| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A new statistical methodology predicting chip failure probability considering electromigration
|
Sun, Ted
|
|
2013
|
53 |
12 |
p. 1979-1986
8 p.
|
artikel
|
| 2 |
Conduction mechanisms in thermal nitride and dry gate oxides grown on 4H-SiC
|
Ouennoughi, Z.
|
|
2013
|
53 |
12 |
p. 1841-1847
7 p.
|
artikel
|
| 3 |
Controlling of conduction mechanism and electronic parameters of silicon–metal junction by mixed Methylene Blue/2′-7′-dichlorofluorescein
|
Soylu, M.
|
|
2013
|
53 |
12 |
p. 1901-1906
6 p.
|
artikel
|
| 4 |
Degradation mechanism of concentrator solar receivers without protection layer
|
Hong, Hwen-Fen
|
|
2013
|
53 |
12 |
p. 1927-1932
6 p.
|
artikel
|
| 5 |
Degradation of thermal interface materials for high-temperature power electronics applications
|
Skuriat, R.
|
|
2013
|
53 |
12 |
p. 1933-1942
10 p.
|
artikel
|
| 6 |
Delay fault testing using partial multiple scan chains
|
Bareisa, Eduardas
|
|
2013
|
53 |
12 |
p. 2070-2077
8 p.
|
artikel
|
| 7 |
Effect of moisture condensation on long-term reliability of crystalline silicon photovoltaic modules
|
Park, Nochang
|
|
2013
|
53 |
12 |
p. 1922-1926
5 p.
|
artikel
|
| 8 |
Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global–local modeling technique
|
Cinar, Yusuf
|
|
2013
|
53 |
12 |
p. 2043-2051
9 p.
|
artikel
|
| 9 |
Effects of zirconium doping on the characteristics of tin oxide thin film transistors
|
Han, Dong-Suk
|
|
2013
|
53 |
12 |
p. 1875-1878
4 p.
|
artikel
|
| 10 |
Experimental investigation on the performance of CPU coolers: Effect of heat pipe inclination angle and the use of nanofluids
|
Yousefi, T.
|
|
2013
|
53 |
12 |
p. 1954-1961
8 p.
|
artikel
|
| 11 |
Explanation of impact load curve in ball impact test in relation to thermal aging
|
Daito, Tomoya
|
|
2013
|
53 |
12 |
p. 2005-2011
7 p.
|
artikel
|
| 12 |
High temperature physical modeling and verification of a novel 4H-SiC lateral JFET structure
|
Zhong, Xueqian
|
|
2013
|
53 |
12 |
p. 1848-1856
9 p.
|
artikel
|
| 13 |
Impact of bilayer character on High K gate stack dielectrics breakdown obtained by conductive atomic force microscopy
|
Foissac, R.
|
|
2013
|
53 |
12 |
p. 1857-1862
6 p.
|
artikel
|
| 14 |
Influence of channel layer and passivation layer on the stability of amorphous InGaZnO thin film transistors
|
Zhan, Runze
|
|
2013
|
53 |
12 |
p. 1879-1885
7 p.
|
artikel
|
| 15 |
Inside front cover - Editorial board
|
|
|
2013
|
53 |
12 |
p. IFC-
1 p.
|
artikel
|
| 16 |
Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
|
Kuo, Chin-Hung
|
|
2013
|
53 |
12 |
p. 2012-2017
6 p.
|
artikel
|
| 17 |
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test
|
Yoon, Jeong-Won
|
|
2013
|
53 |
12 |
p. 2036-2042
7 p.
|
artikel
|
| 18 |
Large area flexible lighting foils using distributed bare LED dies on polyester substrates
|
van den Ende, D.A.
|
|
2013
|
53 |
12 |
p. 1907-1915
9 p.
|
artikel
|
| 19 |
Lifetime investigation and prediction of metallized polypropylene film capacitors
|
Li, Zhiwei
|
|
2013
|
53 |
12 |
p. 1962-1967
6 p.
|
artikel
|
| 20 |
Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection
|
Noae, Takuya
|
|
2013
|
53 |
12 |
p. 1829-1840
12 p.
|
artikel
|
| 21 |
Long term storage reliability of antifuse field programmable gate arrays
|
Patil, Nishad
|
|
2013
|
53 |
12 |
p. 2052-2056
5 p.
|
artikel
|
| 22 |
[No title]
|
Naikan, Vallayil N.A.
|
|
2013
|
53 |
12 |
p. 2078-
1 p.
|
artikel
|
| 23 |
[No title]
|
Davidović, Vojkan
|
|
2013
|
53 |
12 |
p. 2079-
1 p.
|
artikel
|
| 24 |
On the assessment of voids in the thermal interface material on the thermal performance of a silicon chip package
|
Ramos-Alvarado, Bladimir
|
|
2013
|
53 |
12 |
p. 1987-1995
9 p.
|
artikel
|
| 25 |
Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology
|
Leong, W.C.
|
|
2013
|
53 |
12 |
p. 1996-2004
9 p.
|
artikel
|
| 26 |
Quantum size impacts on the threshold voltage in nanocrystalline silicon thin film transistors
|
Mao, Ling-Feng
|
|
2013
|
53 |
12 |
p. 1886-1890
5 p.
|
artikel
|
| 27 |
Recent advances of nanolead-free solder material for low processing temperature interconnect applications
|
Jiang, Hongjin
|
|
2013
|
53 |
12 |
p. 1968-1978
11 p.
|
artikel
|
| 28 |
Reliable ultra-low-voltage low-power probabilistic-based noise-tolerant latch design
|
Wey, I-Chyn
|
|
2013
|
53 |
12 |
p. 2057-2069
13 p.
|
artikel
|
| 29 |
Sidewall defects of AlGaN/GaN HEMTs evaluated by low frequency noise analysis
|
Chiu, Hsien-Chin
|
|
2013
|
53 |
12 |
p. 1897-1900
4 p.
|
artikel
|
| 30 |
Study on low-Ag content Sn–Ag–Zn/Cu solder joints
|
Luo, Tingbi
|
|
2013
|
53 |
12 |
p. 2018-2029
12 p.
|
artikel
|
| 31 |
Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions
|
Wu, Guanghua
|
|
2013
|
53 |
12 |
p. 2030-2035
6 p.
|
artikel
|
| 32 |
The evaluation for the chromatic characteristics of LED module under electrical and thermal coupling analysis
|
Fu, Han Kuei
|
|
2013
|
53 |
12 |
p. 1916-1921
6 p.
|
artikel
|
| 33 |
Thermal and voltage instabilities of hafnium oxide films prepared by sputtering technique
|
Wong, Hei
|
|
2013
|
53 |
12 |
p. 1863-1867
5 p.
|
artikel
|
| 34 |
Time-dependent dielectric breakdown (TDDB) distribution in n-MOSFET with HfSiON gate dielectrics under DC and AC stressing
|
Hirano, Izumi
|
|
2013
|
53 |
12 |
p. 1868-1874
7 p.
|
artikel
|
| 35 |
Understanding and modeling of internal transient latch-up susceptibility in CMOS inverters due to microwave pulses
|
Chen, Jie
|
|
2013
|
53 |
12 |
p. 1891-1896
6 p.
|
artikel
|
| 36 |
Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation
|
Lin, Nay
|
|
2013
|
53 |
12 |
p. 1943-1953
11 p.
|
artikel
|
Tijdschrift beschrijving