| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions
|
Yan, Haidong
|
|
2015
|
88-90 |
12PA |
p. 2532-2541
10 p.
|
artikel
|
| 2 |
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies
|
Yaqub, Imran
|
|
2015
|
88-90 |
12PA |
p. 2596-2605
10 p.
|
artikel
|
| 3 |
Design and process related MIM cap reliability improvement
|
Parke, Justin
|
|
2015
|
88-90 |
12PA |
p. 2516-2521
6 p.
|
artikel
|
| 4 |
Editorial
|
Ersland, Peter
|
|
2015
|
88-90 |
12PA |
p. 2483-
1 p.
|
artikel
|
| 5 |
Editorial Board
|
|
|
2015
|
88-90 |
12PA |
p. IFC-
1 p.
|
artikel
|
| 6 |
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology
|
Chang, Tao-Chih
|
|
2015
|
88-90 |
12PA |
p. 2582-2588
7 p.
|
artikel
|
| 7 |
Electromigration behavior in Cu/Ni–P/Sn–Cu based joint system with low current density
|
Kadoguchi, Takuya
|
|
2015
|
88-90 |
12PA |
p. 2554-2559
6 p.
|
artikel
|
| 8 |
Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer
|
Fujino, Masahisa
|
|
2015
|
88-90 |
12PA |
p. 2560-2564
5 p.
|
artikel
|
| 9 |
Impression creep behavior of Zn–4Al–3Mg–xSn high-temperature lead-free solders
|
Mahmudi, R.
|
|
2015
|
88-90 |
12PA |
p. 2542-2548
7 p.
|
artikel
|
| 10 |
Improved surface morphology of a Ti/Al/Ni/Au ohmic contact for AlGaN/GaN heterostructure by Al2O3 particles
|
Lim, Jin Hong
|
|
2015
|
88-90 |
12PA |
p. 2565-2568
4 p.
|
artikel
|
| 11 |
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability
|
Tsai, M.Y.
|
|
2015
|
88-90 |
12PA |
p. 2589-2595
7 p.
|
artikel
|
| 12 |
Operating channel temperature in GaN HEMTs: DC versus RF accelerated life testing
|
Pomeroy, J.W.
|
|
2015
|
88-90 |
12PA |
p. 2505-2510
6 p.
|
artikel
|
| 13 |
Power electronics packaging
|
Suganuma, Katsuaki
|
|
2015
|
88-90 |
12PA |
p. 2523-
1 p.
|
artikel
|
| 14 |
Preparation and thermal properties of the graphene–polyolefin adhesive composites: Application in thermal interface materials
|
Cui, Tengfei
|
|
2015
|
88-90 |
12PA |
p. 2569-2574
6 p.
|
artikel
|
| 15 |
Scaling DC lifetests on GaN HEMT to RF conditions
|
Paine, Bruce M.
|
|
2015
|
88-90 |
12PA |
p. 2499-2504
6 p.
|
artikel
|
| 16 |
Setting stress conditions that qualify application expectations
|
Roesch, William J.
|
|
2015
|
88-90 |
12PA |
p. 2484-2492
9 p.
|
artikel
|
| 17 |
Study of Al−Cu compounds as soldering bond pad for high-power device packaging
|
Liu, Wei Chih
|
|
2015
|
88-90 |
12PA |
p. 2549-2553
5 p.
|
artikel
|
| 18 |
Study of hot electrons in AlGaN/GaN HEMTs under RF Class B and Class J operation using electroluminescence
|
Brazzini, Tommaso
|
|
2015
|
88-90 |
12PA |
p. 2493-2498
6 p.
|
artikel
|
| 19 |
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
|
Zhao, Su-Yan
|
|
2015
|
88-90 |
12PA |
p. 2524-2531
8 p.
|
artikel
|
| 20 |
Temperature, humidity, and bias acceleration model for a GaAs pHEMT process
|
Drandova, Gergana I.
|
|
2015
|
88-90 |
12PA |
p. 2511-2515
5 p.
|
artikel
|
| 21 |
Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules
|
Zheng, Hanguang
|
|
2015
|
88-90 |
12PA |
p. 2575-2581
7 p.
|
artikel
|
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