| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies
|
Cacho, F.
|
|
2007
|
88-90 |
2-3 |
p. 161-167
7 p.
|
artikel
|
| 2 |
4947375 Addressing of redundant columns and rows of an integrated circuit memory
|
Gaultier, JeanMarie
|
|
1991
|
88-90 |
2-3 |
p. x-xi
nvt p.
|
artikel
|
| 3 |
Advanced numerical prototyping methods in modern engineering applications – Optimisation for micro-electronic package reliability
|
Wymysłowski, A.
|
|
2007
|
88-90 |
2-3 |
p. 280-289
10 p.
|
artikel
|
| 4 |
Advanced structural similarity rules for the BGA package family
|
van Driel, W.D.
|
|
2007
|
88-90 |
2-3 |
p. 205-214
10 p.
|
artikel
|
| 5 |
A method for evaluation of number class intervals of histogram
|
Brkić, D.M.
|
|
1991
|
88-90 |
2-3 |
p. 245-248
4 p.
|
artikel
|
| 6 |
An algorithm to solve integer programming problems: An efficient tool for reliability design
|
Misra, Krishna B.
|
|
1991
|
88-90 |
2-3 |
p. 285-294
10 p.
|
artikel
|
| 7 |
Analysis of a complex system composed of two sub-systems with their standbys
|
Gupta, Rakesh
|
|
1991
|
88-90 |
2-3 |
p. 453-463
11 p.
|
artikel
|
| 8 |
Analysis of Cu/low-k bond pad delamination by using a novel failure index
|
van Gils, M.A.J.
|
|
2007
|
88-90 |
2-3 |
p. 179-186
8 p.
|
artikel
|
| 9 |
Analysis of d.c. and a.c. anomalous latch-up effects in commercial CMOS integrated circuits
|
Zanoni, Enrico
|
|
1991
|
88-90 |
2-3 |
p. 249-254
6 p.
|
artikel
|
| 10 |
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
|
Van Steenberge, Nele
|
|
2007
|
88-90 |
2-3 |
p. 215-222
8 p.
|
artikel
|
| 11 |
An efficient approach for multiple criteria redundancy optimization problems
|
Misra, Krishna B.
|
|
1991
|
88-90 |
2-3 |
p. 303-321
19 p.
|
artikel
|
| 12 |
A new two-dimensional threshold voltage model for cylindrical, fully-depleted, surrounding-gate (SG) MOSFETs
|
Chiang, T.K.
|
|
2007
|
88-90 |
2-3 |
p. 379-383
5 p.
|
artikel
|
| 13 |
4907931 Apparatus for handling semiconductor wafers
|
Mallory, ChesterL
|
|
1991
|
88-90 |
2-3 |
p. i-
1 p.
|
artikel
|
| 14 |
4931726 Apparatus for testing semiconductor device
|
Kasukabe, Susumu
|
|
1991
|
88-90 |
2-3 |
p. vii-
1 p.
|
artikel
|
| 15 |
4900948 Apparatus providing signals for burn-in of integrated circuits
|
Hamilton, Harold
|
|
1991
|
88-90 |
2-3 |
p. i-
1 p.
|
artikel
|
| 16 |
Application of an efficient search technique for optimal design of a computer communication network
|
Sharma, Usha
|
|
1991
|
88-90 |
2-3 |
p. 337-341
5 p.
|
artikel
|
| 17 |
Application of simulation-based decision making in product development of an RF module
|
Lindgren, Mats
|
|
2007
|
88-90 |
2-3 |
p. 302-309
8 p.
|
artikel
|
| 18 |
Applications of a search algorithm to reliability design problems
|
Misra, Krishna B.
|
|
1991
|
88-90 |
2-3 |
p. 295-301
7 p.
|
artikel
|
| 19 |
A practical method of binomial reliability assessment
|
Wang, Hong-Zhou
|
|
1991
|
88-90 |
2-3 |
p. 255-256
2 p.
|
artikel
|
| 20 |
A stuck fault model for dynamic CMOS combinational circuits
|
Ismaeel, Asad A.
|
|
1991
|
88-90 |
2-3 |
p. 407-427
21 p.
|
artikel
|
| 21 |
A threshold-voltage model of SiGe-channel pMOSFET without Si cap layer
|
Zou, X.
|
|
2007
|
88-90 |
2-3 |
p. 391-394
4 p.
|
artikel
|
| 22 |
4947545 Automated burn-in system
|
Gussman, Robert
|
|
1991
|
88-90 |
2-3 |
p. xi-
1 p.
|
artikel
|
| 23 |
Availability and frequency of failures of a system in the presence of chance common-cause shock failures
|
Madhusudana Verma, S.
|
|
1991
|
88-90 |
2-3 |
p. 265-269
5 p.
|
artikel
|
| 24 |
Bibliography on electrical conduction in thick film resistors
|
Dziedzic, Andrzej
|
|
1991
|
88-90 |
2-3 |
p. 549-558
10 p.
|
artikel
|
| 25 |
4949341 Built-in self test method for application specific integrated circuit libraries
|
Lopez, David
|
|
1991
|
88-90 |
2-3 |
p. xi-
1 p.
|
artikel
|
| 26 |
4926117 Burn-in board having discrete test capability
|
Nevill, LelandR
|
|
1991
|
88-90 |
2-3 |
p. vi-
1 p.
|
artikel
|
| 27 |
Carbon/polyesterimide thick-film resistive composites – Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties
|
Dziedzic, Andrzej
|
|
2007
|
88-90 |
2-3 |
p. 354-362
9 p.
|
artikel
|
| 28 |
CHE failure in a two-unit standby system with slow switch, repair and post repair
|
Goel, L.R.
|
|
1991
|
88-90 |
2-3 |
p. 219-222
4 p.
|
artikel
|
| 29 |
Correlation between chemistry of polymer building blocks and microelectronics reliability
|
Bressers, H.J.L.
|
|
2007
|
88-90 |
2-3 |
p. 290-294
5 p.
|
artikel
|
| 30 |
Cost analysis of a one-unit repairable system subject to on-line preventive maintenance and/or repair
|
Gopalan, M.N.
|
|
1991
|
88-90 |
2-3 |
p. 223-228
6 p.
|
artikel
|
| 31 |
Creep of thermally aged SnAgCu-solder joints
|
Wiese, S.
|
|
2007
|
88-90 |
2-3 |
p. 223-232
10 p.
|
artikel
|
| 32 |
4929889 Data path chip test architecture
|
Seiler, LarryD
|
|
1991
|
88-90 |
2-3 |
p. vii-
1 p.
|
artikel
|
| 33 |
Dependability evaluation of Altera FPGA-based embedded systems subjected to SEUs
|
Zarandi, Hamid R.
|
|
2007
|
88-90 |
2-3 |
p. 461-470
10 p.
|
artikel
|
| 34 |
Design of reconfigurable fault-tolerant VLSI/WSI processor array structures
|
Noore, A.
|
|
1991
|
88-90 |
2-3 |
p. 481-489
9 p.
|
artikel
|
| 35 |
Dynamic responses and solder joint reliability under board level drop test
|
Luan, Jing-en
|
|
2007
|
88-90 |
2-3 |
p. 450-460
11 p.
|
artikel
|
| 36 |
Dynamic void formation in a DD-copper-structure with different metallization geometry
|
Weide-Zaage, Kirsten
|
|
2007
|
88-90 |
2-3 |
p. 319-325
7 p.
|
artikel
|
| 37 |
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn–3.5Ag wave soldered solder joints
|
Andersson, C.
|
|
2007
|
88-90 |
2-3 |
p. 266-272
7 p.
|
artikel
|
| 38 |
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
|
Yang, D.G.
|
|
2007
|
88-90 |
2-3 |
p. 233-239
7 p.
|
artikel
|
| 39 |
Effect of stress voltages on voltage acceleration and lifetime projections for ultra-thin gate oxides
|
Abadeer, W.W.
|
|
2007
|
88-90 |
2-3 |
p. 395-400
6 p.
|
artikel
|
| 40 |
4932028 Error log system for self-testing in very large scale integrated circuit (VLSI) units
|
Katircioglu, Haluk
|
|
1991
|
88-90 |
2-3 |
p. viii-
1 p.
|
artikel
|
| 41 |
Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000°C and temperature for minimum low-K interfacial oxide for high-K dielectric on Si
|
Lau, W.S.
|
|
2007
|
88-90 |
2-3 |
p. 429-433
5 p.
|
artikel
|
| 42 |
Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction
|
Watanabe, Kazufumi
|
|
2007
|
88-90 |
2-3 |
p. 409-418
10 p.
|
artikel
|
| 43 |
Excess noise as an indicator of digital integrated circuit reliability
|
Jones, B.K.
|
|
1991
|
88-90 |
2-3 |
p. 351-361
11 p.
|
artikel
|
| 44 |
Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices
|
Khatir, Z.
|
|
2007
|
88-90 |
2-3 |
p. 422-428
7 p.
|
artikel
|
| 45 |
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
|
Roellig, Mike
|
|
2007
|
88-90 |
2-3 |
p. 187-195
9 p.
|
artikel
|
| 46 |
FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress–voiding
|
Orain, S.
|
|
2007
|
88-90 |
2-3 |
p. 295-301
7 p.
|
artikel
|
| 47 |
4937655 Film segment having integrated circuit chip bonded thereto and fixture therefor
|
Miyazaki, Tatsuya
|
|
1991
|
88-90 |
2-3 |
p. ix-
1 p.
|
artikel
|
| 48 |
4920785 Hermeticity testing method and system
|
Etess, Edward
|
|
1991
|
88-90 |
2-3 |
p. v-
1 p.
|
artikel
|
| 49 |
Influence of substrate thickness on thermal impedance of microelectronic structures
|
Vermeersch, B.
|
|
2007
|
88-90 |
2-3 |
p. 437-443
7 p.
|
artikel
|
| 50 |
Inkjettable conductive adhesive for use in microelectronics and microsystems technology
|
Kolbe, Jana
|
|
2007
|
88-90 |
2-3 |
p. 331-334
4 p.
|
artikel
|
| 51 |
4918377 Integrated circuit reliability testing
|
Buehler, MartinG
|
|
1991
|
88-90 |
2-3 |
p. iv-
1 p.
|
artikel
|
| 52 |
4918379 Integrated monolithic circuit having a test bus
|
Jongepier, Abraham
|
|
1991
|
88-90 |
2-3 |
p. iv-
1 p.
|
artikel
|
| 53 |
4937659 Interconnection system for integrated circuit chips
|
Chall, Louis
|
|
1991
|
88-90 |
2-3 |
p. ix-x
nvt p.
|
artikel
|
| 54 |
4918335 Interconnection system for integrated circuit chips
|
Chall, LouisE
|
|
1991
|
88-90 |
2-3 |
p. iii-iv
nvt p.
|
artikel
|
| 55 |
Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards
|
Immonen, Marika P.
|
|
2007
|
88-90 |
2-3 |
p. 363-371
9 p.
|
artikel
|
| 56 |
Investigations of the influence of dicing techniques on the strength properties of thin silicon
|
Schoenfelder, Stephan
|
|
2007
|
88-90 |
2-3 |
p. 168-178
11 p.
|
artikel
|
| 57 |
Isotropic conductive adhesives: Future trends, possibilities and risks
|
Morris, James E.
|
|
2007
|
88-90 |
2-3 |
p. 328-330
3 p.
|
artikel
|
| 58 |
4920445 Junction-breakdown protection semiconductor device
|
Jun, DongSoo
|
|
1991
|
88-90 |
2-3 |
p. v-
1 p.
|
artikel
|
| 59 |
4949157 Large scale integrated circuit
|
Minami, Eiichi
|
|
1991
|
88-90 |
2-3 |
p. xi-
1 p.
|
artikel
|
| 60 |
4937475 Laser programmable integrated circuit
|
Matthew Rhodes, F
|
|
1991
|
88-90 |
2-3 |
p. ix-
1 p.
|
artikel
|
| 61 |
Local area network implementation of petri net reachability analysis
|
Anneberg, L.
|
|
1991
|
88-90 |
2-3 |
p. 491-499
9 p.
|
artikel
|
| 62 |
Low-distortion 4th order programmable Butterworth filter
|
Teresa Sanz, M.
|
|
2007
|
88-90 |
2-3 |
p. 471-476
6 p.
|
artikel
|
| 63 |
Low voltage stress induced leakage current and time to breakdown in ultra-thin (1.2–2.3nm) oxides
|
Petit, C.
|
|
2007
|
88-90 |
2-3 |
p. 401-408
8 p.
|
artikel
|
| 64 |
4930439 Mask-repairing device
|
Sato, Mitsuyoshi
|
|
1991
|
88-90 |
2-3 |
p. vii-
1 p.
|
artikel
|
| 65 |
4927505 Metallization scheme providing adhesion and barrier properties
|
Sharma, RavinderK
|
|
1991
|
88-90 |
2-3 |
p. vi-
1 p.
|
artikel
|
| 66 |
4937826 Method and apparatus for sensing defects in integrated circuit elements
|
Gheewala, TusharR
|
|
1991
|
88-90 |
2-3 |
p. x-
1 p.
|
artikel
|
| 67 |
4947105 Method and circuit for testing integrated circuit modules
|
Unger, Bernhard
|
|
1991
|
88-90 |
2-3 |
p. x-
1 p.
|
artikel
|
| 68 |
4937203 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
|
Eichelberger, CharlesW
|
|
1991
|
88-90 |
2-3 |
p. ix-
1 p.
|
artikel
|
| 69 |
4918385 Method and process for testing the reliability of integrated circuit (IC) chipsand novel IC circuitry for accomplishing same
|
Shreeve, RobertW
|
|
1991
|
88-90 |
2-3 |
p. iv-v
nvt p.
|
artikel
|
| 70 |
4917466 Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
|
Nakamura, Akio
|
|
1991
|
88-90 |
2-3 |
p. iii-
1 p.
|
artikel
|
| 71 |
4933860 Method for fabricating a radio frequency integrated circuit and product formed thereby
|
Liu, LouisC
|
|
1991
|
88-90 |
2-3 |
p. viii-
1 p.
|
artikel
|
| 72 |
4935378 Method for manufacturing a semiconductor device having more than two conductive layers
|
Mori, Seiichi
|
|
1991
|
88-90 |
2-3 |
p. viii-
1 p.
|
artikel
|
| 73 |
4933042 Method for packaging integrated circuit chips employing a polymer film overlay layer
|
Eichelberger, CharlesW
|
|
1991
|
88-90 |
2-3 |
p. viii-
1 p.
|
artikel
|
| 74 |
4924589 Method of making and testing an integrated circuit
|
Leedy, GlennJ
|
|
1991
|
88-90 |
2-3 |
p. vi-
1 p.
|
artikel
|
| 75 |
4952272 Method of manufacturing probing head for testing equipment of semiconductor large scale integrated circuits
|
Okino, Hironobu
|
|
1991
|
88-90 |
2-3 |
p. xiii-
1 p.
|
artikel
|
| 76 |
4912052 Method of testing semiconductor elements
|
Miyoshi, Motosuke
|
|
1991
|
88-90 |
2-3 |
p. ii-
1 p.
|
artikel
|
| 77 |
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
|
Gonda, V.
|
|
2007
|
88-90 |
2-3 |
p. 248-251
4 p.
|
artikel
|
| 78 |
4930101 Microprocessor controlled meter package for a printer
|
Wong, YuenW
|
|
1991
|
88-90 |
2-3 |
p. vii-
1 p.
|
artikel
|
| 79 |
Monte Carlo simulation for improving electromigration lifetime by balancing temperature and structural gradients
|
Gui, X.
|
|
1991
|
88-90 |
2-3 |
p. 389-400
12 p.
|
artikel
|
| 80 |
Multicriteria optimization for combined reliability and redundancy allocation in systems employing mixed redundancies
|
Misra, Krishna B.
|
|
1991
|
88-90 |
2-3 |
p. 323-335
13 p.
|
artikel
|
| 81 |
4912399 Multiple lead probe for integrated circuits in wafer form
|
Greub, HansJ
|
|
1991
|
88-90 |
2-3 |
p. ii-iii
nvt p.
|
artikel
|
| 82 |
New definitions of basic R&M terms
|
Badenius, Duncan
|
|
1991
|
88-90 |
2-3 |
p. 525-535
11 p.
|
artikel
|
| 83 |
Novel shear tools for viscoelastic characterization of packaging polymers
|
van’t Hof, C.
|
|
2007
|
88-90 |
2-3 |
p. 240-247
8 p.
|
artikel
|
| 84 |
Numerical approach to characterization of thermally conductive adhesives
|
Fałat, Tomasz
|
|
2007
|
88-90 |
2-3 |
p. 342-346
5 p.
|
artikel
|
| 85 |
Numerical modeling of warpage induced in QFN array molding process
|
Yang, D.G.
|
|
2007
|
88-90 |
2-3 |
p. 310-318
9 p.
|
artikel
|
| 86 |
On multivariate generalized logistic distribution
|
Ragab, Aisha
|
|
1991
|
88-90 |
2-3 |
p. 511-519
9 p.
|
artikel
|
| 87 |
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections
|
de Vries, J.W.C.
|
|
2007
|
88-90 |
2-3 |
p. 444-449
6 p.
|
artikel
|
| 88 |
On the effect of power-line disturbances on microcomputer performance
|
Roda, Valentin Obac
|
|
1991
|
88-90 |
2-3 |
p. 229-235
7 p.
|
artikel
|
| 89 |
4952057 Optical fiber backscatter signature generator (OFBSG)
|
Kamikawa, Neil
|
|
1991
|
88-90 |
2-3 |
p. xii-xiii
nvt p.
|
artikel
|
| 90 |
Optimal replacement of a system with imperfect repair
|
Makiš, Viliam
|
|
1991
|
88-90 |
2-3 |
p. 381-388
8 p.
|
artikel
|
| 91 |
Optimization of test parallelism with limited hardware overhead
|
Feng, Sheng
|
|
1991
|
88-90 |
2-3 |
p. 271-276
6 p.
|
artikel
|
| 92 |
Optimizing the thermalsonic bonding process for thick film hybrid IC by the Taguchi Method
|
Yann-Chyn, Jeng
|
|
1991
|
88-90 |
2-3 |
p. 501-510
10 p.
|
artikel
|
| 93 |
Organic thin film transistors with HfO2 high-k gate dielectric grown by anodic oxidation or deposited by sol–gel
|
Tardy, J.
|
|
2007
|
88-90 |
2-3 |
p. 372-377
6 p.
|
artikel
|
| 94 |
Performance trends of Si-based RF transistors
|
Schwierz, F.
|
|
2007
|
88-90 |
2-3 |
p. 384-390
7 p.
|
artikel
|
| 95 |
Physicochemical investigations and nonstandard electrical measurements of inks and thick films—Bibliography
|
Dziedzic, Andrzej
|
|
1991
|
88-90 |
2-3 |
p. 537-548
12 p.
|
artikel
|
| 96 |
Polytronic 2005
|
Dziedzic, Andrzej
|
|
2007
|
88-90 |
2-3 |
p. 327-
1 p.
|
artikel
|
| 97 |
Pre-emptive repeat priority repairs and failure of non-failed component during system failure of a complex system
|
Singh, I.P.
|
|
1991
|
88-90 |
2-3 |
p. 261-264
4 p.
|
artikel
|
| 98 |
Problems of PCB microvias filling by conductive paste
|
Kisiel, Ryszard
|
|
2007
|
88-90 |
2-3 |
p. 335-341
7 p.
|
artikel
|
| 99 |
4945302 Process and a circuit board for performing tests during burn-in of integrated semi-conductor circuits
|
Janum, ViggoK
|
|
1991
|
88-90 |
2-3 |
p. x-
1 p.
|
artikel
|
| 100 |
4950498 Process for repairing pattern film
|
Kaito, Takashi
|
|
1991
|
88-90 |
2-3 |
p. xi-xii
nvt p.
|
artikel
|
| 101 |
4914814 Process of fabricating a circuit package
|
Behun, JohnR
|
|
1991
|
88-90 |
2-3 |
p. iii-
1 p.
|
artikel
|
| 102 |
Regression models for estimating survival of patients with non-Hodgkin's Lymphoma
|
Alidrisi, Mustafa
|
|
1991
|
88-90 |
2-3 |
p. 473-480
8 p.
|
artikel
|
| 103 |
Reliability analysis of a human operator under several levels of stress
|
Who Kee Chung,
|
|
1991
|
88-90 |
2-3 |
p. 367-370
4 p.
|
artikel
|
| 104 |
Reliability analysis of a non-identical unit parallel system with common-cause failures
|
Dhillon, B.S.
|
|
1991
|
88-90 |
2-3 |
p. 429-441
13 p.
|
artikel
|
| 105 |
Reliability analysis of a series repairable system with multiple failures
|
Chung, Who Kee
|
|
1991
|
88-90 |
2-3 |
p. 371-373
3 p.
|
artikel
|
| 106 |
Reliability analysis of a series system with repair
|
Who Kee Chung,
|
|
1991
|
88-90 |
2-3 |
p. 363-365
3 p.
|
artikel
|
| 107 |
Reliability analysis of a system with a human operator and subject to two failure modes
|
Kumar, Ashok
|
|
1991
|
88-90 |
2-3 |
p. 277-283
7 p.
|
artikel
|
| 108 |
Reliability assessment of computer systems design
|
Bastos Martini, M.R.
|
|
1991
|
88-90 |
2-3 |
p. 237-244
8 p.
|
artikel
|
| 109 |
Reliability assessment of the metallized film capacitors from degradation data
|
Zhao, Jianyin
|
|
2007
|
88-90 |
2-3 |
p. 434-436
3 p.
|
artikel
|
| 110 |
Reliability measures for fail safe computer-based systems
|
Zhou, Zhibang
|
|
1991
|
88-90 |
2-3 |
p. 401-406
6 p.
|
artikel
|
| 111 |
Reliability model of cold standby systems with built-in-test
|
Shao, Jiajun
|
|
1991
|
88-90 |
2-3 |
p. 443-451
9 p.
|
artikel
|
| 112 |
Reliability of SnPb and Pb-free flip–chips under different test conditions
|
Spraul, M.
|
|
2007
|
88-90 |
2-3 |
p. 252-258
7 p.
|
artikel
|
| 113 |
Reliability study of ultrathin oxide films subject to irradiation-then-stress treatment using conductive atomic force microscopy
|
Wu, You-Lin
|
|
2007
|
88-90 |
2-3 |
p. 419-421
3 p.
|
artikel
|
| 114 |
Repair body cost minimization with unreliable Markovian restoration
|
Martynenko, Oleg
|
|
1991
|
88-90 |
2-3 |
p. 343-349
7 p.
|
artikel
|
| 115 |
4951122 Resin-encapsulated semiconductor device
|
Tsubosaki, Kunihiro
|
|
1991
|
88-90 |
2-3 |
p. xii-
1 p.
|
artikel
|
| 116 |
Revised test that a distribution is new better than used
|
Green, Jack R.
|
|
1991
|
88-90 |
2-3 |
p. 521-524
4 p.
|
artikel
|
| 117 |
4908226 Selective area nucleation and growth method for metal chemical vapor deposition using focused ion beams
|
Kubena, Randall
|
|
1991
|
88-90 |
2-3 |
p. i-ii
nvt p.
|
artikel
|
| 118 |
4908690 Semiconductor integrated circuit device with high reliability wiring layers
|
Hata, Masayuk
|
|
1991
|
88-90 |
2-3 |
p. ii-
1 p.
|
artikel
|
| 119 |
4910735 Semiconductor integrated circuit with self-testing
|
Yamashita, Koichi
|
|
1991
|
88-90 |
2-3 |
p. ii-
1 p.
|
artikel
|
| 120 |
4951253 Semiconductor memory system
|
Sahara, Hirosh
|
|
1991
|
88-90 |
2-3 |
p. xii-
1 p.
|
artikel
|
| 121 |
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology
|
Lee, Chang-Chun
|
|
2007
|
88-90 |
2-3 |
p. 196-204
9 p.
|
artikel
|
| 122 |
Stochastic analysis of a two-unit deteriorating standby system with two switching devices
|
Goel, L.R.
|
|
1991
|
88-90 |
2-3 |
p. 213-218
6 p.
|
artikel
|
| 123 |
4929081 System for detecting defects in a regularly arranged pattern such as an integrated circuit or the like
|
Yamamoto, Yoko
|
|
1991
|
88-90 |
2-3 |
p. vi-vii
nvt p.
|
artikel
|
| 124 |
4922134 Testable redundancy decoder of an integrated semiconductor memory
|
Hoffmann, Kurt
|
|
1991
|
88-90 |
2-3 |
p. v-vi
nvt p.
|
artikel
|
| 125 |
4918691 Testing of integrated circuit modules
|
Chall, Louis
|
|
1991
|
88-90 |
2-3 |
p. v-
1 p.
|
artikel
|
| 126 |
4950980 Test socket for electronic device packages
|
Pfaff, WayneK
|
|
1991
|
88-90 |
2-3 |
p. xii-
1 p.
|
artikel
|
| 127 |
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages
|
Vandevelde, Bart
|
|
2007
|
88-90 |
2-3 |
p. 259-265
7 p.
|
artikel
|
| 128 |
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
|
Wymysłowski, Artur
|
|
2007
|
88-90 |
2-3 |
p. 159-160
2 p.
|
artikel
|
| 129 |
Thermal simulation of UV laser ablation of polyimide
|
Gordon, Péter
|
|
2007
|
88-90 |
2-3 |
p. 347-353
7 p.
|
artikel
|
| 130 |
The Sherif-Dear simple (SDS) Theorem in number theory
|
Sherif, Yosef S.
|
|
1991
|
88-90 |
2-3 |
p. 465-471
7 p.
|
artikel
|
| 131 |
Three-server bulk service queue with service interruptions and exponential repairs
|
Singh, I.P.
|
|
1991
|
88-90 |
2-3 |
p. 257-259
3 p.
|
artikel
|
| 132 |
TMR neural simulation
|
Goben, C.A.
|
|
1991
|
88-90 |
2-3 |
p. 375-380
6 p.
|
artikel
|
| 133 |
Virtual qualification of moisture induced failures of advanced packages
|
van Gils, M.A.J.
|
|
2007
|
88-90 |
2-3 |
p. 273-279
7 p.
|
artikel
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