| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A data-base for IC mask making
|
Kundu, N.N.
|
|
1983
|
14 |
5 |
p. 43-52
10 p.
|
artikel
|
| 2 |
Advances in low cost silver-containing thick film conductors
|
|
|
1983
|
14 |
5 |
p. 81-82
2 p.
|
artikel
|
| 3 |
Arsenic spin-on source for deep junction formation
|
|
|
1983
|
14 |
5 |
p. 84-
1 p.
|
artikel
|
| 4 |
A study of masking properties of SiO2 and photoresists with boron ion implantation
|
|
|
1983
|
14 |
5 |
p. 84-
1 p.
|
artikel
|
| 5 |
Automatic production system for circuit boards with universal hybrid integrated circuits
|
|
|
1983
|
14 |
5 |
p. 82-
1 p.
|
artikel
|
| 6 |
CMOS regenerative logic circuits
|
Dokić, Branko L.
|
|
1983
|
14 |
5 |
p. 21-30
10 p.
|
artikel
|
| 7 |
Consequences of contact resistance in very-small-geometry CML gates
|
Stevens, E.H.
|
|
1983
|
14 |
5 |
p. 15-20
6 p.
|
artikel
|
| 8 |
Design and evaluation of RC active filters for hybrid thick film implementation
|
|
|
1983
|
14 |
5 |
p. 80-
1 p.
|
artikel
|
| 9 |
Development and evaluation of a pre-encapsulating cleaning process to improve realiability of HICs with aluminium metallised chips
|
|
|
1983
|
14 |
5 |
p. 83-
1 p.
|
artikel
|
| 10 |
Editorial
|
Butcher, John
|
|
1983
|
14 |
5 |
p. 3-
1 p.
|
artikel
|
| 11 |
Electrical characteristics of polymer thick film resistors, Part I: experimental results
|
|
|
1983
|
14 |
5 |
p. 83-
1 p.
|
artikel
|
| 12 |
Electronic structure of SiO2 (111) thin film
|
|
|
1983
|
14 |
5 |
p. 84-
1 p.
|
artikel
|
| 13 |
Erlevel insulation reliability evaluation
|
|
|
1983
|
14 |
5 |
p. 81-
1 p.
|
artikel
|
| 14 |
Gallium: Arsenide and related compounds 1982
|
|
|
1983
|
14 |
5 |
p. 77-78
2 p.
|
artikel
|
| 15 |
High slew rate CMOS operational amplifier employing internal transistor compensation
|
Wu, Bingxin
|
|
1983
|
14 |
5 |
p. 5-13
9 p.
|
artikel
|
| 16 |
How a computer is developed and produced
|
Heusler, Joachim
|
|
1983
|
14 |
5 |
p. 53-75
23 p.
|
artikel
|
| 17 |
Ider attachment of leaded components to ck film hybrids
|
|
|
1983
|
14 |
5 |
p. 81-
1 p.
|
artikel
|
| 18 |
Improved cost effectiveness and product reliability through solder alloy development
|
|
|
1983
|
14 |
5 |
p. 83-
1 p.
|
artikel
|
| 19 |
Integrated optics: a tutorial review
|
|
|
1983
|
14 |
5 |
p. 84-
1 p.
|
artikel
|
| 20 |
interactive design system for hybrid ICs
|
|
|
1983
|
14 |
5 |
p. 81-
1 p.
|
artikel
|
| 21 |
Internal gettering in silicon
|
|
|
1983
|
14 |
5 |
p. 84-
1 p.
|
artikel
|
| 22 |
Model of impurity diffusion from an oxide source into silicon
|
|
|
1983
|
14 |
5 |
p. 84-
1 p.
|
artikel
|
| 23 |
Nichrome thin film technology and its application
|
|
|
1983
|
14 |
5 |
p. 83-
1 p.
|
artikel
|
| 24 |
Novel switched capacitor realisations of floating FDNC
|
Kumar, Umesh
|
|
1983
|
14 |
5 |
p. 31-34
4 p.
|
artikel
|
| 25 |
Optoelectronics: An introduction
|
|
|
1983
|
14 |
5 |
p. 77-
1 p.
|
artikel
|
| 26 |
Packaging trade-offs for an LSI-oriented very high-speed computer, the HITAC M-200H
|
|
|
1983
|
14 |
5 |
p. 80-
1 p.
|
artikel
|
| 27 |
Reference materials and the semiconductor industry
|
|
|
1983
|
14 |
5 |
p. 84-
1 p.
|
artikel
|
| 28 |
Reliability evaluation of aluminium-metallised MOS dynamic RAM's in plastic packages in high humidity and temperature environments
|
|
|
1983
|
14 |
5 |
p. 82-
1 p.
|
artikel
|
| 29 |
Residual stress in thick films
|
Kirby, P.L.
|
|
1983
|
14 |
5 |
p. 35-41
7 p.
|
artikel
|
| 30 |
Resistors screen printed on ceramic-coated steel substrates
|
|
|
1983
|
14 |
5 |
p. 82-
1 p.
|
artikel
|
| 31 |
Solder post attachment of ceramic chip carriers to ceramic film integrated circuits
|
|
|
1983
|
14 |
5 |
p. 81-
1 p.
|
artikel
|
| 32 |
Speech enhancement
|
|
|
1983
|
14 |
5 |
p. 78-79
2 p.
|
artikel
|
| 33 |
The effect of high speed laser trimming on accuracy and stability of thick film resistors
|
|
|
1983
|
14 |
5 |
p. 80-
1 p.
|
artikel
|
| 34 |
The influence of boron induced and oxidation induced defects on bipolar transistor slice yield
|
|
|
1983
|
14 |
5 |
p. 83-
1 p.
|
artikel
|
| 35 |
The influence of the area of a thin film capacitor on the breakdown voltage
|
|
|
1983
|
14 |
5 |
p. 80-
1 p.
|
artikel
|
| 36 |
VLSI circuit development for future applications
|
|
|
1983
|
14 |
5 |
p. 84-
1 p.
|
artikel
|
| 37 |
X-ray and microscopic investigations of resistors containing CdO and RuO2
|
|
|
1983
|
14 |
5 |
p. 83-
1 p.
|
artikel
|
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