| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions
|
Wang, Jing
|
|
2017
|
73 |
C |
p. 42-53
12 p.
|
artikel
|
| 2 |
A method to recover critical bits under a double error in SEC-DED protected memories
|
Liu, Shanshan
|
|
2017
|
73 |
C |
p. 92-96
5 p.
|
artikel
|
| 3 |
Assessment of sense measurement duration on BTI degradation in MG/HK CMOS technologies using a novel stacked transistor test structure
|
Kerber, Andreas
|
|
2017
|
73 |
C |
p. 153-157
5 p.
|
artikel
|
| 4 |
Automatic characterisation method for statistical evaluation of tin whisker growth
|
Krammer, Olivér
|
|
2017
|
73 |
C |
p. 14-21
8 p.
|
artikel
|
| 5 |
Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards
|
Verdingovas, Vadimas
|
|
2017
|
73 |
C |
p. 158-166
9 p.
|
artikel
|
| 6 |
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
|
Wang, Mingna
|
|
2017
|
73 |
C |
p. 69-75
7 p.
|
artikel
|
| 7 |
Editorial Board
|
|
|
2017
|
73 |
C |
p. IFC-
1 p.
|
artikel
|
| 8 |
Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application
|
Ghasemi, Seyed Ebrahim
|
|
2017
|
73 |
C |
p. 97-105
9 p.
|
artikel
|
| 9 |
Highly reliable and low-power magnetic full-adder designs for nanoscale technologies
|
Rajaei, Ramin
|
|
2017
|
73 |
C |
p. 129-135
7 p.
|
artikel
|
| 10 |
Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration
|
Wang, Fengjiang
|
|
2017
|
73 |
C |
p. 106-115
10 p.
|
artikel
|
| 11 |
Low-voltage triggering SCRs for ESD protection in a 0.35μm SiGe BiCMOS process
|
JiZhi, Liu
|
|
2017
|
73 |
C |
p. 122-128
7 p.
|
artikel
|
| 12 |
Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing
|
Kim, Cheolgyu
|
|
2017
|
73 |
C |
p. 136-145
10 p.
|
artikel
|
| 13 |
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding
|
Laor, Ari
|
|
2017
|
73 |
C |
p. 60-68
9 p.
|
artikel
|
| 14 |
Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling
|
Suresh Kumar, K.R.
|
|
2017
|
73 |
C |
p. 1-13
13 p.
|
artikel
|
| 15 |
Random telegraph noise in SiGe HBTs: Reliability analysis close to SOA limit
|
Mukherjee, C.
|
|
2017
|
73 |
C |
p. 146-152
7 p.
|
artikel
|
| 16 |
Research on the effect of single-event transient of an on-chip linear voltage regulator fabricated on 130nm commercial CMOS technology
|
Zhao, QiFeng
|
|
2017
|
73 |
C |
p. 116-121
6 p.
|
artikel
|
| 17 |
Similarities of lag phenomena and current collapse in field-plate AlGaN/GaN HEMTs with different types of buffer layers
|
Tsurumaki, Ryouhei
|
|
2017
|
73 |
C |
p. 36-41
6 p.
|
artikel
|
| 18 |
Single event transient effects on charge redistribution SAR ADCs
|
Becker, Thales E.
|
|
2017
|
73 |
C |
p. 22-35
14 p.
|
artikel
|
| 19 |
Static fault localization of subtle metallization defects using near infrared photon emission microscopy
|
Quah, A.C.T.
|
|
2017
|
73 |
C |
p. 76-91
16 p.
|
artikel
|
| 20 |
Thermal impedance measurement of integrated inductors on bulk silicon substrate
|
Kałuża, M.
|
|
2017
|
73 |
C |
p. 54-59
6 p.
|
artikel
|
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