nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Accurate reliability analysis of concurrent checking circuits employing an efficient analytical method
|
An, T. |
|
2015 |
55 |
3-4 |
p. 696-703 8 p. |
artikel |
2 |
A dual-rail compact defect-tolerant multiplexer
|
Ben Dhia, A. |
|
2015 |
55 |
3-4 |
p. 662-670 9 p. |
artikel |
3 |
Ageing and thermal recovery of advanced SiGe heterojunction bipolar transistors under long-term mixed-mode and reverse stress conditions
|
Fischer, G.G. |
|
2015 |
55 |
3-4 |
p. 498-507 10 p. |
artikel |
4 |
An accurate closed-expression model for FinFETs parasitic resistance
|
Pereira, A.S.N. |
|
2015 |
55 |
3-4 |
p. 470-480 11 p. |
artikel |
5 |
An efficient BTX sensor based on p-type nanoporous titania thin films
|
Dutta, K. |
|
2015 |
55 |
3-4 |
p. 558-564 7 p. |
artikel |
6 |
An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model
|
George, Elviz |
|
2015 |
55 |
3-4 |
p. 582-587 6 p. |
artikel |
7 |
A return on investment analysis of applying health monitoring to LED lighting systems
|
Chang, Moon-Hwan |
|
2015 |
55 |
3-4 |
p. 527-537 11 p. |
artikel |
8 |
Burnout properties of microwave pulse injected on GaAs PHEMT
|
Zhang, Cunbo |
|
2015 |
55 |
3-4 |
p. 508-513 6 p. |
artikel |
9 |
Characterization and modeling of power MOSFET switching times variations under constant electrical stress
|
Sezgin, Hatice Gül |
|
2015 |
55 |
3-4 |
p. 492-497 6 p. |
artikel |
10 |
Cross-layer investigation of continuous-time sigma–delta modulator under aging effects
|
Cai, Hao |
|
2015 |
55 |
3-4 |
p. 645-653 9 p. |
artikel |
11 |
Degradation behavior by DC-accelerated and pulse-current stress in Co/Cr/Y/Al/Ni co-doped ZnO–PrO1.83-based varistors
|
Nahm, Choon-W. |
|
2015 |
55 |
3-4 |
p. 565-571 7 p. |
artikel |
12 |
Design and analyze of transient-induced latch-up in RS485 transceiver with on-chip TVS
|
Jiang, Qi |
|
2015 |
55 |
3-4 |
p. 637-644 8 p. |
artikel |
13 |
Design of a folded cascode opamp with increased immunity to conducted electromagnetic interference in 0.18μm CMOS
|
Richelli, Anna |
|
2015 |
55 |
3-4 |
p. 654-661 8 p. |
artikel |
14 |
Development of a fast method for optimization of Au ball bond process
|
Gomes, J. |
|
2015 |
55 |
3-4 |
p. 602-607 6 p. |
artikel |
15 |
Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy
|
Yang, Li |
|
2015 |
55 |
3-4 |
p. 596-601 6 p. |
artikel |
16 |
Elimination of stress induced dislocation in deep Poly Sinker LDMOS technology
|
Xu, Xiangming |
|
2015 |
55 |
3-4 |
p. 486-491 6 p. |
artikel |
17 |
Extended Sensor Reliability Evaluation Method in multi-sensor control systems
|
Łęczycki, Paweł |
|
2015 |
55 |
3-4 |
p. 671-678 8 p. |
artikel |
18 |
Fatigue life and resistance analysis of COG assemblies under hygrothermal aging
|
Zhang, Wenguo |
|
2015 |
55 |
3-4 |
p. 623-629 7 p. |
artikel |
19 |
Hot carrier effect on the bipolar transistors’ response to electromagnetic interference
|
Xiong, Cen |
|
2015 |
55 |
3-4 |
p. 514-519 6 p. |
artikel |
20 |
Improving the power cycling performance of IGBT modules by plating the emitter contact
|
Özkol, Emre |
|
2015 |
55 |
3-4 |
p. 552-557 6 p. |
artikel |
21 |
Improving the reliability of the Benes network for use in large-scale systems
|
Jahanshahi, Mohsen |
|
2015 |
55 |
3-4 |
p. 679-695 17 p. |
artikel |
22 |
Inside front cover - Editorial board
|
|
|
2015 |
55 |
3-4 |
p. IFC- 1 p. |
artikel |
23 |
Leakage current study and relevant defect localization in integrated circuit failure analysis
|
Wu, Chunlei |
|
2015 |
55 |
3-4 |
p. 463-469 7 p. |
artikel |
24 |
Maximum pulse current estimation for high accuracy power capability prediction of a Li-Ion battery
|
Lee, Seongjun |
|
2015 |
55 |
3-4 |
p. 572-581 10 p. |
artikel |
25 |
Microstructure, tensile and electrical properties of gold-coated silver bonding wire
|
Tseng, Yi-Wei |
|
2015 |
55 |
3-4 |
p. 608-612 5 p. |
artikel |
26 |
MOSFET channel resistance characterization from the triode region to impact ionization region with the inductive breakdown network
|
Lee, Chie-In |
|
2015 |
55 |
3-4 |
p. 481-485 5 p. |
artikel |
27 |
Real-time fault-tolerance with hot-standby topology for conditional sum adder
|
Mukherjee, Atin |
|
2015 |
55 |
3-4 |
p. 704-712 9 p. |
artikel |
28 |
Reliability of thin films: Experimental study on mechanical and thermal behavior of indium tin oxide and poly(3,4-ethylenedioxythiophene)
|
Alkhazaili, Atif |
|
2015 |
55 |
3-4 |
p. 538-546 9 p. |
artikel |
29 |
Robust dual-direction SCR with low trigger voltage, tunable holding voltage for high-voltage ESD protection
|
Wang, Yang |
|
2015 |
55 |
3-4 |
p. 520-526 7 p. |
artikel |
30 |
Temperature mapping by μ-Raman spectroscopy over cross-section area of power diode in forward biased conditions
|
Kociniewski, T. |
|
2015 |
55 |
3-4 |
p. 547-551 5 p. |
artikel |
31 |
The effect of the echo-time of a bipolar pulse waveform on molten metallic droplet formation by squeeze mode piezoelectric inkjet printing
|
Wu, Cheng-Han |
|
2015 |
55 |
3-4 |
p. 630-636 7 p. |
artikel |
32 |
The fundamentals of thermal-mass diffusion analogy
|
Wong, E.H. |
|
2015 |
55 |
3-4 |
p. 588-595 8 p. |
artikel |
33 |
Vacuum effect on the void formation of the molded underfill process in flip chip packaging
|
Guo, Xue-Ru |
|
2015 |
55 |
3-4 |
p. 613-622 10 p. |
artikel |