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101 gevonden resultaten
nr
titel
auteur
tijdschrift
jaar
jaarg.
afl.
pagina('s)
type
1
A comparative glossary of semiconductor devices
1968
7
2
p. 163-
1 p.
artikel
2
Advances in the thick-film compositions
Hille-Dahl, W.A.
1968
7
2
p. 113-116
4 p.
artikel
3
A high-performance lateral geometry transistor for complementary integrated circuits
1968
7
2
p. 172-
1 p.
artikel
4
Alumina substrates for thick-film circuits
Waterfield, B.C.
1968
7
2
p. 117-119
3 p.
artikel
5
A new thermocompression bonder
1968
7
2
p. 170-171
2 p.
artikel
6
An integrated 4GHz balanced transistor amplifier
1968
7
2
p. 171-
1 p.
artikel
7
Anisotropy in layers of anodic oxides of tantalum and titanium
1968
7
2
p. 167-
1 p.
artikel
8
Anisotropy of hot electrons in high resistivity silicon—Preliminary results
1968
7
2
p. 166-
1 p.
artikel
9
Application of quantum defect techniques to photoionization of impurities in semiconductors
1968
7
2
p. 160-
1 p.
artikel
10
A practical tantalum thin-film single-sideband demodulator using RC time-varying and active networks
1968
7
2
p. 171-172
2 p.
artikel
11
Aspects of using infrared for electronic circuit diagnosis
1968
7
2
p. 161-162
2 p.
artikel
12
A survey of epitaxial growth processes and equipment
1968
7
2
p. 166-
1 p.
artikel
13
A thin-film facility for electrical engineering research
1968
7
2
p. 168-
1 p.
artikel
14
Automatic control and monitoring system for thin-film deposition
1968
7
2
p. 169-
1 p.
artikel
15
Automation of micromodule circuit fabrication and testing
1968
7
2
p. 166-
1 p.
artikel
16
A variable-ratio frequency divider using micrologic elements
1968
7
2
p. 172-
1 p.
artikel
17
Batch packaging speeds system assemblies of ICs
1968
7
2
p. 170-
1 p.
artikel
18
Comparison of screen-printed with vacuum-deposited film resistors under thermal cycling environment
Mead, M.R.
1968
7
2
p. 145-146
2 p.
artikel
19
Computer-aided design for integrated circuits
1968
7
2
p. 172-
1 p.
artikel
20
Computer control of the manufacture of electron beam processed microelectronic modules
1968
7
2
p. 173-
1 p.
artikel
21
Concerning the nature and the characteristics of thin dielectric layers prepared by the anodic oxidisation of titanium, tantalum and niobium
1968
7
2
p. 167-
1 p.
artikel
22
Control factors in the manufacture of thick-film circuits
Russell, R.F.
1968
7
2
p. 121-122
2 p.
artikel
23
Dependence of hole velocity upon electric field and hole density for p-type silicon
1968
7
2
p. 167-
1 p.
artikel
24
Deposition of ferrite films by sputtering in a glow discharge
1968
7
2
p. 168-
1 p.
artikel
25
Deposition of silicon dioxide films by the reaction of SiCl4 or SiHCl3 with water vapour
1968
7
2
p. 169-
1 p.
artikel
26
Design and control of a high precision electron beam machine
1968
7
2
p. 173-
1 p.
artikel
27
Design for maintainability with particular reference to domestic radio and television receivers
1968
7
2
p. 161-
1 p.
artikel
28
Destructive reverse breakdown in large area phosphorus diffused high voltage silicon n+p junctions
1968
7
2
p. 160-
1 p.
artikel
29
Detecting metal particles in semiconductor device housings
1968
7
2
p. 160-
1 p.
artikel
30
Developing the quality assurance requirements for a custom thin-film circuit program
1968
7
2
p. 162-
1 p.
artikel
31
Diborane for boron diffusion into silicon
1968
7
2
p. 165-
1 p.
artikel
32
Dielectrically isolated silicon with a sharp impurity gradient
1968
7
2
p. 165-
1 p.
artikel
33
Dynamic mechanism reliability by Monte Carlo methods
1968
7
2
p. 161-
1 p.
artikel
34
Effective mass and intrinsic concentration in silicon
1968
7
2
p. 166-
1 p.
artikel
35
Effect of diffused oxygen and gold on surface properties of oxidized silicon
1968
7
2
p. 164-165
2 p.
artikel
36
Effects of ionizing radiation on oxidized silicon surfaces and planar devices
1968
7
2
p. 165-
1 p.
artikel
37
Electrical contacts: research and reliability
1968
7
2
p. 159-
1 p.
artikel
38
Electron beam heating of a thin film on a highly conducting substrate
1968
7
2
p. 173-
1 p.
artikel
39
Electron beam induced potential contrast on unbiased planar transistors
1968
7
2
p. 173-
1 p.
artikel
40
Electron beam welding in the manufacture of electronic components
1968
7
2
p. 174-
1 p.
artikel
41
Estimation of temperature rise in electron beam heating of thin films
1968
7
2
p. 174-
1 p.
artikel
42
Evaporated silicon thin-film transistors
1968
7
2
p. 169-170
2 p.
artikel
43
First unofficial thick-film symposium
1968
7
2
p. 111-
1 p.
artikel
44
IC trends in the U.S.A.
1968
7
2
p. 162-
1 p.
artikel
45
Infrared evaluation of microweld quality
1968
7
2
p. 159-
1 p.
artikel
46
Integrated circuit design analysis by digital computer
1968
7
2
p. 171-
1 p.
artikel
47
Integrated circuit reliability
1968
7
2
p. 161-
1 p.
artikel
48
Integrated-circuit reliability: myth or fact?
1968
7
2
p. 162-
1 p.
artikel
49
Integrated electronics—II. Design ingenuity is the key to success
1968
7
2
p. 163-
1 p.
artikel
50
Integrated electronics—III. Hybrid technology wins a foothold
1968
7
2
p. 163-
1 p.
artikel
51
Integrated electronics—II. Power grab by linear ICs
1968
7
2
p. 164-
1 p.
artikel
52
Integrated electronics—I. Linear ICs: Part 2. Heart of the matter
1968
7
2
p. 164-
1 p.
artikel
53
Integrated electronics—I. Scrambling for linear IC business
1968
7
2
p. 163-
1 p.
artikel
54
Integrated electronics: Microwave IC's come of age
1968
7
2
p. 163-164
2 p.
artikel
55
Interconnection and packaging of microelectronics
1968
7
2
p. 171-
1 p.
artikel
56
Interconnexions for semiconductor integrated circuits used in digital systems
Bingham, K.C.
1968
7
2
p. 155-156
2 p.
artikel
57
Ion implantation as a production technique
1968
7
2
p. 173-174
2 p.
artikel
58
Large-scale integration: A complex array of problems
1968
7
2
p. 163-
1 p.
artikel
59
Laser beams and integrated circuits
1968
7
2
p. 163-
1 p.
artikel
60
Low energy sputtering of resistive films
1968
7
2
p. 170-
1 p.
artikel
61
LSI—Today and tomorrow
1968
7
2
p. 163-
1 p.
artikel
62
Major causes of equipment unreliability
1968
7
2
p. 161-
1 p.
artikel
63
Making microcircuits
1968
7
2
p. 163-
1 p.
artikel
64
Measurement of diffusion-induced strains at metal bond interfaces
1968
7
2
p. 166-
1 p.
artikel
65
Measurement of film thickness
1968
7
2
p. 168-
1 p.
artikel
66
Measurement of the microwave properties of substrate-supported semiconducting films
1968
7
2
p. 168-
1 p.
artikel
67
Memory on a chip: a step toward large-scale integration
1968
7
2
p. 172-
1 p.
artikel
68
Microscopy for semiconductors
1968
7
2
p. 162-
1 p.
artikel
69
Monolithic IC techniques produce first all-silicon X-band switch
1968
7
2
p. 172-
1 p.
artikel
70
MOS transistors integrated circuits
1968
7
2
p. 165-166
2 p.
artikel
71
Plated through holes: a reliability assessment
1968
7
2
p. 159-160
2 p.
artikel
72
Preparation of GaAs surfaces for epitaxial deposition
1968
7
2
p. 166-
1 p.
artikel
73
Printing variables and their effects on thick films
Finch, R.G.
1968
7
2
p. 127-130
4 p.
artikel
74
Quality failure cost analysis
1968
7
2
p. 162-
1 p.
artikel
75
RC active filters realized with operational integrated amplifiers
1968
7
2
p. 172-
1 p.
artikel
76
Reliability and drift behavior of resistors (Part 3)
1968
7
2
p. 159-
1 p.
artikel
77
Reliability and stability of miniature polystyrene capacitors
1968
7
2
p. 159-
1 p.
artikel
78
Reliability of a domestic wireless receiver
1968
7
2
p. 162-
1 p.
artikel
79
Screen printed capacitor dielectrics
Hoffman, L.C.
1968
7
2
p. 131-134
4 p.
artikel
80
Second-breakdown tests for germanium-transistor reliability
1968
7
2
p. 159-
1 p.
artikel
81
Semiconductor films
1968
7
2
p. 169-
1 p.
artikel
82
Silicon diode breakdown in the transition range between avalanche effect and field emission
1968
7
2
p. 160-
1 p.
artikel
83
Single crystal InSb thin films by electron beam re-crystallization
1968
7
2
p. 174-
1 p.
artikel
84
Slip and bowing control by advanced etching techniques
1968
7
2
p. 164-
1 p.
artikel
85
Some practical considerations in the fabrication of printed glaze resistors and circuits
1968
7
2
p. 169-
1 p.
artikel
86
Structural and electrical properties of electron beam zone recrystallized indium antimonide thin films
1968
7
2
p. 173-
1 p.
artikel
87
The electron beam fabrication of small geometry transistors
1968
7
2
p. 174-
1 p.
artikel
88
The electron beam scanlaser: Theoretical and operational studies
1968
7
2
p. 174-
1 p.
artikel
89
The interconnexion challenge
1968
7
2
p. 163-
1 p.
artikel
90
The measurement of protective film thickness on silicon wafers by reflectance spectrophotometry
1968
7
2
p. 167-
1 p.
artikel
91
The preparation and application of tantalum thin-film passive components
1968
7
2
p. 170-
1 p.
artikel
92
The Si-SiO2 interface—Electrical properties as determined by the metal-insulator-silicon-conductance technique
1968
7
2
p. 164-
1 p.
artikel
93
The structure and sintering of polycrystalline evaporated metal films
1968
7
2
p. 168-
1 p.
artikel
94
The study of surface properties of thin Ge films using a piezoelectric mass detector
1968
7
2
p. 168-
1 p.
artikel
95
The substitution of semiconductor circuits for inductances
1968
7
2
p. 164-
1 p.
artikel
96
Thin-film magnetoresistive devices
1968
7
2
p. 168-169
2 p.
artikel
97
Two statistical evaluation criteria for predicting performance of microelectronic circuits
1968
7
2
p. 171-
1 p.
artikel
98
Variables affecting uniformity in the screen process printing of printed and fired-on films and the development of a squeegee design for improving uniformity
Hughes Jr., Daniel C.
1968
7
2
p. 137-143
7 p.
artikel
99
Welding electronic devices by ultrasonics
1968
7
2
p. 171-
1 p.
artikel
100
Zener and avalanche breakdown in silicon alloyed p−n junctions—I. Analysis of reverse characteristics
1968
7
2
p. 160-
1 p.
artikel
101
Zener and avalanche breakdown in silicon alloyed p−n junctions—II. Effect of temperature on the reverse characteristics and criteria for distinguishing between the two breakdown mechanisms
1968
7
2
p. 161-
1 p.
artikel
101 gevonden resultaten
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