| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Comparison of hydrothermal performance between plate fins and plate-pin fins subject to nanofluid-cooled corrugated miniature heat sinks
|
Khoshvaght-Aliabadi, M.
|
|
2017
|
70 |
C |
p. 84-96
13 p.
|
artikel
|
| 2 |
Corrosion behavior of crystalline silicon solar cells
|
Xiong, Huaping
|
|
2017
|
70 |
C |
p. 49-58
10 p.
|
artikel
|
| 3 |
Editorial Board
|
|
|
2017
|
70 |
C |
p. IFC-
1 p.
|
artikel
|
| 4 |
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging
|
Pan, Yuanxing
|
|
2017
|
70 |
C |
p. 97-102
6 p.
|
artikel
|
| 5 |
Erosion defect formation in Ni-gate AlGaN/GaN high electron mobility transistors
|
Whiting, P.G.
|
|
2017
|
70 |
C |
p. 32-40
9 p.
|
artikel
|
| 6 |
Interacting multiple model particle filter for prognostics of lithium-ion batteries
|
Su, Xiaohong
|
|
2017
|
70 |
C |
p. 59-69
11 p.
|
artikel
|
| 7 |
Investigation of dependence between time-zero and time-dependent variability in high-κ NMOS transistors
|
Hassan, Mohammad Khaled
|
|
2017
|
70 |
C |
p. 22-31
10 p.
|
artikel
|
| 8 |
Mechanism of gate dielectric degradation by hydrogen migration from the cathode interface
|
Higashi, Yusuke
|
|
2017
|
70 |
C |
p. 12-21
10 p.
|
artikel
|
| 9 |
Methods of sequential test optimization in dynamic environment
|
Yang, Chenglin
|
|
2017
|
70 |
C |
p. 112-121
10 p.
|
artikel
|
| 10 |
Nanocrack formation in AlGaN/GaN high electron mobility transistors utilizing Ti/Al/Ni/Au ohmic contacts
|
Whiting, P.G.
|
|
2017
|
70 |
C |
p. 41-48
8 p.
|
artikel
|
| 11 |
[No title]
|
Gan, Chong Leong
|
|
2017
|
70 |
C |
p. 122-123
2 p.
|
artikel
|
| 12 |
Peridynamic wetness approach for moisture concentration analysis in electronic packages
|
Diyaroglu, C.
|
|
2017
|
70 |
C |
p. 103-111
9 p.
|
artikel
|
| 13 |
Prognostics of Li(NiMnCo)O2-based lithium-ion batteries using a novel battery degradation model
|
Yang, Fangfang
|
|
2017
|
70 |
C |
p. 70-78
9 p.
|
artikel
|
| 14 |
Review of silver nanoparticle based die attach materials for high power/temperature applications
|
Paknejad, Seyed Amir
|
|
2017
|
70 |
C |
p. 1-11
11 p.
|
artikel
|
| 15 |
Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection
|
Baïri, A.
|
|
2017
|
70 |
C |
p. 79-83
5 p.
|
artikel
|
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