| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission
|
Beyreuther, A.
|
|
2019
|
92 |
C |
p. 143-148
|
artikel
|
| 2 |
Editorial Board
|
|
|
2019
|
92 |
C |
p. ii
|
artikel
|
| 3 |
Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect
|
Zhu, Ze
|
|
2019
|
92 |
C |
p. 12-19
|
artikel
|
| 4 |
Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
|
Oh, Gyung-Hwan
|
|
2019
|
92 |
C |
p. 63-72
|
artikel
|
| 5 |
Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling
|
Bettahi, Yousra
|
|
2019
|
92 |
C |
p. 20-26
|
artikel
|
| 6 |
Galvanic corrosion behavior at the Cu-Al ball bond interface: Influence of Pd addition and chloride concentration
|
Wu, Yuelin
|
|
2019
|
92 |
C |
p. 79-86
|
artikel
|
| 7 |
High sensitivity detection of ultrasonic signal for nondestructive inspection using pulse compression method
|
Mitsuta, Hiroki
|
|
2019
|
92 |
C |
p. 172-178
|
artikel
|
| 8 |
Metallized film capacitors used for EMI filtering: A reliability review
|
Valentine, Nathan
|
|
2019
|
92 |
C |
p. 123-135
|
artikel
|
| 9 |
Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
|
Herfurth, N.
|
|
2019
|
92 |
C |
p. 73-78
|
artikel
|
| 10 |
Online condition monitoring of IGBT modules using current-change rate identification
|
Mohamed Sathik, M.H.
|
|
2019
|
92 |
C |
p. 55-62
|
artikel
|
| 11 |
On the cumulative distribution function of the defect centric model for BTI reliability
|
Nouguier, D.
|
|
2019
|
92 |
C |
p. 168-171
|
artikel
|
| 12 |
Optimization of an Artificial Neural Network System for the Prediction of Failure Analysis Success
|
Zhao, Lin
|
|
2019
|
92 |
C |
p. 136-142
|
artikel
|
| 13 |
Over frequency control of photovoltaic inverters in an island microgrid
|
Hsu, Cheng-Ting
|
|
2019
|
92 |
C |
p. 42-54
|
artikel
|
| 14 |
Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient
|
Liang, S.B.
|
|
2019
|
92 |
C |
p. 1-11
|
artikel
|
| 15 |
Power switch failures tolerance of a photovoltaic fed three-level boost DC-DC converter
|
Oulad-Abbou, Driss
|
|
2019
|
92 |
C |
p. 87-95
|
artikel
|
| 16 |
Prognostics of IGBT modules based on the approach of particle filtering
|
Lu, Yizhou
|
|
2019
|
92 |
C |
p. 96-105
|
artikel
|
| 17 |
Reliability analysis through linearity and harmonic distortion of a dual-material-gate asymmetric underlapped DGMOSFET
|
Das, Rahul
|
|
2019
|
92 |
C |
p. 106-113
|
artikel
|
| 18 |
Reliability issue related to dielectric charging in capacitive micromachined ultrasonic transducers: A review
|
Munir, Junaid
|
|
2019
|
92 |
C |
p. 155-167
|
artikel
|
| 19 |
Remaining useful life prediction of aviation circular electrical connectors using vibration-induced physical model and particle filtering method
|
Sun, Bo
|
|
2019
|
92 |
C |
p. 114-122
|
artikel
|
| 20 |
Research on performance of an integrated component with the three-electrode planar switch and the exploding foil bridge
|
Li, Jiao
|
|
2019
|
92 |
C |
p. 27-33
|
artikel
|
| 21 |
Resolving trapping effects by scanning microwave microscopy
|
Hommel, S.
|
|
2019
|
92 |
C |
p. 179-181
|
artikel
|
| 22 |
Single event effects in commercial FRAM and mitigation technique using neutron-induced displacement damage
|
Wei, Jia-nan
|
|
2019
|
92 |
C |
p. 149-154
|
artikel
|
| 23 |
Study on the destruction mechanism caused by dynamic avalanche in GCTs
|
Yang, Wuhua
|
|
2019
|
92 |
C |
p. 34-41
|
artikel
|
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