nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Adhesion strength of die attach film for thin electronic package at elevated temperature
|
Mose, Bruno R. |
|
2018 |
76-77 |
P1 |
p. 15-22 |
artikel |
2 |
A holistic comparison of the different resampling algorithms for particle filter based prognosis using lithium ion batteries as a case study
|
Pugalenthi, Karkulali |
|
2018 |
76-77 |
P1 |
p. 160-169 |
artikel |
3 |
Analytical model for the transient analysis of electronic assemblies subjected to impact loading
|
Gharaibeh, Mohammad A. |
|
2018 |
76-77 |
P1 |
p. 112-119 |
artikel |
4 |
A robust asynchronous 16 × 16-bit subthreshold multiplier using SAPTL technique
|
Zhang, Qi |
|
2018 |
76-77 |
P1 |
p. 98-111 |
artikel |
5 |
Editorial Board
|
|
|
2018 |
76-77 |
P1 |
p. ii |
artikel |
6 |
Failure and failure characterization of QFP package interconnect structure under random vibration condition
|
Jiaxing, Hu |
|
2018 |
76-77 |
P1 |
p. 120-127 |
artikel |
7 |
Heavy ion impact on narrow band cascoded low noise amplifier
|
Rajendiran, P. |
|
2018 |
76-77 |
P1 |
p. 31-37 |
artikel |
8 |
Implications of electron beam irradiation on Al/n-Si Schottky junction properties
|
Vali, Indudhar Panduranga |
|
2018 |
76-77 |
P1 |
p. 179-184 |
artikel |
9 |
Lifetime-aware scheduling in high level synthesis
|
Es'haghi, Siavash |
|
2018 |
76-77 |
P1 |
p. 86-97 |
artikel |
10 |
Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs
|
Zubert, Mariusz |
|
2018 |
76-77 |
P1 |
p. 139-153 |
artikel |
11 |
Mission profile-based assessment of semiconductor technologies for automotive applications
|
Ahari, Ali |
|
2018 |
76-77 |
P1 |
p. 129-138 |
artikel |
12 |
New dynamic electro-thermo-optical model of power LEDs
|
Górecki, Krzysztof |
|
2018 |
76-77 |
P1 |
p. 1-7 |
artikel |
13 |
Performance analysis of S-parameter in N-MOSFET devices after thermal accelerated tests
|
Belaïd, M.A. |
|
2018 |
76-77 |
P1 |
p. 8-14 |
artikel |
14 |
Seu and Sefi error detection and correction on a ddr3 memory system
|
Cóbreces, Ana |
|
2018 |
76-77 |
P1 |
p. 23-30 |
artikel |
15 |
Simulation study of single event effects in the SiC LDMOS with a step compound drift region
|
Bao, Meng-tian |
|
2018 |
76-77 |
P1 |
p. 170-178 |
artikel |
16 |
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface
|
Chen, Si |
|
2018 |
76-77 |
P1 |
p. 52-66 |
artikel |
17 |
Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application
|
Shao, Huakai |
|
2018 |
76-77 |
P1 |
p. 38-45 |
artikel |
18 |
The threshold voltage degradation model of N Channel VDMOSFETs under PBT stress
|
Ye, Xuerong |
|
2018 |
76-77 |
P1 |
p. 46-51 |
artikel |
19 |
To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'17
|
Codecasa, Lorenzo |
|
2018 |
76-77 |
P1 |
p. 128 |
artikel |
20 |
Towards reliability enhancement of graphene FET biosensor in complex analyte: Artificial neural network approach
|
Basu, Joyeeta |
|
2018 |
76-77 |
P1 |
p. 154-159 |
artikel |
21 |
Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
|
Kuczynska, M. |
|
2018 |
76-77 |
P1 |
p. 67-85 |
artikel |