| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A CMOS circuit for evaluating the NBTI over a wide frequency range
|
Fernández-García, R.
|
|
2009
|
49 |
8 |
p. 885-891
7 p.
|
artikel
|
| 2 |
A detailed study of current–voltage characteristics in Au/SiO2/n-GaAs in wide temperature range
|
Altuntaş, H.
|
|
2009
|
49 |
8 |
p. 904-911
8 p.
|
artikel
|
| 3 |
A study on the improved programming characteristics of flash memory with Si3N4/SiO2 stacked tunneling dielectric
|
Liu, L.
|
|
2009
|
49 |
8 |
p. 912-915
4 p.
|
artikel
|
| 4 |
Calendar
|
|
|
2009
|
49 |
8 |
p. I-III
nvt p.
|
artikel
|
| 5 |
Call for Papers for the MIEL 2010 Conference
|
|
|
2009
|
49 |
8 |
p. IV-
1 p.
|
artikel
|
| 6 |
Experimental investigations and model study of moisture behaviors in polymeric materials
|
Fan, X.J.
|
|
2009
|
49 |
8 |
p. 861-871
11 p.
|
artikel
|
| 7 |
Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
|
Wymysłowski, Artur
|
|
2009
|
49 |
8 |
p. 823-824
2 p.
|
artikel
|
| 8 |
Inside front cover - Editorial board
|
|
|
2009
|
49 |
8 |
p. IFC-
1 p.
|
artikel
|
| 9 |
Modeling and characterization of molding compound properties during cure
|
Jansen, K.M.B.
|
|
2009
|
49 |
8 |
p. 872-876
5 p.
|
artikel
|
| 10 |
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics
|
van der Sluis, O.
|
|
2009
|
49 |
8 |
p. 853-860
8 p.
|
artikel
|
| 11 |
Performance properties in thick film silicate dielectric layers using molecular modeling
|
Iwamoto, Nancy
|
|
2009
|
49 |
8 |
p. 877-883
7 p.
|
artikel
|
| 12 |
Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads
|
Lall, Pradeep
|
|
2009
|
49 |
8 |
p. 825-838
14 p.
|
artikel
|
| 13 |
SCRAP: Sequential circuits reliability analysis program
|
Seyyed Mahdavi, S.J.
|
|
2009
|
49 |
8 |
p. 924-933
10 p.
|
artikel
|
| 14 |
Simulation based analysis of secondary effects on solder fatigue
|
Dudek, Rainer
|
|
2009
|
49 |
8 |
p. 839-845
7 p.
|
artikel
|
| 15 |
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull
|
Zaal, J.J.M.
|
|
2009
|
49 |
8 |
p. 846-852
7 p.
|
artikel
|
| 16 |
Sub-threshold behavior of long channel undoped cylindrical surrounding-gate MOSFETs
|
Bian, Wei
|
|
2009
|
49 |
8 |
p. 897-903
7 p.
|
artikel
|
| 17 |
The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation
|
Wong, E.H.
|
|
2009
|
49 |
8 |
p. 916-923
8 p.
|
artikel
|
| 18 |
Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs
|
Hsieh, Zhen-Ying
|
|
2009
|
49 |
8 |
p. 892-896
5 p.
|
artikel
|
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