| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
|
Amin, Nowshad
|
|
2009
|
49 |
5 |
p. 537-543
7 p.
|
artikel
|
| 2 |
Calendar
|
|
|
2009
|
49 |
5 |
p. I-III
nvt p.
|
artikel
|
| 3 |
Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball–wedge bond wires
|
Jinka, K.K.
|
|
2009
|
49 |
5 |
p. 523-529
7 p.
|
artikel
|
| 4 |
Determining DC/RF survivability limits of GaAs semiconductor circuits
|
Gil, C.
|
|
2009
|
49 |
5 |
p. 484-487
4 p.
|
artikel
|
| 5 |
Editorial
|
Ersland, Peter
|
|
2009
|
49 |
5 |
p. 467-
1 p.
|
artikel
|
| 6 |
Effect of bump size on current density and temperature distributions in flip-chip solder joints
|
Kuan, Wei-Chih
|
|
2009
|
49 |
5 |
p. 544-550
7 p.
|
artikel
|
| 7 |
Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor
|
Wong, Oi Ying
|
|
2009
|
49 |
5 |
p. 506-509
4 p.
|
artikel
|
| 8 |
Effects of soft segment mixtures with different molecular weight on the properties and reliability of UV curable adhesives for electrodes protection of plasma display panel (PDP)
|
Hwang, Jin-Sang
|
|
2009
|
49 |
5 |
p. 517-522
6 p.
|
artikel
|
| 9 |
Formation of Ohmic contacts in AlGaN/GaN HEMT structures at 500°C by Ohmic contact recess etching
|
Lau, W.S.
|
|
2009
|
49 |
5 |
p. 558-561
4 p.
|
artikel
|
| 10 |
High-accurate computation of wave propagation in complex waveguides for microchip optical interconnections
|
Zhu, Jianxin
|
|
2009
|
49 |
5 |
p. 562-565
4 p.
|
artikel
|
| 11 |
Inside front cover - Editorial board
|
|
|
2009
|
49 |
5 |
p. IFC-
1 p.
|
artikel
|
| 12 |
Investigation and simulation on the dynamic shock response performance of packaged high-g MEMS accelerometer versus the impurity concentration of the piezoresistor
|
Yang, Zunxian
|
|
2009
|
49 |
5 |
p. 510-516
7 p.
|
artikel
|
| 13 |
Obtaining FPGA soft error rate in high performance information systems
|
Tahoori, M.B.
|
|
2009
|
49 |
5 |
p. 551-557
7 p.
|
artikel
|
| 14 |
On the accurate determination of the thermomechanical properties of micro-scale material: Application to AlSi1% chip metallization of a power semiconductor device
|
Sauveplane, J.B.
|
|
2009
|
49 |
5 |
p. 499-505
7 p.
|
artikel
|
| 15 |
Physical degradation of GaN HEMT devices under high drain bias reliability testing
|
Park, S.Y.
|
|
2009
|
49 |
5 |
p. 478-483
6 p.
|
artikel
|
| 16 |
Prediction of transmission line lifetimes over temperature and current density
|
Whitman, Charles S.
|
|
2009
|
49 |
5 |
p. 488-494
7 p.
|
artikel
|
| 17 |
Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems
|
Dammann, M.
|
|
2009
|
49 |
5 |
p. 474-477
4 p.
|
artikel
|
| 18 |
Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact
|
Zhang, Bo
|
|
2009
|
49 |
5 |
p. 530-536
7 p.
|
artikel
|
| 19 |
ROCS 2009 Call for Papers
|
|
|
2009
|
49 |
5 |
p. IV-
1 p.
|
artikel
|
| 20 |
Temperature dependent time-to-breakdown (T BD) of TiN/HfO2 n-channel MOS devices in inversion
|
Chowdhury, N.A.
|
|
2009
|
49 |
5 |
p. 495-498
4 p.
|
artikel
|
| 21 |
Three-dimensional finite-element thermal simulation of GaN-based HEMTs
|
Bertoluzza, F.
|
|
2009
|
49 |
5 |
p. 468-473
6 p.
|
artikel
|
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