| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A MEMS-based wireless multisensor module for environmental monitoring
|
Hautefeuille, Mathieu
|
|
2008
|
48 |
6 |
p. 906-910
5 p.
|
artikel
|
| 2 |
An approach of numerical multi-objective optimization in stacked packaging
|
Dowhań, Łukasz
|
|
2008
|
48 |
6 |
p. 851-857
7 p.
|
artikel
|
| 3 |
Anomalous narrow width effect in p-channel metal–oxide–semiconductor surface channel transistors using shallow trench isolation technology
|
Lau, W.S.
|
|
2008
|
48 |
6 |
p. 919-922
4 p.
|
artikel
|
| 4 |
Calendar
|
|
|
2008
|
48 |
6 |
p. I-III
nvt p.
|
artikel
|
| 5 |
Design of metal interconnects for stretchable electronic circuits
|
Gonzalez, Mario
|
|
2008
|
48 |
6 |
p. 825-832
8 p.
|
artikel
|
| 6 |
3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package
|
Liu, Yong
|
|
2008
|
48 |
6 |
p. 811-824
14 p.
|
artikel
|
| 7 |
Electro-ultrasonic spectroscopy of polymer-based thick film layers
|
Sedlakova, Vlasta
|
|
2008
|
48 |
6 |
p. 886-889
4 p.
|
artikel
|
| 8 |
Evaluation of conductive-to-resistive layers interaction in thick-film resistors
|
Mleczko, K.
|
|
2008
|
48 |
6 |
p. 881-885
5 p.
|
artikel
|
| 9 |
Evaluation of test methods for silicon die strength
|
Tsai, M.Y.
|
|
2008
|
48 |
6 |
p. 933-941
9 p.
|
artikel
|
| 10 |
Failure analysis of contact probe pins for SnPb and Sn applications
|
Jang, Changsoo
|
|
2008
|
48 |
6 |
p. 942-947
6 p.
|
artikel
|
| 11 |
Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
|
Wymysłowski, Artur
|
|
2008
|
48 |
6 |
p. 803-804
2 p.
|
artikel
|
| 12 |
IMAPS Poland 2007 – Guest Editorial
|
Dziedzic, Andrzej
|
|
2008
|
48 |
6 |
p. 859-
1 p.
|
artikel
|
| 13 |
Inside front cover - Editorial board
|
|
|
2008
|
48 |
6 |
p. IFC-
1 p.
|
artikel
|
| 14 |
Investigation on a new silver photoimageable conductor
|
Jakubowska, Małgorzata
|
|
2008
|
48 |
6 |
p. 860-865
6 p.
|
artikel
|
| 15 |
Microchannel fabrication process in LTCC ceramics
|
Malecha, Karol
|
|
2008
|
48 |
6 |
p. 866-871
6 p.
|
artikel
|
| 16 |
Microsystems elements based on free-standing thick-films made with a new sacrificial layer process
|
Lucat, Claude
|
|
2008
|
48 |
6 |
p. 872-875
4 p.
|
artikel
|
| 17 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
6 |
p. 955-956
2 p.
|
artikel
|
| 18 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
6 |
p. 953-954
2 p.
|
artikel
|
| 19 |
Optimisation of a thick-film 10–400N force sensor
|
Maeder, Thomas
|
|
2008
|
48 |
6 |
p. 902-905
4 p.
|
artikel
|
| 20 |
Piezoelectric polymer films as power converters for human powered electronics
|
Klimiec, Ewa
|
|
2008
|
48 |
6 |
p. 897-901
5 p.
|
artikel
|
| 21 |
Planar and three-dimensional thick-film thermoelectric microgenerators
|
Markowski, Piotr
|
|
2008
|
48 |
6 |
p. 890-896
7 p.
|
artikel
|
| 22 |
Problem of dynamic change of tags location in anticollision RFID systems
|
Jankowski-Mihulowicz, Piotr
|
|
2008
|
48 |
6 |
p. 911-918
8 p.
|
artikel
|
| 23 |
Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method
|
Kim, Jong-Seok
|
|
2008
|
48 |
6 |
p. 948-952
5 p.
|
artikel
|
| 24 |
Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges
|
Koganemaru, Masaaki
|
|
2008
|
48 |
6 |
p. 923-932
10 p.
|
artikel
|
| 25 |
Study of temperature dependent properties of organic substrate materials
|
Boehme, Bjoern
|
|
2008
|
48 |
6 |
p. 876-880
5 p.
|
artikel
|
| 26 |
The effect of downscaling the dimensions of solder interconnects on their creep properties
|
Wiese, S.
|
|
2008
|
48 |
6 |
p. 843-850
8 p.
|
artikel
|
| 27 |
The need for multi-scale approaches in Cu/low-k reliability issues
|
Yuan, Cadmus A.
|
|
2008
|
48 |
6 |
p. 833-842
10 p.
|
artikel
|
| 28 |
Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling method
|
Zhou, Jiang
|
|
2008
|
48 |
6 |
p. 805-810
6 p.
|
artikel
|
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