| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An analytical model for read static noise margin including soft oxide breakdown, negative and positive bias temperature instabilities
|
Afzal, Behrouz
|
|
2013
|
53 |
5 |
p. 670-675
6 p.
|
artikel
|
| 2 |
ESD characterization of a 190V LIGBT SOI ESD power clamp structure for plasma display panel applications
|
Jiang, Lingli
|
|
2013
|
53 |
5 |
p. 687-693
7 p.
|
artikel
|
| 3 |
Estimating the average junction temperature of AlGaInP LED arrays by spectral analysis
|
Chen, Keng
|
|
2013
|
53 |
5 |
p. 701-705
5 p.
|
artikel
|
| 4 |
Experimental analysis of Ga2O3:Ti films grown on Si and glass substrates
|
Dakhel, A.A.
|
|
2013
|
53 |
5 |
p. 676-680
5 p.
|
artikel
|
| 5 |
Extending the fatigue life of Pb-free SAC solder joints under thermal cycling
|
Ishikawa, Shoho
|
|
2013
|
53 |
5 |
p. 741-747
7 p.
|
artikel
|
| 6 |
Extraction of noise spectral densities(intrinsic and irradiation contributions) of a charge preamplifier based on JFET
|
Assaf, J.
|
|
2013
|
53 |
5 |
p. 712-717
6 p.
|
artikel
|
| 7 |
Formation of high resistivity phases of nickel silicide at small area
|
Tomita, R.
|
|
2013
|
53 |
5 |
p. 659-664
6 p.
|
artikel
|
| 8 |
High-power silicon P–i–N diode with cathode shorts: The impact of electron irradiation
|
Pína, L.
|
|
2013
|
53 |
5 |
p. 681-686
6 p.
|
artikel
|
| 9 |
Improvement on sheet resistance uniformity of nickel silicide by optimization of silicidation conditions
|
Tomita, R.
|
|
2013
|
53 |
5 |
p. 665-669
5 p.
|
artikel
|
| 10 |
Influence of temperature on the actuation voltage of RF-MEMS switches
|
Mulloni, V.
|
|
2013
|
53 |
5 |
p. 706-711
6 p.
|
artikel
|
| 11 |
Inside front cover - Editorial board
|
|
|
2013
|
53 |
5 |
p. IFC-
1 p.
|
artikel
|
| 12 |
Mechanical shock behavior of Sn–3.9Ag–0.7Cu and Sn–3.9Ag–0.7Cu–0.5Ce solder joints
|
Xie, H.X.
|
|
2013
|
53 |
5 |
p. 733-740
8 p.
|
artikel
|
| 13 |
Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints
|
Wei, Xiao-feng
|
|
2013
|
53 |
5 |
p. 748-754
7 p.
|
artikel
|
| 14 |
PCB drop test lifetime assessment based on simulations and cyclic bend tests
|
Fuchs, P.F.
|
|
2013
|
53 |
5 |
p. 774-781
8 p.
|
artikel
|
| 15 |
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique
|
Chicot, D.
|
|
2013
|
53 |
5 |
p. 761-766
6 p.
|
artikel
|
| 16 |
Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners
|
Chen, Qianwen
|
|
2013
|
53 |
5 |
p. 725-732
8 p.
|
artikel
|
| 17 |
Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method
|
Liao, Chenglong
|
|
2013
|
53 |
5 |
p. 767-773
7 p.
|
artikel
|
| 18 |
The impact of process-induced mechanical stress in narrow width devices and variable-taper CMOS buffer design
|
Alam, Naushad
|
|
2013
|
53 |
5 |
p. 718-724
7 p.
|
artikel
|
| 19 |
Two-dimensional transient simulations of the self-heating effects in GaN-based HEMTs
|
Zhang, Yamin
|
|
2013
|
53 |
5 |
p. 694-700
7 p.
|
artikel
|
| 20 |
Whiskering behaviour of immersion tin surface coating
|
Illés, Balázs
|
|
2013
|
53 |
5 |
p. 755-760
6 p.
|
artikel
|
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