no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
A high level synthesis design flow with a novel approach for efficient design space exploration in case of multi-parametric optimization objective
|
Sengupta, Anirban |
|
2010 |
50 |
3 |
p. 424-437 14 p. |
article |
2 |
Analysis of dependence of short-channel effects in double-gate MOSFETs on channel thickness
|
Kobayashi, Yusuke |
|
2010 |
50 |
3 |
p. 332-337 6 p. |
article |
3 |
A prognostics and health management roadmap for information and electronics-rich systems
|
Pecht, Michael |
|
2010 |
50 |
3 |
p. 317-323 7 p. |
article |
4 |
Calendar
|
|
|
2010 |
50 |
3 |
p. I-III nvt p. |
article |
5 |
Circuit level interconnect reliability study using 3D circuit model
|
He, Feifei |
|
2010 |
50 |
3 |
p. 376-390 15 p. |
article |
6 |
Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes
|
Dong, X. |
|
2010 |
50 |
3 |
p. 391-397 7 p. |
article |
7 |
Electro-thermal stress effect on InGaP/GaAs heterojunction bipolar low-noise amplifier performance
|
Liu, Xiang |
|
2010 |
50 |
3 |
p. 365-369 5 p. |
article |
8 |
Extraction of VBIC model parameters for InGaAsSb DHBTs
|
Chang, Yang-Hua |
|
2010 |
50 |
3 |
p. 370-375 6 p. |
article |
9 |
Impact of interface state trap density on the performance characteristics of different III–V MOSFET architectures
|
Benbakhti, B. |
|
2010 |
50 |
3 |
p. 360-364 5 p. |
article |
10 |
Improved resolution method to study at 3D the conduction phenomena inside GaAs PIN photodiode
|
Bouabdallah, B. |
|
2010 |
50 |
3 |
p. 447-453 7 p. |
article |
11 |
Inside front cover - Editorial board
|
|
|
2010 |
50 |
3 |
p. IFC- 1 p. |
article |
12 |
Modeling of drain current, capacitance and transconductance in thin film undoped symmetric DG MOSFETs including quantum effects
|
Mohammadi, Saeed |
|
2010 |
50 |
3 |
p. 338-345 8 p. |
article |
13 |
Observation of halo implant from the drain side reaching the source side and vice versa in extremely short p-channel transistors
|
Lau, W.S. |
|
2010 |
50 |
3 |
p. 346-350 5 p. |
article |
14 |
Reliability enhancement of digital combinational circuits based on evolutionary approach
|
Seyyed Mahdavi, S.J. |
|
2010 |
50 |
3 |
p. 415-423 9 p. |
article |
15 |
Reliability growth modeling for in-service electronic systems considering latent failure modes
|
Jin, Tongdan |
|
2010 |
50 |
3 |
p. 324-331 8 p. |
article |
16 |
Reliability Object Model Tree (ROM-Tree): A system design-for-reliability method
|
Kim, Injoong |
|
2010 |
50 |
3 |
p. 438-446 9 p. |
article |
17 |
SrO capping effect for La2O3/Ce-silicate gate dielectrics
|
Kakushima, K. |
|
2010 |
50 |
3 |
p. 356-359 4 p. |
article |
18 |
The frequency-dependent electrical characteristics of interfaces in the Sn/p-Si metal semiconductor structures
|
Karataş, Ş. |
|
2010 |
50 |
3 |
p. 351-355 5 p. |
article |
19 |
The use of Mahalanobis–Taguchi System to improve flip-chip bumping height inspection efficiency
|
Yang, Taho |
|
2010 |
50 |
3 |
p. 407-414 8 p. |
article |
20 |
Warpage mechanism analyses of strip panel type PBGA chip packaging
|
Kim, Yeong K. |
|
2010 |
50 |
3 |
p. 398-406 9 p. |
article |