| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Acceleration of the goodness-on-fit test by using the programme for EDA. A proposal of BWP on the Weibull plot and a study of applying BWP to censored data
|
|
|
1993
|
76-77 |
13 |
p. 2063-
1 p.
|
artikel
|
| 2 |
A color vision inspection system for integrated circuit manufacturing
|
|
|
1993
|
76-77 |
13 |
p. 2071-
1 p.
|
artikel
|
| 3 |
A computer-based model for system level reliability and maintainability allocation
|
|
|
1993
|
76-77 |
13 |
p. 2061-
1 p.
|
artikel
|
| 4 |
A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling
|
|
|
1993
|
76-77 |
13 |
p. 2056-
1 p.
|
artikel
|
| 5 |
Advancing the state of the art in high-performance logic and array technology
|
|
|
1993
|
76-77 |
13 |
p. 2072-
1 p.
|
artikel
|
| 6 |
A four-level VLSI bipolar metallization design with chemical-mechanical planarization
|
|
|
1993
|
76-77 |
13 |
p. 2068-
1 p.
|
artikel
|
| 7 |
A fracture mechanics approach to thermal fatigue life prediction of solder joints
|
|
|
1993
|
76-77 |
13 |
p. 2057-
1 p.
|
artikel
|
| 8 |
A generalization of consecutive-k-out-of-n:F systems
|
|
|
1993
|
76-77 |
13 |
p. 2064-
1 p.
|
artikel
|
| 9 |
A method of threshold voltage and current gain factor estimation for CMOS IC input transistors
|
Pidin, S.
|
|
1993
|
76-77 |
13 |
p. 2047-2052
6 p.
|
artikel
|
| 10 |
A method to estimate the acceleration factor for subassemblies
|
|
|
1993
|
76-77 |
13 |
p. 2056-
1 p.
|
artikel
|
| 11 |
An ad hoc query interface for IC-CIM databases
|
|
|
1993
|
76-77 |
13 |
p. 2065-
1 p.
|
artikel
|
| 12 |
Analysis of a conceptual automated rework facility for printed wiring assembly manufacturing systems
|
|
|
1993
|
76-77 |
13 |
p. 2058-
1 p.
|
artikel
|
| 13 |
Analysis of microwave scattering from semiconductor wafers
|
|
|
1993
|
76-77 |
13 |
p. 2072-2073
2 p.
|
artikel
|
| 14 |
An architecture for the development of real-time fault diagnosis systems using model-based reasoning
|
|
|
1993
|
76-77 |
13 |
p. 2061-
1 p.
|
artikel
|
| 15 |
An improved lower bound for the right tail of the reliability function under a type-two censoring plan
|
Arsham, H.
|
|
1993
|
76-77 |
13 |
p. 2031-2038
8 p.
|
artikel
|
| 16 |
A novel multichip module assembly approach using gold ball flip-chip bonding
|
|
|
1993
|
76-77 |
13 |
p. 2066-
1 p.
|
artikel
|
| 17 |
Application of electron and ion beam analysis techniques to microelectronics
|
|
|
1993
|
76-77 |
13 |
p. 2075-
1 p.
|
artikel
|
| 18 |
Approximation for the variance of the waiting time in a GI/G/1 queue
|
Bhat, Vasanthakumar N.
|
|
1993
|
76-77 |
13 |
p. 1997-2002
6 p.
|
artikel
|
| 19 |
A proposed magnetically enhanced reactive ion etcher for ULSI
|
|
|
1993
|
76-77 |
13 |
p. 2074-
1 p.
|
artikel
|
| 20 |
A semi-analytical method to predict printed circuit board package temperatures
|
|
|
1993
|
76-77 |
13 |
p. 2057-
1 p.
|
artikel
|
| 21 |
A simple microwave method for monitoring the conductivity of semiconductor epitaxial layers
|
|
|
1993
|
76-77 |
13 |
p. 2072-
1 p.
|
artikel
|
| 22 |
A simplified life estimation for LSI plastic package on thermal shock testing
|
|
|
1993
|
76-77 |
13 |
p. 2058-
1 p.
|
artikel
|
| 23 |
A statistical approach to quality control of non-normal lithographical overlay distributions
|
|
|
1993
|
76-77 |
13 |
p. 2064-
1 p.
|
artikel
|
| 24 |
A study of how to estimate contact reliability of connectors
|
|
|
1993
|
76-77 |
13 |
p. 2058-
1 p.
|
artikel
|
| 25 |
A study of long time reliability test of mold-encapsulated ICs
|
|
|
1993
|
76-77 |
13 |
p. 2058-
1 p.
|
artikel
|
| 26 |
A study of the effect of ultrasonic cleaning on component quality—hybrid devices
|
|
|
1993
|
76-77 |
13 |
p. 2066-
1 p.
|
artikel
|
| 27 |
Availability of consecutive-k-out-of-n:F system
|
|
|
1993
|
76-77 |
13 |
p. 2062-2063
2 p.
|
artikel
|
| 28 |
Availability of systems with two failure states
|
|
|
1993
|
76-77 |
13 |
p. 2063-2064
2 p.
|
artikel
|
| 29 |
Bayes shrinkage estimation of reliability and the parameters of a finite range failure time model
|
Pandey, M.
|
|
1993
|
76-77 |
13 |
p. 2039-2042
4 p.
|
artikel
|
| 30 |
Bipolar VLSI—an application for a high-performance microcontroller
|
|
|
1993
|
76-77 |
13 |
p. 2071-
1 p.
|
artikel
|
| 31 |
Bond wireless multichip packaging technology for high-speed circuits
|
|
|
1993
|
76-77 |
13 |
p. 2067-
1 p.
|
artikel
|
| 32 |
Case study of Bayes parameter estimation of exponential distribution
|
|
|
1993
|
76-77 |
13 |
p. 2060-
1 p.
|
artikel
|
| 33 |
CCD, multi-chip innovations evoke echoes of past
|
|
|
1993
|
76-77 |
13 |
p. 2065-
1 p.
|
artikel
|
| 34 |
Characterization and modelling of packages by a time-domain reflectometry approach
|
|
|
1993
|
76-77 |
13 |
p. 2069-
1 p.
|
artikel
|
| 35 |
Chip capacitors meet size, reliability requirements
|
|
|
1993
|
76-77 |
13 |
p. 2056-2057
2 p.
|
artikel
|
| 36 |
Comparison of N-MOSFET lifetime estimates based on GIDL enhancement and transconductance degradation as criteria
|
|
|
1993
|
76-77 |
13 |
p. 2059-
1 p.
|
artikel
|
| 37 |
Comparison of plastic and hermetic microcircuits under temperature cycling and temperature humidity bias
|
|
|
1993
|
76-77 |
13 |
p. 2058-
1 p.
|
artikel
|
| 38 |
Compensating effects in time-dependent dielectric breakdown
|
|
|
1993
|
76-77 |
13 |
p. 2056-
1 p.
|
artikel
|
| 39 |
Computer aided reliability modelling and applications in semiconductor manufacturing
|
|
|
1993
|
76-77 |
13 |
p. 2059-
1 p.
|
artikel
|
| 40 |
Concurrent thermal designs of PCBs: balancing accuracy with time constraints
|
|
|
1993
|
76-77 |
13 |
p. 2057-
1 p.
|
artikel
|
| 41 |
Conductance fluctuations in solids caused by defect migration
|
|
|
1993
|
76-77 |
13 |
p. 2073-
1 p.
|
artikel
|
| 42 |
Control of batch processing systems in semiconductor wafer fabrication facilities
|
|
|
1993
|
76-77 |
13 |
p. 2057-
1 p.
|
artikel
|
| 43 |
Design and evaluation of fault-tolerant 32-Bis microcomputer system
|
|
|
1993
|
76-77 |
13 |
p. 2062-
1 p.
|
artikel
|
| 44 |
Designing a custom VLSI moment invariant data signal processor
|
|
|
1993
|
76-77 |
13 |
p. 2071-2072
2 p.
|
artikel
|
| 45 |
Designing for maintainability: computerized human models
|
|
|
1993
|
76-77 |
13 |
p. 2055-
1 p.
|
artikel
|
| 46 |
Deterministic reliability-modeling of dynamic redundancy
|
|
|
1993
|
76-77 |
13 |
p. 2064-
1 p.
|
artikel
|
| 47 |
Development and analysis of an automated test system for the thermal characterization of IC packaging technologies
|
|
|
1993
|
76-77 |
13 |
p. 2070-
1 p.
|
artikel
|
| 48 |
Device interconnection technology for advanced thermal conduction modules
|
|
|
1993
|
76-77 |
13 |
p. 2071-
1 p.
|
artikel
|
| 49 |
Diagnosing mixed-signal board failures
|
|
|
1993
|
76-77 |
13 |
p. 2059-
1 p.
|
artikel
|
| 50 |
Digital characteristics of a CMOS ternary inverter at the liquid nitrogen temperature
|
Srivastava, A.
|
|
1993
|
76-77 |
13 |
p. 1957-1962
6 p.
|
artikel
|
| 51 |
Dose perturbation by wafer charging during ion implantation
|
|
|
1993
|
76-77 |
13 |
p. 2074-2075
2 p.
|
artikel
|
| 52 |
Dépôts de nitrure de silicium et de silice par méthode photochimique. Passivation de la surface d'InP par (NH4)2 S x . Application au MISFET-InP
|
|
|
1993
|
76-77 |
13 |
p. 2073-2074
2 p.
|
artikel
|
| 53 |
Dynamic fault-tree models for fault-tolerant computer systems
|
|
|
1993
|
76-77 |
13 |
p. 2060-2061
2 p.
|
artikel
|
| 54 |
Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronic devices
|
|
|
1993
|
76-77 |
13 |
p. 2069-
1 p.
|
artikel
|
| 55 |
Effects of oxygen implantation in GaAs
|
|
|
1993
|
76-77 |
13 |
p. 2075-
1 p.
|
artikel
|
| 56 |
Efficient computation of the sensitivity of k-out-of-n system reliability
|
Rushdi, Ali M.
|
|
1993
|
76-77 |
13 |
p. 1963-1979
17 p.
|
artikel
|
| 57 |
Encapsulant for nonhermetic multichip packaging applications
|
|
|
1993
|
76-77 |
13 |
p. 2066-
1 p.
|
artikel
|
| 58 |
Estimation of a composite hazard rate model
|
Ananda, Malwane M.A.
|
|
1993
|
76-77 |
13 |
p. 2013-2019
7 p.
|
artikel
|
| 59 |
Estimation of reliability in a multicomponent stress-strength model
|
Borhan Uddin, Md.
|
|
1993
|
76-77 |
13 |
p. 2043-2046
4 p.
|
artikel
|
| 60 |
Evaluation of manufacturing variables in the reliability of surface mount capacitors
|
|
|
1993
|
76-77 |
13 |
p. 2059-
1 p.
|
artikel
|
| 61 |
Expert judgement in maintenance optimization
|
|
|
1993
|
76-77 |
13 |
p. 2064-
1 p.
|
artikel
|
| 62 |
Failure analysis of semiconductor by infrared emission microscope
|
|
|
1993
|
76-77 |
13 |
p. 2058-
1 p.
|
artikel
|
| 63 |
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution
|
|
|
1993
|
76-77 |
13 |
p. 2067-
1 p.
|
artikel
|
| 64 |
Integrated circuitry produces compact solid-state relays
|
|
|
1993
|
76-77 |
13 |
p. 2057-
1 p.
|
artikel
|
| 65 |
Integrated processing for microelectronics science and technology
|
|
|
1993
|
76-77 |
13 |
p. 2065-
1 p.
|
artikel
|
| 66 |
Intelligent fault isolation and diagnosis for communication satellite systems
|
|
|
1993
|
76-77 |
13 |
p. 2062-
1 p.
|
artikel
|
| 67 |
Investigation of conduction mechanism in thick film resistors trimmed by the pulse voltage method
|
|
|
1993
|
76-77 |
13 |
p. 2074-
1 p.
|
artikel
|
| 68 |
MAG-EX: a magnetics fabrication expert system focusing expert systems technology on improving quality control
|
|
|
1993
|
76-77 |
13 |
p. 2060-
1 p.
|
artikel
|
| 69 |
Makers accelerate speed of chip mounters
|
|
|
1993
|
76-77 |
13 |
p. 2067-
1 p.
|
artikel
|
| 70 |
Makers develop dense chip mounting for IC memory cards
|
|
|
1993
|
76-77 |
13 |
p. 2071-
1 p.
|
artikel
|
| 71 |
Manufacturability of rapid-thermal oxidation of silicon: oxide thickness, oxide thickness variation, and system dependency
|
|
|
1993
|
76-77 |
13 |
p. 2073-
1 p.
|
artikel
|
| 72 |
Maximum likelihood estimation of Weibull parameters in a renewal process based on remaining life from a specified time
|
|
|
1993
|
76-77 |
13 |
p. 2063-
1 p.
|
artikel
|
| 73 |
Modification of “SPICE” for simulation of coupled packaging interconnections
|
|
|
1993
|
76-77 |
13 |
p. 2070-2071
2 p.
|
artikel
|
| 74 |
Multichip routing and placement
|
|
|
1993
|
76-77 |
13 |
p. 2066-
1 p.
|
artikel
|
| 75 |
Numerical modeling of advanced semiconductor devices
|
|
|
1993
|
76-77 |
13 |
p. 2055-2056
2 p.
|
artikel
|
| 76 |
On comparison of MTBF between four redundant systems
|
Meng, Fan Chin
|
|
1993
|
76-77 |
13 |
p. 1987-1990
4 p.
|
artikel
|
| 77 |
On some basic notions of stochastic multiobjective programming problems with random parameters in the constraints
|
El-Banna, Abou-Zaid H.
|
|
1993
|
76-77 |
13 |
p. 1981-1986
6 p.
|
artikel
|
| 78 |
On the common-emitter breakdown voltage of bipolar junction transistors
|
|
|
1993
|
76-77 |
13 |
p. 2072-
1 p.
|
artikel
|
| 79 |
On the introduction of fuzzy inference to reliability analysis method
|
|
|
1993
|
76-77 |
13 |
p. 2064-
1 p.
|
artikel
|
| 80 |
Optimal design of partially accelerated life tests for the exponential distribution under type-I censoring
|
|
|
1993
|
76-77 |
13 |
p. 2065-
1 p.
|
artikel
|
| 81 |
Optimum simple ramp-tests for the Weibull distribution and type I censoring
|
|
|
1993
|
76-77 |
13 |
p. 2061-2062
2 p.
|
artikel
|
| 82 |
Overview of packaging for the IBM enterprise system/9000 based on the glass-ceramic copper/thin film thermal conduction module
|
|
|
1993
|
76-77 |
13 |
p. 2069-
1 p.
|
artikel
|
| 83 |
Packaging technology for the NEC SX-3 Supercomputers
|
|
|
1993
|
76-77 |
13 |
p. 2069-
1 p.
|
artikel
|
| 84 |
Performability of integrated software-hardware components of real-time parallel and distributed systems
|
|
|
1993
|
76-77 |
13 |
p. 2060-
1 p.
|
artikel
|
| 85 |
Plasma-based dry etching techniques in the silicon integrated circuit technology
|
|
|
1993
|
76-77 |
13 |
p. 2069-2070
2 p.
|
artikel
|
| 86 |
Predicting software errors, during development, using nonlinear regression models: a comparative study
|
|
|
1993
|
76-77 |
13 |
p. 2061-
1 p.
|
artikel
|
| 87 |
Publications, notices, calls for papers, etc.
|
|
|
1993
|
76-77 |
13 |
p. 2077-
1 p.
|
artikel
|
| 88 |
Quality process modelling; continuous electrical resistance annealing of copper wire
|
|
|
1993
|
76-77 |
13 |
p. 2059-
1 p.
|
artikel
|
| 89 |
Rapid integrated-circuit reliability simulation and its application to testing
|
|
|
1993
|
76-77 |
13 |
p. 2056-
1 p.
|
artikel
|
| 90 |
Redundant task-allocation in multicomputer systems
|
|
|
1993
|
76-77 |
13 |
p. 2065-
1 p.
|
artikel
|
| 91 |
Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages
|
|
|
1993
|
76-77 |
13 |
p. 2068-2069
2 p.
|
artikel
|
| 92 |
Reliability of a consecutive k-out-of-r-from-n:F system
|
|
|
1993
|
76-77 |
13 |
p. 2060-
1 p.
|
artikel
|
| 93 |
Reliability of surface mount electronics assemblies cleaned using CFC-113-free techniques
|
|
|
1993
|
76-77 |
13 |
p. 2066-2067
2 p.
|
artikel
|
| 94 |
Reliability optimization of systems by a surrogate-constraints algorithm
|
|
|
1993
|
76-77 |
13 |
p. 2063-
1 p.
|
artikel
|
| 95 |
Reliability theory for large linear systems with helping neighbours
|
|
|
1993
|
76-77 |
13 |
p. 2060-
1 p.
|
artikel
|
| 96 |
Renewal approximations of the doubly stochastic Poisson processes
|
Bhat, Vasanthakumar N.
|
|
1993
|
76-77 |
13 |
p. 1991-1996
6 p.
|
artikel
|
| 97 |
Rigorous theory and simplified model of the band-to-band tunneling in silicon
|
|
|
1993
|
76-77 |
13 |
p. 2073-
1 p.
|
artikel
|
| 98 |
SAMPAN: an expert system architecture for maintenance of Alcatel 1000 E10 exchanges
|
|
|
1993
|
76-77 |
13 |
p. 2062-
1 p.
|
artikel
|
| 99 |
Simulation of ultra thin film SOI transistors using a non-local ballistic model for impact ionisation
|
|
|
1993
|
76-77 |
13 |
p. 2075-
1 p.
|
artikel
|
| 100 |
S-parameter-based IC interconnect transmission line characterization
|
|
|
1993
|
76-77 |
13 |
p. 2070-
1 p.
|
artikel
|
| 101 |
Stress-induced dislocations in silicon integrated circuits
|
|
|
1993
|
76-77 |
13 |
p. 2059-
1 p.
|
artikel
|
| 102 |
Surface mounting technology adapts to new environment
|
|
|
1993
|
76-77 |
13 |
p. 2067-
1 p.
|
artikel
|
| 103 |
Targeting zero-defect manufacturing
|
|
|
1993
|
76-77 |
13 |
p. 2060-
1 p.
|
artikel
|
| 104 |
The closeness for {NBU} and {NWU}
|
Hai-Yan, Gu
|
|
1993
|
76-77 |
13 |
p. 2053-2054
2 p.
|
artikel
|
| 105 |
Thermal analysis of a substrate with power dissipation in the vias
|
|
|
1993
|
76-77 |
13 |
p. 2068-
1 p.
|
artikel
|
| 106 |
Thermal enhancements for a thin film chip carrier
|
|
|
1993
|
76-77 |
13 |
p. 2069-
1 p.
|
artikel
|
| 107 |
Thermal resistance simulation of IC packages using a three-dimensional boundary element method
|
|
|
1993
|
76-77 |
13 |
p. 2066-
1 p.
|
artikel
|
| 108 |
Thermomechanical assessment of plastic coated TAB chips
|
|
|
1993
|
76-77 |
13 |
p. 2067-
1 p.
|
artikel
|
| 109 |
The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules
|
|
|
1993
|
76-77 |
13 |
p. 2068-
1 p.
|
artikel
|
| 110 |
The single chip versus multichip packaging option for digital CMOS in the 1990s
|
|
|
1993
|
76-77 |
13 |
p. 2070-
1 p.
|
artikel
|
| 111 |
Time-domain characterization of interconnect discontinuities in high-speed circuits
|
|
|
1993
|
76-77 |
13 |
p. 2072-
1 p.
|
artikel
|
| 112 |
Training of semiconductor failure analysis engineers
|
|
|
1993
|
76-77 |
13 |
p. 2055-
1 p.
|
artikel
|
| 113 |
Transient thermal gradients across solder interconnections in electronic systems
|
|
|
1993
|
76-77 |
13 |
p. 2056-
1 p.
|
artikel
|
| 114 |
Ultra-dense: an MCM-based three-dimensional digital signal processor
|
|
|
1993
|
76-77 |
13 |
p. 2072-
1 p.
|
artikel
|
| 115 |
Ultra-miniature chip components change mounting methods
|
|
|
1993
|
76-77 |
13 |
p. 2056-
1 p.
|
artikel
|
| 116 |
Ultra-miniature relays must meet rigorous specifications
|
|
|
1993
|
76-77 |
13 |
p. 2059-
1 p.
|
artikel
|
| 117 |
Uncertainty importance of multistate system components
|
Utkin, Lev V.
|
|
1993
|
76-77 |
13 |
p. 2021-2029
9 p.
|
artikel
|
| 118 |
Useful and available RAM data banks
|
Harris, A.P.
|
|
1993
|
76-77 |
13 |
p. 2003-2012
10 p.
|
artikel
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