nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
ACF particle distribution in COG process
|
Yen, Yee-Wen |
|
2011 |
51 |
3 |
p. 676-684 9 p. |
artikel |
2 |
Acoustic emission for detecting deterioration of capacitors under aging
|
Smulko, Janusz |
|
2011 |
51 |
3 |
p. 621-627 7 p. |
artikel |
3 |
Analyses of electromagnetic vibration-based generators fabricated with LTCC multilayer and silver spring-inducer
|
Lu, W.L. |
|
2011 |
51 |
3 |
p. 610-620 11 p. |
artikel |
4 |
A self-test and dynamics characterization circuit for MEMS electrostatic actuators
|
Fernández, Daniel |
|
2011 |
51 |
3 |
p. 602-609 8 p. |
artikel |
5 |
Characteristics of the intrinsic defects in unintentionally doped 4H–SiC after thermal annealing
|
Cheng, Ping |
|
2011 |
51 |
3 |
p. 572-575 4 p. |
artikel |
6 |
Compact modeling of short-channel effects in symmetric and asymmetric 3-T/4-T double gate MOSFETs
|
Mohammadi, Saeed |
|
2011 |
51 |
3 |
p. 543-549 7 p. |
artikel |
7 |
Current transport mechanisms and trap state investigations in (Ni/Au)–AlN/GaN Schottky barrier diodes
|
Arslan, Engin |
|
2011 |
51 |
3 |
p. 576-580 5 p. |
artikel |
8 |
Cyclic endurance reliability of stretchable electronic substrates
|
Bossuyt, F. |
|
2011 |
51 |
3 |
p. 628-635 8 p. |
artikel |
9 |
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes
|
Tsai, M.Y. |
|
2011 |
51 |
3 |
p. 642-648 7 p. |
artikel |
10 |
Device linearity and intermodulation distortion comparison of dual material gate and conventional AlGaN/GaN high electron mobility transistor
|
Kumar, Sona P. |
|
2011 |
51 |
3 |
p. 587-596 10 p. |
artikel |
11 |
Drain current model for undoped Gate Stack Double Gate (GSDG) MOSFETs including the hot-carrier degradation effects
|
Djeffal, F. |
|
2011 |
51 |
3 |
p. 550-555 6 p. |
artikel |
12 |
Edge current induced failure of semiconductor PN junction during operation in the breakdown region of electrical characteristic
|
Obreja, V.V.N. |
|
2011 |
51 |
3 |
p. 536-542 7 p. |
artikel |
13 |
Effect of Cr additions on interfacial reaction between the Sn–Zn–Bi solder and Cu/electroplated Ni substrates
|
Bi, Jinglin |
|
2011 |
51 |
3 |
p. 636-641 6 p. |
artikel |
14 |
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading
|
Yu, Da |
|
2011 |
51 |
3 |
p. 649-656 8 p. |
artikel |
15 |
Hysteresis effect in bottom-gate polymorphous silicon thin-film transistors
|
Hastas, N.A. |
|
2011 |
51 |
3 |
p. 556-559 4 p. |
artikel |
16 |
Influence of P3HT:PCBM blend preparation on the active layer morphology and cell degradation
|
Balderrama, V.S. |
|
2011 |
51 |
3 |
p. 597-601 5 p. |
artikel |
17 |
Inside front cover - Editorial board
|
|
|
2011 |
51 |
3 |
p. IFC- 1 p. |
artikel |
18 |
LDMOSFET with drain potential suppression for 100V Power IC technology
|
Holland, P. |
|
2011 |
51 |
3 |
p. 529-535 7 p. |
artikel |
19 |
Mitigation of permanent faults in adaptive equalizers
|
Reviriego, P. |
|
2011 |
51 |
3 |
p. 703-710 8 p. |
artikel |
20 |
Molybdenum and low-temperature annealing of a silicon power P–i–N diode
|
Vobecký, J. |
|
2011 |
51 |
3 |
p. 566-571 6 p. |
artikel |
21 |
On the profile of frequency dependent dielectric properties of (Ni/Au)/GaN/Al0.3Ga0.7N heterostructures
|
Tekeli, Z. |
|
2011 |
51 |
3 |
p. 581-586 6 p. |
artikel |
22 |
Orthogonal fault-tolerant systolic arrays for matrix multiplication
|
Milovanović, I.Ž. |
|
2011 |
51 |
3 |
p. 711-725 15 p. |
artikel |
23 |
Reliability challenges in 3D IC packaging technology
|
Tu, K.N. |
|
2011 |
51 |
3 |
p. 517-523 7 p. |
artikel |
24 |
RF small signal avalanche for bipolar transistor circuit design: Characterization, modeling and repercussions
|
Milovanović, Vladimir |
|
2011 |
51 |
3 |
p. 560-565 6 p. |
artikel |
25 |
Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
|
Schreier-Alt, Thomas |
|
2011 |
51 |
3 |
p. 668-675 8 p. |
artikel |
26 |
Switch-level emulation of strength-base soft error detection
|
Sedaghat, Reza |
|
2011 |
51 |
3 |
p. 692-702 11 p. |
artikel |
27 |
The effect of a post processing thermal anneal on pre-existing and stress induced electrically active defects in ultra-thin SiON dielectric layers
|
O’Connor, Robert |
|
2011 |
51 |
3 |
p. 524-528 5 p. |
artikel |
28 |
The influence of solder composition on the impact strength of lead-free solder ball grid array joints
|
Tsukamoto, H. |
|
2011 |
51 |
3 |
p. 657-667 11 p. |
artikel |
29 |
Thermal fracture toughness measurement for underfill during temperature change
|
Park, Soojae |
|
2011 |
51 |
3 |
p. 685-691 7 p. |
artikel |