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                             35 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Advancing the thermal stability of 3D ICs using logi-thermal simulation Nagy, Gergely
2015
12PA p. 1114-1120
7 p.
artikel
2 A multilevel memristor–CMOS memory cell as a ReRAM Rabbani, Payam
2015
12PA p. 1283-1290
8 p.
artikel
3 Analysis and design of a two-stage amplifier with enhanced performance Mesri, Alireza
2015
12PA p. 1304-1312
9 p.
artikel
4 Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations Elger, Gordon
2015
12PA p. 1230-1238
9 p.
artikel
5 A role-changeable fault-tolerant management strategy towards resilient NoC-based manycore systems Wu, Zixu
2015
12PA p. 1371-1379
9 p.
artikel
6 A self-control technique for high efficiency class-E CMOS power amplifier Dehqan, A.R.
2015
12PA p. 1258-1262
5 p.
artikel
7 A sub-mW pulse-based 5-bit flash ADC with a time-domain fully-digital reference ladder Katic, Nikola
2015
12PA p. 1343-1350
8 p.
artikel
8 A 1-V feed-forward incremental modulator simulation based on gain-boost inverter for image sensors in 65-nm CMOS Xu, Jiangtao
2015
12PA p. 1325-1332
8 p.
artikel
9 Characterization of phase change material systems using a thermal test device Jordà, Xavier
2015
12PA p. 1195-1201
7 p.
artikel
10 Comparison of Green׳s function solutions for different heat conduction models in electronic nanostructures Janicki, Marcin
2015
12PA p. 1162-1166
5 p.
artikel
11 Design of low power and high read stability 8T-SRAM memory based on the modified Gate Diffusion Input (m-GDI) in 32nm CNTFET technology Abiri, Ebrahim
2015
12PA p. 1351-1363
13 p.
artikel
12 Dual-stage, Time-over-Threshold based prototype readout ASIC for silicon microstrip sensors Kasinski, Krzysztof
2015
12PA p. 1248-1257
10 p.
artikel
13 Editorial board 2015
12PA p. IFC-
1 p.
artikel
14 Elimination of the effect of bottom-plate capacitors in C-2C DAC using a layout technique Khorami, Ata
2015
12PA p. 1275-1282
8 p.
artikel
15 Experimental investigations on the offset correction of transient cooling curves of light emitting diodes based on JESD51-14 and simple semi-empirical approximations Daiminger, Franz
2015
12PA p. 1208-1215
8 p.
artikel
16 Heat and mass transfer reduced order modeling approach of droplet microreactor based Lab-on-a-Chip devices Németh, Márton
2015
12PA p. 1152-1161
10 p.
artikel
17 Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit Melamed, Samson
2015
12PA p. 1106-1113
8 p.
artikel
18 Improved crosstalk noise modeling of MWCNT interconnects using FDTD technique Kumar, Vobulapuram Ramesh
2015
12PA p. 1263-1268
6 p.
artikel
19 Joule heated metallic microwire devices for sub-microsecond T-jump experiments Quintero, Carlos M.
2015
12PA p. 1167-1174
8 p.
artikel
20 Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays Ali, Karim
2015
12PA p. 1291-1303
13 p.
artikel
21 Low power, high speed carbon nanotube FET based level shifters for multi-V DD Systems-On-Chips Pasupathy, K.R.
2015
12PA p. 1269-1274
6 p.
artikel
22 Low power SRAM design for 14nm GAA Si-nanowire technology Kaushal, Gaurav
2015
12PA p. 1239-1247
9 p.
artikel
23 Multi-domain compact modeling of LEDs: An overview of models and experimental data Poppe, András
2015
12PA p. 1138-1151
14 p.
artikel
24 Performance investigation of thermally enhanced polymer composite materials for microelectronics cooling Eveloy, Valérie
2015
12PA p. 1216-1224
9 p.
artikel
25 Power and thermal constraints of modern system-on-a-chip computer Rotem, Efraim
2015
12PA p. 1225-1229
5 p.
artikel
26 Robust and energy-efficient carbon nanotube FET-based MVL gates: A novel design approach Sharifi, Fazel
2015
12PA p. 1333-1342
10 p.
artikel
27 Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction Codecasa, Lorenzo
2015
12PA p. 1129-1137
9 p.
artikel
28 Thermal-electronic logic circuits: Scaling down Mizsei, János
2015
12PA p. 1175-1178
4 p.
artikel
29 Thermal investigations of integrated circuits and systems, THERMINIC’14 Rencz, Marta
2015
12PA p. 1105-
1 p.
artikel
30 Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s) Takács, G.
2015
12PA p. 1202-1207
6 p.
artikel
31 Thermal transient measurement of insulated gate devices using the thermal properties of the channel resistance and parasitic elements Farkas, Gabor
2015
12PA p. 1185-1194
10 p.
artikel
32 Towards electro-thermo-mechanical simulation of integrated circuits in standard CAD environment Garci, Maroua
2015
12PA p. 1121-1128
8 p.
artikel
33 True random number generation using CMOS Boolean chaotic oscillator Park, Myunghwan
2015
12PA p. 1364-1370
7 p.
artikel
34 Using a Monte-Carlo model to identify best filler arrangement in thermally conductive materials Descamps, P.
2015
12PA p. 1179-1184
6 p.
artikel
35 Variability modeling in near-threshold CMOS digital circuits Slimani, M.
2015
12PA p. 1313-1324
12 p.
artikel
                             35 gevonden resultaten
 
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