| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach
|
Wlanis, Thomas
|
|
2018
|
86 |
C |
p. 1-9
|
artikel
|
| 2 |
Editorial Board
|
|
|
2018
|
86 |
C |
p. ii
|
artikel
|
| 3 |
Effect of potting materials on LED bulb's driver temperature
|
Nguyen, Nam
|
|
2018
|
86 |
C |
p. 77-81
|
artikel
|
| 4 |
Electro thermal modeling of the power diode using Pspice
|
Hanini, Wasma
|
|
2018
|
86 |
C |
p. 82-91
|
artikel
|
| 5 |
Evaluation of screen printed silver trace performance and long-term reliability against environmental stress on a low surface energy substrate
|
Mikkonen, Riikka
|
|
2018
|
86 |
C |
p. 54-65
|
artikel
|
| 6 |
Experimental identification of LED compact thermal model element values
|
Janicki, Marcin
|
|
2018
|
86 |
C |
p. 20-26
|
artikel
|
| 7 |
Hardware redundancy architecture based on reconfigurable logic blocks with persistent high reliability improvement
|
Krištofík, Štefan
|
|
2018
|
86 |
C |
p. 38-53
|
artikel
|
| 8 |
Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model
|
Raszkowski, Tomasz
|
|
2018
|
86 |
C |
p. 10-19
|
artikel
|
| 9 |
Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics
|
Choi, Kyeonggon
|
|
2018
|
86 |
C |
p. 66-71
|
artikel
|
| 10 |
Opcode vector: An efficient scheme to detect soft errors in instructions
|
Martinez, Jorge
|
|
2018
|
86 |
C |
p. 92-97
|
artikel
|
| 11 |
Reliability analysis of a mini-instrument for simultaneous monitoring water content, deep tissue temperature, and hemodynamic parameters
|
Li, Ting
|
|
2018
|
86 |
C |
p. 72-76
|
artikel
|
| 12 |
Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates
|
Wan, Yongqiang
|
|
2018
|
86 |
C |
p. 27-37
|
artikel
|
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