| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Active filters: part 8. Positive results from negative feedback
|
|
|
1970
|
9 |
2 |
p. 120-
1 p.
|
artikel
|
| 2 |
Air-gap isolated microcircuits-beam-lead devices
|
|
|
1970
|
9 |
2 |
p. 117-
1 p.
|
artikel
|
| 3 |
An Electronic Design Special Report. MOS on the upswing
|
|
|
1970
|
9 |
2 |
p. 116-
1 p.
|
artikel
|
| 4 |
A new look at microwave silicon technology
|
|
|
1970
|
9 |
2 |
p. 122-123
2 p.
|
artikel
|
| 5 |
An interpretation of certain A.G.R.E.E. principles
|
Siemaszko, Z.S.
|
|
1970
|
9 |
2 |
p. 167-176
10 p.
|
artikel
|
| 6 |
Applications of microelectronics to aerospace equipment
|
|
|
1970
|
9 |
2 |
p. 119-
1 p.
|
artikel
|
| 7 |
Approximations to system reliability using a modular decomposition
|
|
|
1970
|
9 |
2 |
p. 113-
1 p.
|
artikel
|
| 8 |
A semi-automatic test set for in-circuit testing of diodes
|
|
|
1970
|
9 |
2 |
p. 113-
1 p.
|
artikel
|
| 9 |
Automatic formation of trial layouts of thin-film microcircuits
|
|
|
1970
|
9 |
2 |
p. 125-
1 p.
|
artikel
|
| 10 |
Basic principles, methods and objectives of reliability operations
|
|
|
1970
|
9 |
2 |
p. 109-
1 p.
|
artikel
|
| 11 |
Beam-leaded tantalum thin-film capacitors
|
|
|
1970
|
9 |
2 |
p. 126-
1 p.
|
artikel
|
| 12 |
Cables and accessories: some trends in standardization, rationalization and ratings
|
|
|
1970
|
9 |
2 |
p. 112-113
2 p.
|
artikel
|
| 13 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1970
|
9 |
2 |
p. 89-92
4 p.
|
artikel
|
| 14 |
Clean rooms: designed to kill
|
|
|
1970
|
9 |
2 |
p. 119-
1 p.
|
artikel
|
| 15 |
Commercial application of thick-film hybrid microelectronic packaging
|
|
|
1970
|
9 |
2 |
p. 126-
1 p.
|
artikel
|
| 16 |
Computer simulation methods applied to hybrid integrated circuits
|
|
|
1970
|
9 |
2 |
p. 117-
1 p.
|
artikel
|
| 17 |
Conference report
|
|
|
1970
|
9 |
2 |
p. 93-
1 p.
|
artikel
|
| 18 |
Controlled collapse reflow chip joining
|
|
|
1970
|
9 |
2 |
p. 117-118
2 p.
|
artikel
|
| 19 |
Courses in microelectronics and reliability
|
|
|
1970
|
9 |
2 |
p. 85-86
2 p.
|
artikel
|
| 20 |
Cutting of thin carbon films with a CO2-gas laser—I. Theoretical considerations and experiments on flat plates
|
|
|
1970
|
9 |
2 |
p. 126-
1 p.
|
artikel
|
| 21 |
Depletion layer calculations for error function diffused junctions
|
|
|
1970
|
9 |
2 |
p. 123-124
2 p.
|
artikel
|
| 22 |
Designing considerations for building high-frequency hybrid ICs
|
|
|
1970
|
9 |
2 |
p. 118-
1 p.
|
artikel
|
| 23 |
Designing MOS systems for radiation environments
|
|
|
1970
|
9 |
2 |
p. 118-
1 p.
|
artikel
|
| 24 |
Designing with diff-amp and op-amp ICs
|
|
|
1970
|
9 |
2 |
p. 117-
1 p.
|
artikel
|
| 25 |
Development of integrated microwave components for ground-based phased arrays (Electronic steering module)
|
|
|
1970
|
9 |
2 |
p. 119-
1 p.
|
artikel
|
| 26 |
Electrical properties of evaporated cerium oxide films
|
|
|
1970
|
9 |
2 |
p. 125-126
2 p.
|
artikel
|
| 27 |
Electrical properties of n-type epitaxial films of silicon on sapphire formed by vacuum evaporation
|
|
|
1970
|
9 |
2 |
p. 125-
1 p.
|
artikel
|
| 28 |
Equipment reliability and the environment
|
Harris, J.
|
|
1970
|
9 |
2 |
p. 145-152
8 p.
|
artikel
|
| 29 |
Estimating the optimum position for restoring organs in non-cascaded redundant networks
|
|
|
1970
|
9 |
2 |
p. 113-
1 p.
|
artikel
|
| 30 |
Evaluation of materials and processes for integrated microwave circuits
|
|
|
1970
|
9 |
2 |
p. 115-
1 p.
|
artikel
|
| 31 |
Failure of aluminium contacts to silicon in shallow diffused transistors
|
McCarthy, J.
|
|
1970
|
9 |
2 |
p. 187-188
2 p.
|
artikel
|
| 32 |
Fluidic handling of integrated circuits, reject classifying and packaging unit
|
|
|
1970
|
9 |
2 |
p. 116-
1 p.
|
artikel
|
| 33 |
Fundamental practical hints for development, construction and production using ICs for reliable numerical control
|
|
|
1970
|
9 |
2 |
p. 120-
1 p.
|
artikel
|
| 34 |
GaAs integrated microwave circuits
|
|
|
1970
|
9 |
2 |
p. 121-
1 p.
|
artikel
|
| 35 |
Geometric optimization of controlled collapse interconnections
|
|
|
1970
|
9 |
2 |
p. 118-
1 p.
|
artikel
|
| 36 |
Getting more speed from MOS
|
|
|
1970
|
9 |
2 |
p. 116-
1 p.
|
artikel
|
| 37 |
High performance thin films for microcircuits
|
|
|
1970
|
9 |
2 |
p. 124-
1 p.
|
artikel
|
| 38 |
High reliability aluminum wire bonding
|
|
|
1970
|
9 |
2 |
p. 110-111
2 p.
|
artikel
|
| 39 |
High reliability magnetic components for space applications
|
|
|
1970
|
9 |
2 |
p. 111-
1 p.
|
artikel
|
| 40 |
High-yield processing for fixed-interconnect large-scale integrated arrays
|
|
|
1970
|
9 |
2 |
p. 122-
1 p.
|
artikel
|
| 41 |
I am an integrated-circuit design engineer
|
|
|
1970
|
9 |
2 |
p. 118-
1 p.
|
artikel
|
| 42 |
ICs break through the voltage barrier
|
|
|
1970
|
9 |
2 |
p. 123-
1 p.
|
artikel
|
| 43 |
Improving reliability of amplifiers by redundancy
|
|
|
1970
|
9 |
2 |
p. 114-115
2 p.
|
artikel
|
| 44 |
Information on microelectronics for Navy equipments
|
|
|
1970
|
9 |
2 |
p. 119-
1 p.
|
artikel
|
| 45 |
Integrated circuits in electronics of the future
|
|
|
1970
|
9 |
2 |
p. 115-116
2 p.
|
artikel
|
| 46 |
Integrated circuit testing at Texas Instruments Limited. Automatic testing cuts cost of quality control
|
|
|
1970
|
9 |
2 |
p. 116-
1 p.
|
artikel
|
| 47 |
Integrated logical circuits tested thoroughly
|
|
|
1970
|
9 |
2 |
p. 110-
1 p.
|
artikel
|
| 48 |
Integrated microwave modules—a prospectus
|
|
|
1970
|
9 |
2 |
p. 115-
1 p.
|
artikel
|
| 49 |
Integrated microwave power distribution network
|
|
|
1970
|
9 |
2 |
p. 119-
1 p.
|
artikel
|
| 50 |
Investigation of microcircuit surface metallurgy
|
|
|
1970
|
9 |
2 |
p. 111-
1 p.
|
artikel
|
| 51 |
La technologie des circuits hybrides: Technique des couches minces au nickel-chrome
|
|
|
1970
|
9 |
2 |
p. 125-
1 p.
|
artikel
|
| 52 |
Letter to the editor-in-chief
|
van der Touw, W.G.
|
|
1970
|
9 |
2 |
p. 83-
1 p.
|
artikel
|
| 53 |
Life testing of semiconductor rectifiers with energy sparing synthetic circuits
|
|
|
1970
|
9 |
2 |
p. 112-
1 p.
|
artikel
|
| 54 |
Low energy sputtering of tantalum thin-film microcircuits
|
|
|
1970
|
9 |
2 |
p. 124-125
2 p.
|
artikel
|
| 55 |
LSI and systems. The changing interface
|
|
|
1970
|
9 |
2 |
p. 120-
1 p.
|
artikel
|
| 56 |
Maintenance and reliability problems in GPO network
|
|
|
1970
|
9 |
2 |
p. 115-
1 p.
|
artikel
|
| 57 |
Maintenance—keeping the system in trim
|
|
|
1970
|
9 |
2 |
p. 114-
1 p.
|
artikel
|
| 58 |
Micro-image photoresist evaluation
|
|
|
1970
|
9 |
2 |
p. 118-119
2 p.
|
artikel
|
| 59 |
Millimeter-wave integrated circuits
|
|
|
1970
|
9 |
2 |
p. 115-
1 p.
|
artikel
|
| 60 |
Naval research logistics quarterly 15
|
|
|
1970
|
9 |
2 |
p. 109-
1 p.
|
artikel
|
| 61 |
Non-equilibrium C-V and I-V characteristics of metal-insulator-semiconductor capacitors
|
|
|
1970
|
9 |
2 |
p. 124-
1 p.
|
artikel
|
| 62 |
Notice of Meeting
|
|
|
1970
|
9 |
2 |
p. 128-
1 p.
|
artikel
|
| 63 |
On the precision of diffusion operations
|
|
|
1970
|
9 |
2 |
p. 122-
1 p.
|
artikel
|
| 64 |
On the rate of failure and other quantitative characteristics of reliability
|
|
|
1970
|
9 |
2 |
p. 109-
1 p.
|
artikel
|
| 65 |
Papers to be published in future issues
|
|
|
1970
|
9 |
2 |
p. 127-
1 p.
|
artikel
|
| 66 |
Paste transfer in the screening process
|
|
|
1970
|
9 |
2 |
p. 118-
1 p.
|
artikel
|
| 67 |
Phase locking: integrated tuned circuits made easy
|
|
|
1970
|
9 |
2 |
p. 120-
1 p.
|
artikel
|
| 68 |
Phase locking: integrated tuned circuits made easy
|
|
|
1970
|
9 |
2 |
p. 121-
1 p.
|
artikel
|
| 69 |
P-I-N isolation for monolithic integrated circuits
|
|
|
1970
|
9 |
2 |
p. 121-122
2 p.
|
artikel
|
| 70 |
Practical considerations of system design with bipolar digital integrated circuits
|
|
|
1970
|
9 |
2 |
p. 120-
1 p.
|
artikel
|
| 71 |
Problems of design and fabrication of a C.W. silicon IMPATT diode
|
Brayne, T.
|
|
1970
|
9 |
2 |
p. 157-162
6 p.
|
artikel
|
| 72 |
Processing ceramics to give suitable substrate characteristics
|
|
|
1970
|
9 |
2 |
p. 125-
1 p.
|
artikel
|
| 73 |
Quality and reliability of electronic components
|
|
|
1970
|
9 |
2 |
p. 111-
1 p.
|
artikel
|
| 74 |
Recent advances in gallium arsenide materials technology
|
|
|
1970
|
9 |
2 |
p. 123-
1 p.
|
artikel
|
| 75 |
Recent United Kingdom patents in microelectronics
|
|
|
1970
|
9 |
2 |
p. 105-107
3 p.
|
artikel
|
| 76 |
Relationship between hot-spot formation and second breakdown in transistors
|
|
|
1970
|
9 |
2 |
p. 110-
1 p.
|
artikel
|
| 77 |
Reliability definitions for electronic equipment
|
|
|
1970
|
9 |
2 |
p. 115-
1 p.
|
artikel
|
| 78 |
Reliability of controlled collapse interconnections
|
|
|
1970
|
9 |
2 |
p. 111-
1 p.
|
artikel
|
| 79 |
Reliability testing during development
|
|
|
1970
|
9 |
2 |
p. 114-
1 p.
|
artikel
|
| 80 |
Repairability of printed wiring boards containing microelectronic devices
|
|
|
1970
|
9 |
2 |
p. 110-
1 p.
|
artikel
|
| 81 |
R.F. power meter uses thin-film thermocouple
|
|
|
1970
|
9 |
2 |
p. 120-
1 p.
|
artikel
|
| 82 |
Semiconductor devices in the BS 9000 scheme for common standards in electronic component parts
|
Newman, D.J.
|
|
1970
|
9 |
2 |
p. 129-132
4 p.
|
artikel
|
| 83 |
Sense and nonsense in electronic reliability engineering
|
|
|
1970
|
9 |
2 |
p. 109-
1 p.
|
artikel
|
| 84 |
Silicon planar transistors and diodes for deep water submarine cable repeaters
|
|
|
1970
|
9 |
2 |
p. 111-112
2 p.
|
artikel
|
| 85 |
Single building block proves logical choice for custom ICs
|
|
|
1970
|
9 |
2 |
p. 120-
1 p.
|
artikel
|
| 86 |
Single building block proves logical choice for custom ICs
|
|
|
1970
|
9 |
2 |
p. 121-
1 p.
|
artikel
|
| 87 |
Small-signal characteristics of the diode-stabilized linear integrated devices
|
|
|
1970
|
9 |
2 |
p. 116-117
2 p.
|
artikel
|
| 88 |
Some international aspects of reliability and quality control
|
Hayes, E.H.
|
|
1970
|
9 |
2 |
p. 137-143
7 p.
|
artikel
|
| 89 |
Speed/power chart for digital ICs
|
|
|
1970
|
9 |
2 |
p. 118-
1 p.
|
artikel
|
| 90 |
State-variable and gyrator realizations for complete integration: A comparison
|
Waldron, M.B.
|
|
1970
|
9 |
2 |
p. 177-186
10 p.
|
artikel
|
| 91 |
Strategy and tactics for integrated circuits
|
|
|
1970
|
9 |
2 |
p. 116-
1 p.
|
artikel
|
| 92 |
Stress corrosion cracking of gold-plated kovar transistor leads
|
|
|
1970
|
9 |
2 |
p. 112-
1 p.
|
artikel
|
| 93 |
Stress failures and joining considerations in hybrid circuits
|
|
|
1970
|
9 |
2 |
p. 113-114
2 p.
|
artikel
|
| 94 |
System reliability prediction
|
Ryerson, C.M.
|
|
1970
|
9 |
2 |
p. 81-82
2 p.
|
artikel
|
| 95 |
Technologie integrierter halbleiterschaltungen aus silizium
|
|
|
1970
|
9 |
2 |
p. 116-
1 p.
|
artikel
|
| 96 |
Testing and reliability of semiconductor devices
|
|
|
1970
|
9 |
2 |
p. 113-
1 p.
|
artikel
|
| 97 |
The changing philosophy of reliability
|
Young, K.J.
|
|
1970
|
9 |
2 |
p. 133-135
3 p.
|
artikel
|
| 98 |
The computer as an aid to the system reliability engineer
|
|
|
1970
|
9 |
2 |
p. 114-
1 p.
|
artikel
|
| 99 |
The effect of exposure to air on silver and gold films deposited in ultrahigh vacuum
|
|
|
1970
|
9 |
2 |
p. 125-
1 p.
|
artikel
|
| 100 |
The effect of the distributed resistance of the electrodes of
|
Morley, A.R.
|
|
1970
|
9 |
2 |
p. 189-191
3 p.
|
artikel
|
| 101 |
The effect of the substrate upon the gate and drain noise parameters of MOSFETS
|
|
|
1970
|
9 |
2 |
p. 123-
1 p.
|
artikel
|
| 102 |
The electrical properties of dislocations in silicon—I. The effects on carrier lifetime
|
|
|
1970
|
9 |
2 |
p. 123-
1 p.
|
artikel
|
| 103 |
The possibilities of mass production of vacuum evaporated thin-film circuits
|
|
|
1970
|
9 |
2 |
p. 124-
1 p.
|
artikel
|
| 104 |
The qualifications of electronic components for use in space
|
|
|
1970
|
9 |
2 |
p. 110-
1 p.
|
artikel
|
| 105 |
Thermal instabilities limiting power dissipation in transistors
|
|
|
1970
|
9 |
2 |
p. 112-
1 p.
|
artikel
|
| 106 |
Thermocompression bonding of external package leads on integrated circuit substrates
|
|
|
1970
|
9 |
2 |
p. 117-
1 p.
|
artikel
|
| 107 |
Thermocompression bonding of gold wire for microelectronic circuits
|
|
|
1970
|
9 |
2 |
p. 116-
1 p.
|
artikel
|
| 108 |
Thick-film layout considerations
|
|
|
1970
|
9 |
2 |
p. 124-
1 p.
|
artikel
|
| 109 |
Thin-film shielding for microcircuit applications and a useful laboratory tool for plane-wave shielding evaluations
|
|
|
1970
|
9 |
2 |
p. 124-
1 p.
|
artikel
|
| 110 |
Torture tests improve equipment reliability
|
|
|
1970
|
9 |
2 |
p. 114-
1 p.
|
artikel
|
| 111 |
Triangular, rhomboid and V distributed-resistance networks and their applications
|
|
|
1970
|
9 |
2 |
p. 119-
1 p.
|
artikel
|
| 112 |
TV sound IF amplifier with integrated circuits
|
|
|
1970
|
9 |
2 |
p. 121-
1 p.
|
artikel
|
| 113 |
User's approach to the design of custom monolithic-integrated circuits
|
|
|
1970
|
9 |
2 |
p. 122-
1 p.
|
artikel
|
| 114 |
Vacuum deposition of epitaxial silicon layers
|
|
|
1970
|
9 |
2 |
p. 122-
1 p.
|
artikel
|
| 115 |
Versatile monolith for circuit experiments
|
|
|
1970
|
9 |
2 |
p. 122-
1 p.
|
artikel
|
| 116 |
Wafer-chip assembly for large-scale integration
|
|
|
1970
|
9 |
2 |
p. 121-
1 p.
|
artikel
|
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