| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A collector current model for InAlAs/InGaAsSb/InGaAs double heterojunction bipolar transistors with non-ideal effects
|
Chang, Yang-Hua
|
|
2012
|
52 |
7 |
p. 1328-1331
4 p.
|
artikel
|
| 2 |
A methodology for accelerated testing by mechanical actuation of MEMS devices
|
McMahon, Michael
|
|
2012
|
52 |
7 |
p. 1382-1388
7 p.
|
artikel
|
| 3 |
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging
|
Weltevreden, E.R.
|
|
2012
|
52 |
7 |
p. 1300-1305
6 p.
|
artikel
|
| 4 |
Analysis of intermittent timing fault vulnerability
|
Kothawade, Saurabh
|
|
2012
|
52 |
7 |
p. 1515-1522
8 p.
|
artikel
|
| 5 |
A numerical procedure for simulating delamination growth on interfaces of interconnect structures
|
Chiu, Tz-Cheng
|
|
2012
|
52 |
7 |
p. 1464-1474
11 p.
|
artikel
|
| 6 |
Burn-in and thermal cyclic tests to determine the short-term reliability of a thin film resistance temperature detector
|
Post, Julian W.
|
|
2012
|
52 |
7 |
p. 1389-1395
7 p.
|
artikel
|
| 7 |
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
|
Hölck, O.
|
|
2012
|
52 |
7 |
p. 1285-1290
6 p.
|
artikel
|
| 8 |
Cu diffusion in Ag-plated Cu leadframe packages
|
Li, Wu-Hu
|
|
2012
|
52 |
7 |
p. 1523-1527
5 p.
|
artikel
|
| 9 |
Degradation of moulding compounds during highly accelerated stress tests – A simple approach to study adhesion by performing button shear tests
|
Pufall, R.
|
|
2012
|
52 |
7 |
p. 1266-1271
6 p.
|
artikel
|
| 10 |
Design, modeling and analysis of highly reliable capacitive microaccelerometer based on circular stepped-plate and small-area touch mode
|
Li, Kai
|
|
2012
|
52 |
7 |
p. 1373-1381
9 p.
|
artikel
|
| 11 |
Developing the stress–strain curve to failure using mesoscale models parameterized from molecular models
|
Iwamoto, Nancy
|
|
2012
|
52 |
7 |
p. 1291-1299
9 p.
|
artikel
|
| 12 |
Development of a standard for transient measurement of junction-to-case thermal resistance
|
Pape, Heinz
|
|
2012
|
52 |
7 |
p. 1272-1278
7 p.
|
artikel
|
| 13 |
Development of high-temperature solders: Review
|
Zeng, Guang
|
|
2012
|
52 |
7 |
p. 1306-1322
17 p.
|
artikel
|
| 14 |
Drop impact reliability of Sn–1.0Ag–0.5Cu BGA interconnects with different mounting methods
|
Wang, Bo
|
|
2012
|
52 |
7 |
p. 1475-1482
8 p.
|
artikel
|
| 15 |
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds
|
Placette, Mark D.
|
|
2012
|
52 |
7 |
p. 1401-1408
8 p.
|
artikel
|
| 16 |
Effect of enhanced-mobility current path on the mobility of AOS TFT
|
Kim, Myung Ju
|
|
2012
|
52 |
7 |
p. 1346-1349
4 p.
|
artikel
|
| 17 |
Effect of interface charge on the dc bias stress-induced deformation and shift of the transfer characteristic of amorphous oxide thin-film transistors
|
Estrada, Magali
|
|
2012
|
52 |
7 |
p. 1342-1345
4 p.
|
artikel
|
| 18 |
Effect of temperature on the capacitance–frequency and conductance–voltage characteristics of polyaniline/p-Si/Al MIS device at high frequencies
|
Aydoğan, Ş.
|
|
2012
|
52 |
7 |
p. 1362-1366
5 p.
|
artikel
|
| 19 |
Effects of single vacancy defect position on the stability of carbon nanotubes
|
Poelma, R.H.
|
|
2012
|
52 |
7 |
p. 1279-1284
6 p.
|
artikel
|
| 20 |
Efficient error detection in Double Error Correction BCH codes for memory applications
|
Reviriego, P.
|
|
2012
|
52 |
7 |
p. 1528-1530
3 p.
|
artikel
|
| 21 |
Electrical characterization of inorganic-on-organic diode based InP and poly(3,4-ethylenedioxithiophene)/poly(styrenesulfonate) (PEDOT:PSS)
|
Enver Aydin, M.
|
|
2012
|
52 |
7 |
p. 1350-1354
5 p.
|
artikel
|
| 22 |
2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
|
Wymysłowski, Artur
|
|
2012
|
52 |
7 |
p. 1253-1254
2 p.
|
artikel
|
| 23 |
Evaluation of creep properties for Sn–Ag–Cu micro solder joint by multi-temperature stress relaxation test
|
Kanda, Yoshihiko
|
|
2012
|
52 |
7 |
p. 1435-1440
6 p.
|
artikel
|
| 24 |
Fabrication and electrical characteristics of Perylene-3,4,9,10-tetracarboxylic dianhydride/p-GaAs diode structure
|
Soylu, Murat
|
|
2012
|
52 |
7 |
p. 1355-1361
7 p.
|
artikel
|
| 25 |
Gate leakage current in GaN-based mesa- and planar-type heterostructure field-effect transistors
|
Kováč, J.
|
|
2012
|
52 |
7 |
p. 1323-1327
5 p.
|
artikel
|
| 26 |
Improved reliability of copper-cored solder joints under a harsh thermal cycling condition
|
Kim, Yunsung
|
|
2012
|
52 |
7 |
p. 1441-1444
4 p.
|
artikel
|
| 27 |
Inside front cover - Editorial board
|
|
|
2012
|
52 |
7 |
p. IFC-
1 p.
|
artikel
|
| 28 |
Interfacial reliability between hot-melt polyamides resin and textile for wearable electronics application
|
Chung, Soon-Wan
|
|
2012
|
52 |
7 |
p. 1501-1510
10 p.
|
artikel
|
| 29 |
Investigation of STI edge effect on programming disturb in localized charge trapping SONOS flash memory cells
|
Xu, Yue
|
|
2012
|
52 |
7 |
p. 1337-1341
5 p.
|
artikel
|
| 30 |
Ionization coefficient of monolayer graphene nanoribbon
|
Ghadiry, Mahdiar
|
|
2012
|
52 |
7 |
p. 1396-1400
5 p.
|
artikel
|
| 31 |
Lifetime predictions of LED-based light bars by accelerated degradation test
|
Wang, Fu-Kwun
|
|
2012
|
52 |
7 |
p. 1332-1336
5 p.
|
artikel
|
| 32 |
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
|
Otiaba, Kenny C.
|
|
2012
|
52 |
7 |
p. 1409-1419
11 p.
|
artikel
|
| 33 |
Optimisation of silver paste for flexography printing on LTCC substrate
|
Faddoul, Rita
|
|
2012
|
52 |
7 |
p. 1483-1491
9 p.
|
artikel
|
| 34 |
Optimization of the bistability property for flexible display by an integrated approach using Taguchi methods, neural networks and genetic algorithms
|
Su, Chao-Ton
|
|
2012
|
52 |
7 |
p. 1492-1500
9 p.
|
artikel
|
| 35 |
Prediction of pad cratering fracture at the copper pad – Printed circuit board interface
|
Nadimpalli, Siva P.V.
|
|
2012
|
52 |
7 |
p. 1454-1463
10 p.
|
artikel
|
| 36 |
Reliability evaluation for single event crosstalk via probabilistic transfer matrix
|
Liu, Baojun
|
|
2012
|
52 |
7 |
p. 1511-1514
4 p.
|
artikel
|
| 37 |
Studies on the reliability of power packages based on strength and fracture criteria
|
Dudek, Rainer
|
|
2012
|
52 |
7 |
p. 1255-1265
11 p.
|
artikel
|
| 38 |
Surface and interface characterization of oxygen plasma activated anodic bonding of glass–ceramics to stainless steel
|
Xiong, Dehua
|
|
2012
|
52 |
7 |
p. 1367-1372
6 p.
|
artikel
|
| 39 |
Testing method for measuring corrosion resistance of surface mount chip resistors
|
Reid, Michael
|
|
2012
|
52 |
7 |
p. 1420-1427
8 p.
|
artikel
|
| 40 |
The performance and fracture mechanism of solder joints under mechanical reliability test
|
Jang, Wei-Luen
|
|
2012
|
52 |
7 |
p. 1428-1434
7 p.
|
artikel
|
| 41 |
The reliability of component boards studied with different shock impact repetition frequencies
|
Hokka, Jussi
|
|
2012
|
52 |
7 |
p. 1445-1453
9 p.
|
artikel
|
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