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                             101 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A comparative glossary of semiconductor devices 1968
7 2 p. 163-
1 p.
artikel
2 Advances in the thick-film compositions Hille-Dahl, W.A.
1968
7 2 p. 113-116
4 p.
artikel
3 A high-performance lateral geometry transistor for complementary integrated circuits 1968
7 2 p. 172-
1 p.
artikel
4 Alumina substrates for thick-film circuits Waterfield, B.C.
1968
7 2 p. 117-119
3 p.
artikel
5 A new thermocompression bonder 1968
7 2 p. 170-171
2 p.
artikel
6 An integrated 4GHz balanced transistor amplifier 1968
7 2 p. 171-
1 p.
artikel
7 Anisotropy in layers of anodic oxides of tantalum and titanium 1968
7 2 p. 167-
1 p.
artikel
8 Anisotropy of hot electrons in high resistivity silicon—Preliminary results 1968
7 2 p. 166-
1 p.
artikel
9 Application of quantum defect techniques to photoionization of impurities in semiconductors 1968
7 2 p. 160-
1 p.
artikel
10 A practical tantalum thin-film single-sideband demodulator using RC time-varying and active networks 1968
7 2 p. 171-172
2 p.
artikel
11 Aspects of using infrared for electronic circuit diagnosis 1968
7 2 p. 161-162
2 p.
artikel
12 A survey of epitaxial growth processes and equipment 1968
7 2 p. 166-
1 p.
artikel
13 A thin-film facility for electrical engineering research 1968
7 2 p. 168-
1 p.
artikel
14 Automatic control and monitoring system for thin-film deposition 1968
7 2 p. 169-
1 p.
artikel
15 Automation of micromodule circuit fabrication and testing 1968
7 2 p. 166-
1 p.
artikel
16 A variable-ratio frequency divider using micrologic elements 1968
7 2 p. 172-
1 p.
artikel
17 Batch packaging speeds system assemblies of ICs 1968
7 2 p. 170-
1 p.
artikel
18 Comparison of screen-printed with vacuum-deposited film resistors under thermal cycling environment Mead, M.R.
1968
7 2 p. 145-146
2 p.
artikel
19 Computer-aided design for integrated circuits 1968
7 2 p. 172-
1 p.
artikel
20 Computer control of the manufacture of electron beam processed microelectronic modules 1968
7 2 p. 173-
1 p.
artikel
21 Concerning the nature and the characteristics of thin dielectric layers prepared by the anodic oxidisation of titanium, tantalum and niobium 1968
7 2 p. 167-
1 p.
artikel
22 Control factors in the manufacture of thick-film circuits Russell, R.F.
1968
7 2 p. 121-122
2 p.
artikel
23 Dependence of hole velocity upon electric field and hole density for p-type silicon 1968
7 2 p. 167-
1 p.
artikel
24 Deposition of ferrite films by sputtering in a glow discharge 1968
7 2 p. 168-
1 p.
artikel
25 Deposition of silicon dioxide films by the reaction of SiCl4 or SiHCl3 with water vapour 1968
7 2 p. 169-
1 p.
artikel
26 Design and control of a high precision electron beam machine 1968
7 2 p. 173-
1 p.
artikel
27 Design for maintainability with particular reference to domestic radio and television receivers 1968
7 2 p. 161-
1 p.
artikel
28 Destructive reverse breakdown in large area phosphorus diffused high voltage silicon n+p junctions 1968
7 2 p. 160-
1 p.
artikel
29 Detecting metal particles in semiconductor device housings 1968
7 2 p. 160-
1 p.
artikel
30 Developing the quality assurance requirements for a custom thin-film circuit program 1968
7 2 p. 162-
1 p.
artikel
31 Diborane for boron diffusion into silicon 1968
7 2 p. 165-
1 p.
artikel
32 Dielectrically isolated silicon with a sharp impurity gradient 1968
7 2 p. 165-
1 p.
artikel
33 Dynamic mechanism reliability by Monte Carlo methods 1968
7 2 p. 161-
1 p.
artikel
34 Effective mass and intrinsic concentration in silicon 1968
7 2 p. 166-
1 p.
artikel
35 Effect of diffused oxygen and gold on surface properties of oxidized silicon 1968
7 2 p. 164-165
2 p.
artikel
36 Effects of ionizing radiation on oxidized silicon surfaces and planar devices 1968
7 2 p. 165-
1 p.
artikel
37 Electrical contacts: research and reliability 1968
7 2 p. 159-
1 p.
artikel
38 Electron beam heating of a thin film on a highly conducting substrate 1968
7 2 p. 173-
1 p.
artikel
39 Electron beam induced potential contrast on unbiased planar transistors 1968
7 2 p. 173-
1 p.
artikel
40 Electron beam welding in the manufacture of electronic components 1968
7 2 p. 174-
1 p.
artikel
41 Estimation of temperature rise in electron beam heating of thin films 1968
7 2 p. 174-
1 p.
artikel
42 Evaporated silicon thin-film transistors 1968
7 2 p. 169-170
2 p.
artikel
43 First unofficial thick-film symposium 1968
7 2 p. 111-
1 p.
artikel
44 IC trends in the U.S.A. 1968
7 2 p. 162-
1 p.
artikel
45 Infrared evaluation of microweld quality 1968
7 2 p. 159-
1 p.
artikel
46 Integrated circuit design analysis by digital computer 1968
7 2 p. 171-
1 p.
artikel
47 Integrated circuit reliability 1968
7 2 p. 161-
1 p.
artikel
48 Integrated-circuit reliability: myth or fact? 1968
7 2 p. 162-
1 p.
artikel
49 Integrated electronics—II. Design ingenuity is the key to success 1968
7 2 p. 163-
1 p.
artikel
50 Integrated electronics—III. Hybrid technology wins a foothold 1968
7 2 p. 163-
1 p.
artikel
51 Integrated electronics—II. Power grab by linear ICs 1968
7 2 p. 164-
1 p.
artikel
52 Integrated electronics—I. Linear ICs: Part 2. Heart of the matter 1968
7 2 p. 164-
1 p.
artikel
53 Integrated electronics—I. Scrambling for linear IC business 1968
7 2 p. 163-
1 p.
artikel
54 Integrated electronics: Microwave IC's come of age 1968
7 2 p. 163-164
2 p.
artikel
55 Interconnection and packaging of microelectronics 1968
7 2 p. 171-
1 p.
artikel
56 Interconnexions for semiconductor integrated circuits used in digital systems Bingham, K.C.
1968
7 2 p. 155-156
2 p.
artikel
57 Ion implantation as a production technique 1968
7 2 p. 173-174
2 p.
artikel
58 Large-scale integration: A complex array of problems 1968
7 2 p. 163-
1 p.
artikel
59 Laser beams and integrated circuits 1968
7 2 p. 163-
1 p.
artikel
60 Low energy sputtering of resistive films 1968
7 2 p. 170-
1 p.
artikel
61 LSI—Today and tomorrow 1968
7 2 p. 163-
1 p.
artikel
62 Major causes of equipment unreliability 1968
7 2 p. 161-
1 p.
artikel
63 Making microcircuits 1968
7 2 p. 163-
1 p.
artikel
64 Measurement of diffusion-induced strains at metal bond interfaces 1968
7 2 p. 166-
1 p.
artikel
65 Measurement of film thickness 1968
7 2 p. 168-
1 p.
artikel
66 Measurement of the microwave properties of substrate-supported semiconducting films 1968
7 2 p. 168-
1 p.
artikel
67 Memory on a chip: a step toward large-scale integration 1968
7 2 p. 172-
1 p.
artikel
68 Microscopy for semiconductors 1968
7 2 p. 162-
1 p.
artikel
69 Monolithic IC techniques produce first all-silicon X-band switch 1968
7 2 p. 172-
1 p.
artikel
70 MOS transistors integrated circuits 1968
7 2 p. 165-166
2 p.
artikel
71 Plated through holes: a reliability assessment 1968
7 2 p. 159-160
2 p.
artikel
72 Preparation of GaAs surfaces for epitaxial deposition 1968
7 2 p. 166-
1 p.
artikel
73 Printing variables and their effects on thick films Finch, R.G.
1968
7 2 p. 127-130
4 p.
artikel
74 Quality failure cost analysis 1968
7 2 p. 162-
1 p.
artikel
75 RC active filters realized with operational integrated amplifiers 1968
7 2 p. 172-
1 p.
artikel
76 Reliability and drift behavior of resistors (Part 3) 1968
7 2 p. 159-
1 p.
artikel
77 Reliability and stability of miniature polystyrene capacitors 1968
7 2 p. 159-
1 p.
artikel
78 Reliability of a domestic wireless receiver 1968
7 2 p. 162-
1 p.
artikel
79 Screen printed capacitor dielectrics Hoffman, L.C.
1968
7 2 p. 131-134
4 p.
artikel
80 Second-breakdown tests for germanium-transistor reliability 1968
7 2 p. 159-
1 p.
artikel
81 Semiconductor films 1968
7 2 p. 169-
1 p.
artikel
82 Silicon diode breakdown in the transition range between avalanche effect and field emission 1968
7 2 p. 160-
1 p.
artikel
83 Single crystal InSb thin films by electron beam re-crystallization 1968
7 2 p. 174-
1 p.
artikel
84 Slip and bowing control by advanced etching techniques 1968
7 2 p. 164-
1 p.
artikel
85 Some practical considerations in the fabrication of printed glaze resistors and circuits 1968
7 2 p. 169-
1 p.
artikel
86 Structural and electrical properties of electron beam zone recrystallized indium antimonide thin films 1968
7 2 p. 173-
1 p.
artikel
87 The electron beam fabrication of small geometry transistors 1968
7 2 p. 174-
1 p.
artikel
88 The electron beam scanlaser: Theoretical and operational studies 1968
7 2 p. 174-
1 p.
artikel
89 The interconnexion challenge 1968
7 2 p. 163-
1 p.
artikel
90 The measurement of protective film thickness on silicon wafers by reflectance spectrophotometry 1968
7 2 p. 167-
1 p.
artikel
91 The preparation and application of tantalum thin-film passive components 1968
7 2 p. 170-
1 p.
artikel
92 The Si-SiO2 interface—Electrical properties as determined by the metal-insulator-silicon-conductance technique 1968
7 2 p. 164-
1 p.
artikel
93 The structure and sintering of polycrystalline evaporated metal films 1968
7 2 p. 168-
1 p.
artikel
94 The study of surface properties of thin Ge films using a piezoelectric mass detector 1968
7 2 p. 168-
1 p.
artikel
95 The substitution of semiconductor circuits for inductances 1968
7 2 p. 164-
1 p.
artikel
96 Thin-film magnetoresistive devices 1968
7 2 p. 168-169
2 p.
artikel
97 Two statistical evaluation criteria for predicting performance of microelectronic circuits 1968
7 2 p. 171-
1 p.
artikel
98 Variables affecting uniformity in the screen process printing of printed and fired-on films and the development of a squeegee design for improving uniformity Hughes Jr., Daniel C.
1968
7 2 p. 137-143
7 p.
artikel
99 Welding electronic devices by ultrasonics 1968
7 2 p. 171-
1 p.
artikel
100 Zener and avalanche breakdown in silicon alloyed p−n junctions—I. Analysis of reverse characteristics 1968
7 2 p. 160-
1 p.
artikel
101 Zener and avalanche breakdown in silicon alloyed p−n junctions—II. Effect of temperature on the reverse characteristics and criteria for distinguishing between the two breakdown mechanisms 1968
7 2 p. 161-
1 p.
artikel
                             101 gevonden resultaten
 
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