| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices
|
Schriefer, Thomas
|
|
2019
|
98 |
C |
p. 86-94
|
artikel
|
| 2 |
Analysis of bipolar amplification due to heavy-ion irradiation in 45 nm FDSOI MOSFET with thin BOX and ground plane
|
K.R., Pasupathy
|
|
2019
|
98 |
C |
p. 56-62
|
artikel
|
| 3 |
A new creep fatigue model for solder joints
|
Wong, E.H.
|
|
2019
|
98 |
C |
p. 153-160
|
artikel
|
| 4 |
An oxygen vacancy mediated Ag reduction and nucleation mechanism in SiO2 RRAM devices
|
Patel, K.
|
|
2019
|
98 |
C |
p. 144-152
|
artikel
|
| 5 |
A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions
|
Mokhtari, Omid
|
|
2019
|
98 |
C |
p. 95-105
|
artikel
|
| 6 |
Bending reliability of flexible transparent electrode of gravure offset printed invisible silver-grid laminated with conductive polymer
|
Ohsawa, Masato
|
|
2019
|
98 |
C |
p. 124-130
|
artikel
|
| 7 |
Contrast of latch-up induced by pulsed gamma rays in CMOS circuits after neutron irradiation and TID accumulation
|
Li, Ruibin
|
|
2019
|
98 |
C |
p. 42-48
|
artikel
|
| 8 |
Corrosion on automobile printed circuit broad
|
Tseng, Tsan-Hsien
|
|
2019
|
98 |
C |
p. 19-23
|
artikel
|
| 9 |
Double tricrystal nucleation behavior in Pb-free BGA solder joints
|
Han, Jing
|
|
2019
|
98 |
C |
p. 1-9
|
artikel
|
| 10 |
Editorial Board
|
|
|
2019
|
98 |
C |
p. ii
|
artikel
|
| 11 |
E-field induced keep-out zone determination method of through-silicon vias for 3-D ICs
|
Kim, Kibeom
|
|
2019
|
98 |
C |
p. 161-164
|
artikel
|
| 12 |
Instantaneous Mean-Time-To-Failure (MTTF) estimation for checkpoint interval computation at run time
|
Bandan, Mohamad Imran bin
|
|
2019
|
98 |
C |
p. 69-77
|
artikel
|
| 13 |
Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field
|
Ibrahiem, A.A.
|
|
2019
|
98 |
C |
p. 10-18
|
artikel
|
| 14 |
Junction temperature control of UV-C LEDs based on a thermoelectric cooler device
|
Fredes, P.
|
|
2019
|
98 |
C |
p. 24-30
|
artikel
|
| 15 |
New perspectives in defect centric model for NBTI reliability
|
Nouguier, D.
|
|
2019
|
98 |
C |
p. 119-123
|
artikel
|
| 16 |
Residual stress and warpage of AMB ceramic substrate studied by finite element simulations
|
Zhang, Shanshan
|
|
2019
|
98 |
C |
p. 49-55
|
artikel
|
| 17 |
Statistical simulation of self-heating induced variability and reliability with application to Nanosheet-FETs based SRAM
|
Chen, Wangyong
|
|
2019
|
98 |
C |
p. 63-68
|
artikel
|
| 18 |
Thermal fracture parameter analysis of MEMS multilayer structures based on the generalized thermoelastic theory
|
Long, Zhang
|
|
2019
|
98 |
C |
p. 106-111
|
artikel
|
| 19 |
The strong effect on MEMS switch reliability of film deposition conditions and electrode geometry
|
Oh, Changho
|
|
2019
|
98 |
C |
p. 131-143
|
artikel
|
| 20 |
Two dimensional Green's function solution of threshold for junction less field effect transistors at low drain voltage
|
Hosseini, Seyed Akram
|
|
2019
|
98 |
C |
p. 31-41
|
artikel
|
| 21 |
Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders
|
Lin, Qiaoli
|
|
2019
|
98 |
C |
p. 112-118
|
artikel
|
| 22 |
Wireless sEMG-based identification in a virtual reality environment
|
Li, Xiaoou
|
|
2019
|
98 |
C |
p. 78-85
|
artikel
|
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