| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol–gel derived hybrid layers
|
Kim, Sanwi
|
|
2014
|
54 |
4 |
p. 833-839
7 p.
|
artikel
|
| 2 |
An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact
|
Mattila, T.T.
|
|
2014
|
54 |
4 |
p. 785-795
11 p.
|
artikel
|
| 3 |
A time error model for time-based PWM pixel with correlated double sample in the circumstance of nonlinear response
|
Xu, Jiangtao
|
|
2014
|
54 |
4 |
p. 755-763
9 p.
|
artikel
|
| 4 |
Characterization of interface state density of three-dimensional Si nanostructure by charge pumping measurement
|
Dou, Chunmeng
|
|
2014
|
54 |
4 |
p. 725-729
5 p.
|
artikel
|
| 5 |
Determination of energy and spatial distribution of oxide border traps in In0.53Ga0.47As MOS capacitors from capacitance–voltage characteristics measured at various temperatures
|
Dou, Chunmeng
|
|
2014
|
54 |
4 |
p. 746-754
9 p.
|
artikel
|
| 6 |
Electromigration challenges for advanced on-chip Cu interconnects
|
Li, Baozhen
|
|
2014
|
54 |
4 |
p. 712-724
13 p.
|
artikel
|
| 7 |
Evolution of oxide charge trapping under bias temperature stressing
|
Ang, D.S.
|
|
2014
|
54 |
4 |
p. 663-681
19 p.
|
artikel
|
| 8 |
Fatigue and resistance analysis of COG modules using electro-mechanical coupling method
|
Gao, Hong
|
|
2014
|
54 |
4 |
p. 816-824
9 p.
|
artikel
|
| 9 |
High performance of CNT-interconnects by the multi-layer structure
|
Chiu, Wei-Chih
|
|
2014
|
54 |
4 |
p. 778-784
7 p.
|
artikel
|
| 10 |
2015 IEEE Aerospace Conference
|
|
|
2014
|
54 |
4 |
p. iii-
1 p.
|
artikel
|
| 11 |
Influence of solder bump arrangements on molded IC encapsulation
|
Khor, C.Y.
|
|
2014
|
54 |
4 |
p. 796-807
12 p.
|
artikel
|
| 12 |
Inside front cover - Editorial board
|
|
|
2014
|
54 |
4 |
p. IFC-
1 p.
|
artikel
|
| 13 |
Modelling RTN and BTI in nanoscale MOSFETs from device to circuit: A review
|
Gerrer, L.
|
|
2014
|
54 |
4 |
p. 682-697
16 p.
|
artikel
|
| 14 |
Numerical analysis of thermo-mechanical and mobility effects for 28nm node and beyond: Comparison and design consequences over bumping technologies
|
Fiori, Vincent
|
|
2014
|
54 |
4 |
p. 764-772
9 p.
|
artikel
|
| 15 |
Particle on Bump (POB) technique for ultra-fine pitch chip on glass (COG) applications by conductive particles and adhesives
|
Jia, Lei
|
|
2014
|
54 |
4 |
p. 825-832
8 p.
|
artikel
|
| 16 |
Reliability of washable wearable screen printed UHF RFID tags
|
Virkki, J.
|
|
2014
|
54 |
4 |
p. 840-846
7 p.
|
artikel
|
| 17 |
SET and noise fault tolerant circuit design techniques: Application to 7nm FinFET
|
Calomarde, A.
|
|
2014
|
54 |
4 |
p. 738-745
8 p.
|
artikel
|
| 18 |
Single-trap-induced random telegraph noise for FinFET, Si/Ge Nanowire FET, Tunnel FET, SRAM and logic circuits
|
Fan, Ming-Long
|
|
2014
|
54 |
4 |
p. 698-711
14 p.
|
artikel
|
| 19 |
Total ionizing dose effect in 0.2μm PDSOI NMOSFETs with shallow trench isolation
|
Peng, Chao
|
|
2014
|
54 |
4 |
p. 730-737
8 p.
|
artikel
|
| 20 |
Using active thermography for defects inspection of flip chip
|
Xu, Zhensong
|
|
2014
|
54 |
4 |
p. 808-815
8 p.
|
artikel
|
| 21 |
Void control during plating process and thermal annealing of through-mask electroplated copper interconnects
|
Zhu, Chunsheng
|
|
2014
|
54 |
4 |
p. 773-777
5 p.
|
artikel
|
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