| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Acceleration of the growth of Cu3Sn voids in solder joints
|
Borgesen, Peter
|
|
2012
|
52 |
6 |
p. 1121-1127
7 p.
|
artikel
|
| 2 |
Adaptive fault-tolerant DVFS with dynamic online AVF prediction
|
Firouzi, Farshad
|
|
2012
|
52 |
6 |
p. 1197-1208
12 p.
|
artikel
|
| 3 |
Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation
|
Zhang, Wenjing
|
|
2012
|
52 |
6 |
p. 1157-1164
8 p.
|
artikel
|
| 4 |
Analysis of reliability and optimization of ESD protection devices supported by modeling and simulation
|
Chvala, A.
|
|
2012
|
52 |
6 |
p. 1031-1038
8 p.
|
artikel
|
| 5 |
A novel method to improve cell endurance window in source-side injection split gate flash memory
|
Tsair, Yong-Shiuan
|
|
2012
|
52 |
6 |
p. 1055-1059
5 p.
|
artikel
|
| 6 |
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages
|
Jang, Kyung-Woon
|
|
2012
|
52 |
6 |
p. 1174-1181
8 p.
|
artikel
|
| 7 |
Challenges and developments of copper wire bonding technology
|
Liu, Peisheng
|
|
2012
|
52 |
6 |
p. 1092-1098
7 p.
|
artikel
|
| 8 |
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
|
Yim, Byung-Seung
|
|
2012
|
52 |
6 |
p. 1165-1173
9 p.
|
artikel
|
| 9 |
Characterization and reliability of nMOSFETs on flexible substrates under mechanical strain
|
Kao, Hsuan-ling
|
|
2012
|
52 |
6 |
p. 999-1004
6 p.
|
artikel
|
| 10 |
Determination of contact parameters of Ni/n-GaP Schottky contacts
|
Duman, S.
|
|
2012
|
52 |
6 |
p. 1005-1011
7 p.
|
artikel
|
| 11 |
Economic design of the mean prognostic distance for canary-equipped electronic systems
|
Wang, Wenbin
|
|
2012
|
52 |
6 |
p. 1086-1091
6 p.
|
artikel
|
| 12 |
Effect of localised charges on nanoscale cylindrical surrounding gate MOSFET: Analog performance and linearity analysis
|
Gautam, Rajni
|
|
2012
|
52 |
6 |
p. 989-994
6 p.
|
artikel
|
| 13 |
Efficient algorithms to accurately compute derating factors of digital circuits
|
Asadi, Hossein
|
|
2012
|
52 |
6 |
p. 1215-1226
12 p.
|
artikel
|
| 14 |
Electrical failure analysis of peristaltic micropumps fabricated with PZT actuators
|
Chen, Bing-Liang
|
|
2012
|
52 |
6 |
p. 1080-1085
6 p.
|
artikel
|
| 15 |
Experimental study of microrectangular groove structure covered with multi mesh layers on performance of flat plate heat pipe for LED lighting module
|
Hsieh, J.C.
|
|
2012
|
52 |
6 |
p. 1071-1079
9 p.
|
artikel
|
| 16 |
Experiment study of dynamic looping process for thermosonic wire bonding
|
Wang, Fuliang
|
|
2012
|
52 |
6 |
p. 1105-1111
7 p.
|
artikel
|
| 17 |
Fault model for on-chip communication and joint equalization and special spacing rules for on-chip bus design
|
Li, Lei
|
|
2012
|
52 |
6 |
p. 1241-1246
6 p.
|
artikel
|
| 18 |
HMM–TLP correlation for system-efficient ESD design
|
Notermans, Guido
|
|
2012
|
52 |
6 |
p. 1012-1019
8 p.
|
artikel
|
| 19 |
Inhomogeneous deformation and microstructure evolution of Sn–Ag-based solder interconnects during thermal cycling and shear testing
|
Chen, Hongtao
|
|
2012
|
52 |
6 |
p. 1112-1120
9 p.
|
artikel
|
| 20 |
Inside front cover - Editorial board
|
|
|
2012
|
52 |
6 |
p. IFC-
1 p.
|
artikel
|
| 21 |
Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM
|
Hurtony, Tamás
|
|
2012
|
52 |
6 |
p. 1138-1142
5 p.
|
artikel
|
| 22 |
Investigation on the thermal behavior of 0.15μm gate-length In0.4Al0.6As/In0.4Ga0.6As MHEMT
|
Lin, Che-Kai
|
|
2012
|
52 |
6 |
p. 969-973
5 p.
|
artikel
|
| 23 |
Low cost and highly reliable hardened latch design for nanoscale CMOS technology
|
Nan, Haiqing
|
|
2012
|
52 |
6 |
p. 1209-1214
6 p.
|
artikel
|
| 24 |
Modeling of noise for p-channel DG-FinFETs
|
Pandit, Srabanti
|
|
2012
|
52 |
6 |
p. 984-988
5 p.
|
artikel
|
| 25 |
Modeling of SET seasoning effects in Phase Change Memory arrays
|
Zambelli, C.
|
|
2012
|
52 |
6 |
p. 1060-1064
5 p.
|
artikel
|
| 26 |
New optimized Dual-Material (DM) gate design to improve the submicron GaN-MESFETs reliability in subthreshold regime
|
Lakhdar, N.
|
|
2012
|
52 |
6 |
p. 958-963
6 p.
|
artikel
|
| 27 |
Nvidia’s GPU failures: A case for prognostics and health management
|
Pecht, Michael
|
|
2012
|
52 |
6 |
p. 953-957
5 p.
|
artikel
|
| 28 |
On thermo-mechanical reliability of plated-through-hole (PTH)
|
Su, Fei
|
|
2012
|
52 |
6 |
p. 1189-1196
8 p.
|
artikel
|
| 29 |
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method
|
Lau, Chun-Sean
|
|
2012
|
52 |
6 |
p. 1143-1152
10 p.
|
artikel
|
| 30 |
Oxide and interface trap densities estimation in ultrathin W/La2O3/Si MOS capacitors
|
Mamatrishat, M.
|
|
2012
|
52 |
6 |
p. 1039-1042
4 p.
|
artikel
|
| 31 |
Physical properties and electrical characteristics of H2O-based and O3-based HfO2 films deposited by ALD
|
Fan, Jibin
|
|
2012
|
52 |
6 |
p. 1043-1049
7 p.
|
artikel
|
| 32 |
Radiation hardened by design techniques to reduce single event transient pulse width based on the physical mechanism
|
Chen, Jianjun
|
|
2012
|
52 |
6 |
p. 1227-1232
6 p.
|
artikel
|
| 33 |
Reflow discoloration formation on pure tin (Sn) surface finish
|
Zeng, Xu
|
|
2012
|
52 |
6 |
p. 1153-1156
4 p.
|
artikel
|
| 34 |
Single event upset mitigation by means of a sequential circuit state freeze
|
Smith, Farouk
|
|
2012
|
52 |
6 |
p. 1233-1240
8 p.
|
artikel
|
| 35 |
Stress immunity enhancement of the SiN uniaxial strained n-channel metal–oxide–semiconductor field-effect-transistor by channel fluorine implantation
|
Chen, Yung-Yu
|
|
2012
|
52 |
6 |
p. 995-998
4 p.
|
artikel
|
| 36 |
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)
|
Suk, Kyoung-Lim
|
|
2012
|
52 |
6 |
p. 1182-1188
7 p.
|
artikel
|
| 37 |
Study of intrinsic characteristics of ESD protection diodes for high-speed I/O applications
|
Yeh, Chih-Ting
|
|
2012
|
52 |
6 |
p. 1020-1030
11 p.
|
artikel
|
| 38 |
Study of the breakdown failure mechanisms for power AlGaN/GaN HEMTs implemented using a RF compatible process
|
Xie, Gang
|
|
2012
|
52 |
6 |
p. 964-968
5 p.
|
artikel
|
| 39 |
Temperature dependent drain current model for Gate Stack Insulated Shallow Extension Silicon On Nothing (ISESON) MOSFET for wide operating temperature range
|
Kumari, Vandana
|
|
2012
|
52 |
6 |
p. 974-983
10 p.
|
artikel
|
| 40 |
Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes
|
Medjahed, Hassen
|
|
2012
|
52 |
6 |
p. 1099-1104
6 p.
|
artikel
|
| 41 |
Uncertainty analysis of solder alloy material parameters estimation based on model calibration method
|
Gang, Jin Hyuk
|
|
2012
|
52 |
6 |
p. 1128-1137
10 p.
|
artikel
|
| 42 |
Variability aware low leakage reliable SRAM cell design technique
|
Islam, A.
|
|
2012
|
52 |
6 |
p. 1247-1252
6 p.
|
artikel
|
| 43 |
W doping effect on the dielectric properties of amorphous Ga2O3 films grown on Si substrate for low-k applications
|
Dakhel, A.A.
|
|
2012
|
52 |
6 |
p. 1050-1054
5 p.
|
artikel
|
| 44 |
Yield enhancement techniques for 3-dimensional random access memories
|
Lu, Shyue-Kung
|
|
2012
|
52 |
6 |
p. 1065-1070
6 p.
|
artikel
|
Tijdschrift beschrijving