nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Advances in Wafer Level Packaging (WLP)
|
Tee, Tong Yan |
|
2010 |
50 |
4 |
p. 479-480 2 p. |
artikel |
2 |
Calendar
|
|
|
2010 |
50 |
4 |
p. I-III nvt p. |
artikel |
3 |
Design and optimization of thermo-mechanical reliability in wafer level packaging
|
Fan, X.J. |
|
2010 |
50 |
4 |
p. 536-546 11 p. |
artikel |
4 |
Designing for reliability using a new Wafer Level Package structure
|
Hochstenbach, P.H. |
|
2010 |
50 |
4 |
p. 528-535 8 p. |
artikel |
5 |
Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection
|
Shen, Li-Cheng |
|
2010 |
50 |
4 |
p. 489-497 9 p. |
artikel |
6 |
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package
|
Sze, Theresa |
|
2010 |
50 |
4 |
p. 498-506 9 p. |
artikel |
7 |
Editorial
|
Vanzi, Massimo |
|
2010 |
50 |
4 |
p. 455- 1 p. |
artikel |
8 |
Finite element modeling on electromigration of solder joints in wafer level packages
|
Dandu, P. |
|
2010 |
50 |
4 |
p. 547-555 9 p. |
artikel |
9 |
Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages
|
Jang, Changsoo |
|
2010 |
50 |
4 |
p. 507-513 7 p. |
artikel |
10 |
Geometric design for ultra-long needle probe card for digital light processing wafer testing
|
Chang, Hao-Yuan |
|
2010 |
50 |
4 |
p. 556-563 8 p. |
artikel |
11 |
Inside front cover - Editorial board
|
|
|
2010 |
50 |
4 |
p. IFC- 1 p. |
artikel |
12 |
Multiple impact characterization of wafer level packaging (WLP)
|
Crosbie, Paul |
|
2010 |
50 |
4 |
p. 577-582 6 p. |
artikel |
13 |
New methodology for the assessment of the thermal resistance of laser diodes and light emitting diodes
|
Veyrié, David |
|
2010 |
50 |
4 |
p. 456-461 6 p. |
artikel |
14 |
Rate-dependent properties of Sn–Ag–Cu based lead-free solder joints for WLCSP
|
Su, Y.A. |
|
2010 |
50 |
4 |
p. 564-576 13 p. |
artikel |
15 |
Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations
|
Chen, Jiunn |
|
2010 |
50 |
4 |
p. 522-527 6 p. |
artikel |
16 |
Reliability evaluation for Blu-Ray laser diodes
|
Meneghini, Matteo |
|
2010 |
50 |
4 |
p. 467-470 4 p. |
artikel |
17 |
Strain estimation in III–V materials by analysis of the degree of polarization of luminescence
|
Cassidy, Daniel T. |
|
2010 |
50 |
4 |
p. 462-466 5 p. |
artikel |
18 |
The interpretation of the DC characteristics of LED and laser diodes to address their failure analysis
|
Mura, G. |
|
2010 |
50 |
4 |
p. 471-478 8 p. |
artikel |
19 |
Trends of power semiconductor wafer level packaging
|
Liu, Yong |
|
2010 |
50 |
4 |
p. 514-521 8 p. |
artikel |
20 |
Wafer-level bonding/stacking technology for 3D integration
|
Ko, Cheng-Ta |
|
2010 |
50 |
4 |
p. 481-488 8 p. |
artikel |