nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A Bayesian reliability growth model
|
|
|
1969 |
8 |
3 |
p. 253- 1 p. |
artikel |
2 |
A ceramic based thin film system for low cost production of modules
|
|
|
1969 |
8 |
3 |
p. 261- 1 p. |
artikel |
3 |
Adhesive strength of evaporated gold films on glass substrate
|
|
|
1969 |
8 |
3 |
p. 262- 1 p. |
artikel |
4 |
Aging characteristics of tantalum nitride thin film resistors
|
|
|
1969 |
8 |
3 |
p. 251- 1 p. |
artikel |
5 |
A high precision alignment device
|
|
|
1969 |
8 |
3 |
p. 256- 1 p. |
artikel |
6 |
All-IC hybrid computer eliminates the patchwork from programming
|
|
|
1969 |
8 |
3 |
p. 258- 1 p. |
artikel |
7 |
A method for estimated errors in system reliability prediction
|
|
|
1969 |
8 |
3 |
p. 253- 1 p. |
artikel |
8 |
A microwave integrated transistor amplifier and the high-frequency limit of transistors
|
|
|
1969 |
8 |
3 |
p. 258- 1 p. |
artikel |
9 |
A procedure for generating test sequences to detect sequential circuit failures
|
|
|
1969 |
8 |
3 |
p. 252- 1 p. |
artikel |
10 |
A process control specification for integrated circuits
|
|
|
1969 |
8 |
3 |
p. 249- 1 p. |
artikel |
11 |
A simple guide to the general assessment of MTBF
|
Deakin, C.G. |
|
1969 |
8 |
3 |
p. 189-203 15 p. |
artikel |
12 |
Assuring integrated circuit reliability during production
|
|
|
1969 |
8 |
3 |
p. 249- 1 p. |
artikel |
13 |
Automatic test equipment
|
|
|
1969 |
8 |
3 |
p. 247- 1 p. |
artikel |
14 |
A versatile manufacturing method for the production of complex hybrid microelectronics assemblies
|
|
|
1969 |
8 |
3 |
p. 256-257 2 p. |
artikel |
15 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1969 |
8 |
3 |
p. 263-265 3 p. |
artikel |
16 |
Comparison of bipolar and MOS integrated circuits
|
|
|
1969 |
8 |
3 |
p. 255- 1 p. |
artikel |
17 |
Comparison of predicted and demonstrated reliability and maintainability figures
|
|
|
1969 |
8 |
3 |
p. 252- 1 p. |
artikel |
18 |
Computer aided integrated circuit design
|
|
|
1969 |
8 |
3 |
p. 257- 1 p. |
artikel |
19 |
Computer aided layout of microcircuits
|
|
|
1969 |
8 |
3 |
p. 255- 1 p. |
artikel |
20 |
Computer's aid for integrated circuit mask production
|
|
|
1969 |
8 |
3 |
p. 256- 1 p. |
artikel |
21 |
Courses in microelectronics and reliability
|
|
|
1969 |
8 |
3 |
p. 181-183 3 p. |
artikel |
22 |
Current-voltage and current-temperature characteristics of alloyed pGe-nSi heterojunctions
|
|
|
1969 |
8 |
3 |
p. 260- 1 p. |
artikel |
23 |
Design and applications of metal oxide silicon array integrated circuits (Mosaics's) to data handling systems
|
|
|
1969 |
8 |
3 |
p. 257- 1 p. |
artikel |
24 |
Economical reliability program design
|
|
|
1969 |
8 |
3 |
p. 247- 1 p. |
artikel |
25 |
Editorial
|
Dummer, G.W.A. |
|
1969 |
8 |
3 |
p. 173- 1 p. |
artikel |
26 |
Effects of nuclear radiation on a high reliability silicon power diode I-Change in I–V design characteristics
|
|
|
1969 |
8 |
3 |
p. 248- 1 p. |
artikel |
27 |
Epitaxial processing and equipment
|
|
|
1969 |
8 |
3 |
p. 259- 1 p. |
artikel |
28 |
Fault indicators and the unavailability of redundant circuits
|
Repton, C.S. |
|
1969 |
8 |
3 |
p. 215-234 20 p. |
artikel |
29 |
Four point mercury contact probe for electrical resistivity measurements of thin films
|
|
|
1969 |
8 |
3 |
p. 262- 1 p. |
artikel |
30 |
Germanium IC's point the way towards picosecond computers
|
|
|
1969 |
8 |
3 |
p. 261- 1 p. |
artikel |
31 |
Getter-ion pumps of the magnetron type and an attempted interpretation of the discharge mechanism
|
|
|
1969 |
8 |
3 |
p. 262- 1 p. |
artikel |
32 |
Handling and bonding of beam-lead sealed-junction integrated circuits
|
|
|
1969 |
8 |
3 |
p. 259-260 2 p. |
artikel |
33 |
High-precision alignment device
|
|
|
1969 |
8 |
3 |
p. 255- 1 p. |
artikel |
34 |
High reliability screening of semiconductor and integrated circuit devices
|
|
|
1969 |
8 |
3 |
p. 251- 1 p. |
artikel |
35 |
How reliable are plastic encapsulated semiconductors?
|
|
|
1969 |
8 |
3 |
p. 248- 1 p. |
artikel |
36 |
Integrated color televison receiver
|
|
|
1969 |
8 |
3 |
p. 259- 1 p. |
artikel |
37 |
Is reliability necessary?
|
|
|
1969 |
8 |
3 |
p. 247-248 2 p. |
artikel |
38 |
Low-density tantalum
|
|
|
1969 |
8 |
3 |
p. 262- 1 p. |
artikel |
39 |
Maintainability demonstration procedure and data
|
|
|
1969 |
8 |
3 |
p. 253- 1 p. |
artikel |
40 |
Measuring microbond integrity with an infrared microradiometer
|
|
|
1969 |
8 |
3 |
p. 248-249 2 p. |
artikel |
41 |
Metallization, dicing and circuit assembly
|
|
|
1969 |
8 |
3 |
p. 260- 1 p. |
artikel |
42 |
Microcircuits and their applications
|
G.W.A.D., |
|
1969 |
8 |
3 |
p. 243- 1 p. |
artikel |
43 |
Microelectronic device data handbook
|
|
|
1969 |
8 |
3 |
p. 254- 1 p. |
artikel |
44 |
Micropower error-correcting redundant circuit design
|
|
|
1969 |
8 |
3 |
p. 251- 1 p. |
artikel |
45 |
Mikroelektronik 3
|
G.W.A.D, |
|
1969 |
8 |
3 |
p. 243- 1 p. |
artikel |
46 |
Monolithic circuit test standards
|
|
|
1969 |
8 |
3 |
p. 254- 1 p. |
artikel |
47 |
MOST capacitor memory
|
|
|
1969 |
8 |
3 |
p. 258- 1 p. |
artikel |
48 |
New developments in interconnection for hybrid microelectronics
|
|
|
1969 |
8 |
3 |
p. 257- 1 p. |
artikel |
49 |
Noise figure of the diode-stabilized linear integrated devices
|
Bozic, S.M. |
|
1969 |
8 |
3 |
p. 237-238 2 p. |
artikel |
50 |
Non-ohmic microwave conductivity in semiconductor posts
|
|
|
1969 |
8 |
3 |
p. 261- 1 p. |
artikel |
51 |
Normalized thermionic-field (T-F) emission in metal-semiconductor (Schottky) barriers
|
|
|
1969 |
8 |
3 |
p. 260-261 2 p. |
artikel |
52 |
Operational system effectiveness study a layman's approach
|
|
|
1969 |
8 |
3 |
p. 253- 1 p. |
artikel |
53 |
Packaging and reliability in integrated circuits
|
|
|
1969 |
8 |
3 |
p. 250- 1 p. |
artikel |
54 |
Papers to be published in future issues
|
|
|
1969 |
8 |
3 |
p. 267- 1 p. |
artikel |
55 |
Particulate contamination of vacuum-evaporated films
|
Buck, R.H. |
|
1969 |
8 |
3 |
p. 235-236 2 p. |
artikel |
56 |
Physical analysis of stress testing for failure of electronic components
|
|
|
1969 |
8 |
3 |
p. 250- 1 p. |
artikel |
57 |
Power supplies for ICs
|
|
|
1969 |
8 |
3 |
p. 258- 1 p. |
artikel |
58 |
Practical aspects of electronic instruments—cost, reliability, and maintenance
|
|
|
1969 |
8 |
3 |
p. 251-252 2 p. |
artikel |
59 |
Preliminary analysis of radio component reliability
|
|
|
1969 |
8 |
3 |
p. 249-250 2 p. |
artikel |
60 |
Preparation of high purity silicon
|
|
|
1969 |
8 |
3 |
p. 261- 1 p. |
artikel |
61 |
Probabilistic reliability: An engineering approach
|
|
|
1969 |
8 |
3 |
p. 246- 1 p. |
artikel |
62 |
Pseudopotential impurity theory and covalent bonding in semiconductors
|
|
|
1969 |
8 |
3 |
p. 260- 1 p. |
artikel |
63 |
Recent patents in microelectronics
|
|
|
1969 |
8 |
3 |
p. 179-180 2 p. |
artikel |
64 |
Relay failure analysis techniques
|
|
|
1969 |
8 |
3 |
p. 250- 1 p. |
artikel |
65 |
Reliability methodology
|
|
|
1969 |
8 |
3 |
p. 245- 1 p. |
artikel |
66 |
Reliability of electrodeposited cylindrical permalloy films
|
|
|
1969 |
8 |
3 |
p. 249- 1 p. |
artikel |
67 |
Reliability Physics
|
|
|
1969 |
8 |
3 |
p. 245- 1 p. |
artikel |
68 |
Reliability tasks vs. product reliability
|
|
|
1969 |
8 |
3 |
p. 247- 1 p. |
artikel |
69 |
Reliable control systems Part 1. Upgrading instrument performance
|
|
|
1969 |
8 |
3 |
p. 252- 1 p. |
artikel |
70 |
Reliable soldering of printed circuit boards
|
|
|
1969 |
8 |
3 |
p. 249- 1 p. |
artikel |
71 |
Reports of conferences, symposia, lectures and meetings of interest
|
|
|
1969 |
8 |
3 |
p. 175-178 4 p. |
artikel |
72 |
R-F sputtering processes
|
|
|
1969 |
8 |
3 |
p. 262- 1 p. |
artikel |
73 |
Schottky diodes speed up digital IC's
|
|
|
1969 |
8 |
3 |
p. 261- 1 p. |
artikel |
74 |
Semiconductor memories
|
|
|
1969 |
8 |
3 |
p. 259- 1 p. |
artikel |
75 |
Sense and nonsense in electronic reliability engineering
|
|
|
1969 |
8 |
3 |
p. 247- 1 p. |
artikel |
76 |
Sequential reliability assurance in finite lots
|
|
|
1969 |
8 |
3 |
p. 245- 1 p. |
artikel |
77 |
Some investigation of failure mechanism in thin film resistors
|
|
|
1969 |
8 |
3 |
p. 248- 1 p. |
artikel |
78 |
Some new integrated circuits for computers and desk calculators
|
|
|
1969 |
8 |
3 |
p. 258- 1 p. |
artikel |
79 |
Stress strength models—A solution to accelerated life testing
|
|
|
1969 |
8 |
3 |
p. 248- 1 p. |
artikel |
80 |
Study of metal transfer between reed contacts
|
Davies, T.A. |
|
1969 |
8 |
3 |
p. 205-206 2 p. |
artikel |
81 |
System cost effectiveness—the end of the first era
|
|
|
1969 |
8 |
3 |
p. 253-254 2 p. |
artikel |
82 |
System reliability in telephone switching equipment
|
Ronayne, J.P. |
|
1969 |
8 |
3 |
p. 239-242 4 p. |
artikel |
83 |
Testing high reliability relays by use of automatic equipment
|
|
|
1969 |
8 |
3 |
p. 250- 1 p. |
artikel |
84 |
The application of a computer in the design and manufacture of photolithographic masks for LSI interconnection patterns
|
|
|
1969 |
8 |
3 |
p. 256- 1 p. |
artikel |
85 |
The contribution of standardization to the reliability of electronic equipment
|
Kersey, R.W. |
|
1969 |
8 |
3 |
p. 185-187 3 p. |
artikel |
86 |
The deposition of tantalum from the vapour-gas phase
|
|
|
1969 |
8 |
3 |
p. 261- 1 p. |
artikel |
87 |
The development of large-scale integration
|
|
|
1969 |
8 |
3 |
p. 254- 1 p. |
artikel |
88 |
The economics of micropacking
|
|
|
1969 |
8 |
3 |
p. 254- 1 p. |
artikel |
89 |
The ever increasing complexity of integrated circuits
|
|
|
1969 |
8 |
3 |
p. 254- 1 p. |
artikel |
90 |
The Methods of reliability
|
|
|
1969 |
8 |
3 |
p. 246- 1 p. |
artikel |
91 |
The physics of thin film deposition
|
|
|
1969 |
8 |
3 |
p. 261-262 2 p. |
artikel |
92 |
The reliability-design engineer relationship
|
|
|
1969 |
8 |
3 |
p. 246- 1 p. |
artikel |
93 |
The reliability of screened metal film resistors
|
|
|
1969 |
8 |
3 |
p. 251- 1 p. |
artikel |
94 |
Thermal considerations for hybrid microcircuit packages and assemblies with high power dissipations
|
|
|
1969 |
8 |
3 |
p. 255- 1 p. |
artikel |
95 |
The ultrasonic bonding of silicon integrated circuit chips
|
|
|
1969 |
8 |
3 |
p. 256- 1 p. |
artikel |
96 |
The use of simple hybrid integrated circuit methods as a research tool
|
|
|
1969 |
8 |
3 |
p. 254-255 2 p. |
artikel |
97 |
Thin-film transistors
|
|
|
1969 |
8 |
3 |
p. 262- 1 p. |
artikel |
98 |
Using cost data to optimize reliability
|
|
|
1969 |
8 |
3 |
p. 246- 1 p. |
artikel |
99 |
Variable magnitude capacitors and resistors
|
Schaudinischky, L. |
|
1969 |
8 |
3 |
p. 211-212 2 p. |
artikel |
100 |
Wanted—Realistic Alternatives to MIL-STD-781
|
|
|
1969 |
8 |
3 |
p. 246- 1 p. |
artikel |
101 |
Will radiation wreck your IC design?
|
|
|
1969 |
8 |
3 |
p. 254- 1 p. |
artikel |
102 |
X-Ray vidicon analysis of electronic components
|
|
|
1969 |
8 |
3 |
p. 251- 1 p. |
artikel |
103 |
7 years of OAO
|
|
|
1969 |
8 |
3 |
p. 252- 1 p. |
artikel |