| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis of dielectric breakdown in CoFeB/MgO/CoFeB magnetic tunnel junction
|
Khan, Ayaz Arif
|
|
2015
|
55 |
6 |
p. 894-902
9 p.
|
artikel
|
| 2 |
Assessing the value of a lead-free solder control plan using cost-based FMEA
|
Lillie, Edwin
|
|
2015
|
55 |
6 |
p. 969-979
11 p.
|
artikel
|
| 3 |
Design, development and reliability testing of a low power bridge-type micromachined hotplate
|
Prasad, Mahanth
|
|
2015
|
55 |
6 |
p. 937-944
8 p.
|
artikel
|
| 4 |
Enhanced power cycling performance of IGBT modules with a reinforced emitter contact
|
Özkol, Emre
|
|
2015
|
55 |
6 |
p. 912-918
7 p.
|
artikel
|
| 5 |
Impact of substrate resistance and layout on passivation etch-induced wafer arcing and reliability
|
Li, Po
|
|
2015
|
55 |
6 |
p. 931-936
6 p.
|
artikel
|
| 6 |
Inside front cover - Editorial board
|
|
|
2015
|
55 |
6 |
p. IFC-
1 p.
|
artikel
|
| 7 |
Low cost and highly reliable radiation hardened latch design in 65nm CMOS technology
|
Qi, Chunhua
|
|
2015
|
55 |
6 |
p. 863-872
10 p.
|
artikel
|
| 8 |
Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions
|
Mirgkizoudi, M.
|
|
2015
|
55 |
6 |
p. 952-960
9 p.
|
artikel
|
| 9 |
Microstructural evolution of ultrasonic-bonded aluminum wires
|
Broll, Marian Sebastian
|
|
2015
|
55 |
6 |
p. 961-968
8 p.
|
artikel
|
| 10 |
Porous low k film with multilayer structure used for promoting adhesion to SiCN cap barrier layer
|
Zhou, M.
|
|
2015
|
55 |
6 |
p. 879-885
7 p.
|
artikel
|
| 11 |
Possible failure modes in Press-Pack IGBTs
|
Tinschert, Lukas
|
|
2015
|
55 |
6 |
p. 903-911
9 p.
|
artikel
|
| 12 |
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test
|
Gallois-Garreignot, Sébastien
|
|
2015
|
55 |
6 |
p. 980-989
10 p.
|
artikel
|
| 13 |
Screening small-delay defects using inter-path correlation to reduce reliability risk
|
García-Gervacio, José L.
|
|
2015
|
55 |
6 |
p. 1005-1011
7 p.
|
artikel
|
| 14 |
Sintered silver finite element modelling and reliability based design optimisation in power electronic module
|
Rajaguru, Pushparajah
|
|
2015
|
55 |
6 |
p. 919-930
12 p.
|
artikel
|
| 15 |
Swarm intelligence driven design space exploration of optimal k-cycle transient fault secured datapath during high level synthesis based on user power–delay budget
|
Sengupta, Anirban
|
|
2015
|
55 |
6 |
p. 990-1004
15 p.
|
artikel
|
| 16 |
The device characteristics of Ir- and Ti-based Schottky gates AlSb/InAs high electron mobility transistors
|
Chiu, Hsien-Chin
|
|
2015
|
55 |
6 |
p. 890-893
4 p.
|
artikel
|
| 17 |
The effect of external stress on the electrical characteristics of AlGaN/GaN HEMTs
|
Liu, Kun
|
|
2015
|
55 |
6 |
p. 886-889
4 p.
|
artikel
|
| 18 |
Total ionizing dose sensitivity of function blocks in FRAM
|
Gu, Ke
|
|
2015
|
55 |
6 |
p. 873-878
6 p.
|
artikel
|
| 19 |
T pattern fuse construction in segment metallized film capacitors based on self-healing characteristics
|
Li, Haoyuan
|
|
2015
|
55 |
6 |
p. 945-951
7 p.
|
artikel
|
| 20 |
What is Electrical Overstress? - Analysis and Conclusions
|
Kaschani, K.T.
|
|
2015
|
55 |
6 |
p. 853-862
10 p.
|
artikel
|
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