|
|
|
1983 |
14 |
6 |
p. 123- 1 p. |
artikel |
9 |
A two level metal, software compatible, CMOS/SOS gate array family
|
Friedman, Eby |
|
1983 |
14 |
6 |
p. 117-118 2 p. |
artikel |
10 |
Beam-recrystallised silicon-on-insulator films: can devices lives with grain boundaries?
|
Colinge, Jean-Pierre |
|
1983 |
14 |
6 |
p. 58-65 8 p. |
artikel |
11 |
Building quality analog circuits with C-MOS logic arrays
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
12 |
Can ATE be trusted by QC?
|
|
|
1983 |
14 |
6 |
p. 123- 1 p. |
artikel |
13 |
Characteristics of micro-groove zone-melting recrystallised Si islands
|
Kugimiya, K. |
|
1983 |
14 |
6 |
p. 111-114 4 p. |
artikel |
14 |
Characteristics of MOS FETs on double solid-phase epitaxial SOS
|
Yoshida, M. |
|
1983 |
14 |
6 |
p. 116-117 2 p. |
artikel |
15 |
Chip resistors gain support
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
16 |
Chip trio simplifies precise position control
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
17 |
Duplicateur de masques a rayons X pour lithographie submicronique
|
|
|
1983 |
14 |
6 |
p. 122- 1 p. |
artikel |
18 |
Dynamic measurement of the water vapour content of integrated circuit packages using derivative infrared diode laser spectroscopy
|
|
|
1983 |
14 |
6 |
p. 123- 1 p. |
artikel |
19 |
Editorial
|
Butcher, John |
|
1983 |
14 |
6 |
p. 3- 1 p. |
artikel |
20 |
Electrical characterisation of ion-implanted silicon-on-sapphire
|
Lin, Alice L. |
|
1983 |
14 |
6 |
p. 22-32 11 p. |
artikel |
21 |
Electron-beam recrystallised polysilicon on silicon dioxide
|
Inoue, Tomoyasu |
|
1983 |
14 |
6 |
p. 74-81 8 p. |
artikel |
22 |
Fabrication of large-area thick film hybrid circuits on RCA porcelain-coated steel substrates
|
|
|
1983 |
14 |
6 |
p. 121- 1 p. |
artikel |
23 |
Functional laser trimming of automotive electronics
|
|
|
1983 |
14 |
6 |
p. 121- 1 p. |
artikel |
24 |
Gallium arsenide digital integrated circuits for applications above one gigahertz
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
25 |
Gettering processes for defect control
|
|
|
1983 |
14 |
6 |
p. 122- 1 p. |
artikel |
26 |
Hybrid lithography
|
|
|
1983 |
14 |
6 |
p. 121- 1 p. |
artikel |
27 |
IEEE SOS/SOI Technology Workshop
|
|
|
1983 |
14 |
6 |
p. 108-110 3 p. |
artikel |
28 |
Influence of light on NMOS transistors in laser μ-zone crystallised silicon layers
|
Bösch, M.A. |
|
1983 |
14 |
6 |
p. 82-87 6 p. |
artikel |
29 |
Large scale integration techniques for telecommunication
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
30 |
Lift-off techniques for fine line metal patterning
|
|
|
1983 |
14 |
6 |
p. 122- 1 p. |
artikel |
31 |
Measurement procedure for evaluating the equivalent circuit elements of bond wires in microwave integrated circuits
|
|
|
1983 |
14 |
6 |
p. 122- 1 p. |
artikel |
32 |
Methods of synthesising active filters with hybrid integrated circuits of the TESLA WQU011 type
|
|
|
1983 |
14 |
6 |
p. 121- 1 p. |
artikel |
33 |
New mounting technologies in the manufacture of hybrid circuits
|
|
|
1983 |
14 |
6 |
p. 122- 1 p. |
artikel |
34 |
Optimisation of RCA porcelain for compatibility with thick films
|
|
|
1983 |
14 |
6 |
p. 122- 1 p. |
artikel |
35 |
Polymer materials for electronic applications
|
Pitt, Keith |
|
1983 |
14 |
6 |
p. 119-120 2 p. |
artikel |
36 |
Process conditions affecting hot electron trapping in DC magnetron sputtered MOS devices
|
|
|
1983 |
14 |
6 |
p. 123- 1 p. |
artikel |
37 |
Radiation-hard CMOS/SOS: An ideal technology for the space environment
|
Veloric, H. |
|
1983 |
14 |
6 |
p. 117- 1 p. |
artikel |
38 |
Reliability considerations of flip chip components for automotive electronic applications
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
39 |
Silicon film recrystallisation using e-beam line source
|
Rensch, D.B. |
|
1983 |
14 |
6 |
p. 66-73 8 p. |
artikel |
40 |
Silicon-on-insulator structures using high dose oxygen implantation to form buried oxide films
|
Das, K. |
|
1983 |
14 |
6 |
p. 88-107 20 p. |
artikel |
41 |
Tester takes on VLSI with 264-K vectors behind its pins
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
42 |
The design and performance of near micron SOS MOSFETs
|
Maddox III, R.L. |
|
1983 |
14 |
6 |
p. 33-44 12 p. |
artikel |
43 |
The physics and chemistry of liquid crystal devices
|
Pitt, Keith |
|
1983 |
14 |
6 |
p. 119- 1 p. |
artikel |
44 |
The use of 16-bit high level languages and microcomputer products to solve industrial control products
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
45 |
Thick film circuits for telecommunications equipment
|
|
|
1983 |
14 |
6 |
p. 121- 1 p. |
artikel |
46 |
Thick film temperature compensating circuit for semiconductor strain gauges
|
|
|
1983 |
14 |
6 |
p. 124- 1 p. |
artikel |
47 |
Thin film technology used in bell system telecommunication circuits
|
|
|
1983 |
14 |
6 |
p. 122- 1 p. |
artikel |