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                             32 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 An optimal structural design to improve the reliability of Al2O3–DBC substrates under thermal cycling Xu, Ling
 2016
 56 C p. 101-108
8 p.
 artikel
2 Berkovich nanoindentation on single SiGe epitaxial films Lian, Derming
 2016
 56 C p. 66-72
7 p.
 artikel
3 Bias dependence of TID induced single transistor latch for 0.13μm partially depleted SOI input/output NMOSFETs Fan, Shuang
 2016
 56 C p. 1-9
9 p.
 artikel
4 Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates Parviainen, Anniina
 2016
 56 C p. 114-120
7 p.
 artikel
5 Deep trap-induced dynamic on-resistance degradation in GaN-on-Si power MISHEMTs Sasikumar, A.
 2016
 56 C p. 37-44
8 p.
 artikel
6 Editorial Board 2016
 56 C p. IFC-
1 p.
 artikel
7 Enhanced architectures for soft error detection and correction in combinational and sequential circuits Krstić, Miloš
 2016
 56 C p. 212-220
9 p.
 artikel
8 Evaluation of the corrosion performance of Cu–Al intermetallic compounds and the effect of Pd addition Lim, Adeline B.Y.
 2016
 56 C p. 155-161
7 p.
 artikel
9 Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line Ključar, Luka
 2016
 56 C p. 93-100
8 p.
 artikel
10 Evidence for causality between GaN RF HEMT degradation and the EC-0.57eV trap in GaN Arehart, A.R.
 2016
 56 C p. 45-48
4 p.
 artikel
11 Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging Mustafa, Muhannad
 2016
 56 C p. 136-147
12 p.
 artikel
12 Failure of electrical vias manufactured in thick-film technology when loaded with short high current pulses Ortolino, D.
 2016
 56 C p. 121-128
8 p.
 artikel
13 Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature Zaka, H.
 2016
 56 C p. 85-92
8 p.
 artikel
14 Hot carrier degradation modeling of short-channel n-FinFETs suitable for circuit simulators Messaris, I.
 2016
 56 C p. 10-16
7 p.
 artikel
15 Hot electrons induced degradation in lattice-matched InAlN/GaN high electron mobility transistors Ren, Jian
 2016
 56 C p. 34-36
3 p.
 artikel
16 Implementing Double Error Correction Orthogonal Latin Squares Codes in SRAM-based FPGAs Demirci, Mustafa
 2016
 56 C p. 221-227
7 p.
 artikel
17 Improved interfacial quality of GaAs metal-oxide-semiconductor device with NH3-plasma treated yittrium-oxynitride as interfacial passivation layer Lu, H.H.
 2016
 56 C p. 17-21
5 p.
 artikel
18 Influence of gate oxides with high thermal conductivity on the failure distribution of InGaAs-based MOS stacks Palumbo, Felix
 2016
 56 C p. 22-28
7 p.
 artikel
19 In-situ X-ray μLaue diffraction study of copper through-silicon vias Sanchez, Dario Ferreira
 2016
 56 C p. 78-84
7 p.
 artikel
20 Lattice Boltzmann method study of bga bump arrangements on void formation Abas, Aizat
 2016
 56 C p. 170-181
12 p.
 artikel
21 Low latency radiation tolerant self-repair reconfigurable SRAM architecture Eftaxiopoulos, Nikolaos
 2016
 56 C p. 202-211
10 p.
 artikel
22 Main degradation mechanism in AsTeGeSiN threshold switching devices Choi, Hyun-Sik
 2016
 56 C p. 61-65
5 p.
 artikel
23 Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging Sun, Shuangxi
 2016
 56 C p. 129-135
7 p.
 artikel
24 Monitoring chip fatigue in an IGBT module based on grey relational analysis Zhou, Shengqi
 2016
 56 C p. 49-52
4 p.
 artikel
25 On the shape formation of the droplet epitaxial quantum dots Nemcsics, Ákos
 2016
 56 C p. 73-77
5 p.
 artikel
26 Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis Dušek, K.
 2016
 56 C p. 162-169
8 p.
 artikel
27 Resilient routing implementation in 2D mesh NoC Bishnoi, Rimpy
 2016
 56 C p. 189-201
13 p.
 artikel
28 Study on fatigue life and electrical property of COG assembly under thermal–electric–mechanical coupled loads Gao, Hong
 2016
 56 C p. 148-154
7 p.
 artikel
29 Temperature dependence of the electrical characteristics up to 370K of amorphous In-Ga-ZnO thin film transistors Estrada, M.
 2016
 56 C p. 29-33
5 p.
 artikel
30 The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates Glushko, O.
 2016
 56 C p. 109-113
5 p.
 artikel
31 Thermal characteristics and fabrication of silicon sub-mount based LED package Kim, Young-Pil
 2016
 56 C p. 53-60
8 p.
 artikel
32 Thermal reliability prediction and analysis for high-density electronic systems based on the Markov process Wan, Yi
 2016
 56 C p. 182-188
7 p.
 artikel
                             32 gevonden resultaten
 
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