| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A carrier-mobility model for high-k gate-dielectric Ge MOSFETs with metal gate electrode
|
Xu, J.P.
|
|
2010
|
50 |
8 |
p. 1081-1086
6 p.
|
article
|
| 2 |
A novel impact test system for more efficient reliability testing
|
Hokka, Jussi
|
|
2010
|
50 |
8 |
p. 1125-1133
9 p.
|
article
|
| 3 |
A proposed DG-FinFET based SRAM cell design with RadHard capabilities
|
Rathod, S.S.
|
|
2010
|
50 |
8 |
p. 1181-1188
8 p.
|
article
|
| 4 |
Characteristics analysis and optimization design of a new ESD power clamp circuit
|
Liu, Hongxia
|
|
2010
|
50 |
8 |
p. 1087-1093
7 p.
|
article
|
| 5 |
Charge-based model for symmetric double-gate MOSFETs with inclusion of channel doping effect
|
Zhang, Lining
|
|
2010
|
50 |
8 |
p. 1062-1070
9 p.
|
article
|
| 6 |
Corrosion protection of anisotropically conductive adhesive joined flip chips
|
Kokko, Kati
|
|
2010
|
50 |
8 |
p. 1152-1158
7 p.
|
article
|
| 7 |
Deteriorated radiation effects impact on the characteristics of MOS transistors with multi-finger configuration
|
Wang, Jian
|
|
2010
|
50 |
8 |
p. 1094-1097
4 p.
|
article
|
| 8 |
Development of a novel stack package to fabricate high density memory modules for high-end application
|
Kuo, Chinguo
|
|
2010
|
50 |
8 |
p. 1116-1120
5 p.
|
article
|
| 9 |
Devices’ optimization against hot-carrier degradation in high voltage pLEDMOS transistor
|
Wu, Hong
|
|
2010
|
50 |
8 |
p. 1071-1076
6 p.
|
article
|
| 10 |
Effects of Al on the failure mechanism of the Sn–Ag–Zn eutectic solder
|
Wei, C.
|
|
2010
|
50 |
8 |
p. 1142-1145
4 p.
|
article
|
| 11 |
Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces
|
Tseng, H.W.
|
|
2010
|
50 |
8 |
p. 1159-1162
4 p.
|
article
|
| 12 |
Evaluating the abrasive wear of Zn1− x Mn x O heteroepitaxial layers using a nanoscratch technique
|
Chang, Yu-Ming
|
|
2010
|
50 |
8 |
p. 1111-1115
5 p.
|
article
|
| 13 |
Exciton wavefunction coupled surface plasmon resonance for In-rich InGaN film with perforated aluminum cylindrical micropillar arrays
|
Hu, Yeu-Jent
|
|
2010
|
50 |
8 |
p. 1107-1110
4 p.
|
article
|
| 14 |
Failure investigation on copper-plated blind vias in PCB
|
Ji, Li-Na
|
|
2010
|
50 |
8 |
p. 1163-1170
8 p.
|
article
|
| 15 |
Generating sub-1V reference voltages from a resistorless CMOS bandgap reference circuit by using a piecewise curvature temperature compensation technique
|
Tam, Wing-Shan
|
|
2010
|
50 |
8 |
p. 1054-1061
8 p.
|
article
|
| 16 |
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy
|
Ahmed, Mansur
|
|
2010
|
50 |
8 |
p. 1134-1141
8 p.
|
article
|
| 17 |
Inside front cover - Editorial board
|
|
|
2010
|
50 |
8 |
p. IFC-
1 p.
|
article
|
| 18 |
[No title]
|
Jankovic, Nebojsa
|
|
2010
|
50 |
8 |
p. 1189-
1 p.
|
article
|
| 19 |
On-chip reliability monitors for measuring circuit degradation
|
Keane, John
|
|
2010
|
50 |
8 |
p. 1039-1053
15 p.
|
article
|
| 20 |
Optimization of SiN X :H films deposited by PECVD for reliability of electronic, microsystems and optical applications
|
Herth, E.
|
|
2010
|
50 |
8 |
p. 1103-1106
4 p.
|
article
|
| 21 |
Plasma-enhanced flexible metal–insulator–metal capacitor using high-k ZrO2 film as gate dielectric with improved reliability
|
Chu, Min-Ching
|
|
2010
|
50 |
8 |
p. 1098-1102
5 p.
|
article
|
| 22 |
Temperature dependence of the interface state distribution due to hot carrier effect in FinFET device
|
Ma, Chenyue
|
|
2010
|
50 |
8 |
p. 1077-1080
4 p.
|
article
|
| 23 |
Testing the effects of temperature cycling on tantalum capacitors
|
Virkki, J.
|
|
2010
|
50 |
8 |
p. 1121-1124
4 p.
|
article
|
| 24 |
The effect of tin grain structure on whisker growth
|
Yu, Cheng-Fu
|
|
2010
|
50 |
8 |
p. 1146-1151
6 p.
|
article
|
| 25 |
Two effective methods to mitigate soft error effects in SRAM-based FPGAs
|
Rohani, Alireza
|
|
2010
|
50 |
8 |
p. 1171-1180
10 p.
|
article
|
Journal description