nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A dual burn-in policy for defect-tolerant memory products using the number of repairs as a quality indicator
|
Tong, Seung-Hoon |
|
2008 |
48 |
3 |
p. 471-480 10 p. |
artikel |
2 |
A junction characterization for microelectronic devices quality and reliability
|
Tazibt, W. |
|
2008 |
48 |
3 |
p. 348-353 6 p. |
artikel |
3 |
A new model of subthreshold swing for sub-100nm MOSFETs
|
Yang, Lin-An |
|
2008 |
48 |
3 |
p. 342-347 6 p. |
artikel |
4 |
Assessment of temperature and voltage accelerating factors for 2.3–3.2nm SiO2 thin oxides stressed to hard breakdown
|
Pic, D. |
|
2008 |
48 |
3 |
p. 335-341 7 p. |
artikel |
5 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
|
Yang, Ping-Feng |
|
2008 |
48 |
3 |
p. 389-394 6 p. |
artikel |
6 |
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
|
Thijsse, J. |
|
2008 |
48 |
3 |
p. 401-407 7 p. |
artikel |
7 |
Conduction mechanisms of silicon oxide/titanium oxide MOS stack structures
|
Tinoco, J.C. |
|
2008 |
48 |
3 |
p. 370-381 12 p. |
artikel |
8 |
dc-Conduction mechanism in lanthanum–manganese oxide films grown on p-Si substrate
|
Dakhel, A.A. |
|
2008 |
48 |
3 |
p. 395-400 6 p. |
artikel |
9 |
Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints
|
Shirley, Dwayne R. |
|
2008 |
48 |
3 |
p. 455-470 16 p. |
artikel |
10 |
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints
|
Yu, Qiang |
|
2008 |
48 |
3 |
p. 431-437 7 p. |
artikel |
11 |
Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging
|
Wan, J.W. |
|
2008 |
48 |
3 |
p. 425-430 6 p. |
artikel |
12 |
Extraction of interface states at emitter–base heterojunctions in AlGaAs/GaAs heterostructure bipolar transistors using sub-bandgap photonic excitation
|
Kim, Se Woon |
|
2008 |
48 |
3 |
p. 382-388 7 p. |
artikel |
13 |
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
|
Hang, C.J. |
|
2008 |
48 |
3 |
p. 416-424 9 p. |
artikel |
14 |
Impact of single pMOSFET dielectric degradation on NAND circuit performance
|
Estrada, D. |
|
2008 |
48 |
3 |
p. 354-363 10 p. |
artikel |
15 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
3 |
p. 494-495 2 p. |
artikel |
16 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
3 |
p. 490-491 2 p. |
artikel |
17 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
3 |
p. 492-493 2 p. |
artikel |
18 |
Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement
|
Jiang, Li |
|
2008 |
48 |
3 |
p. 438-444 7 p. |
artikel |
19 |
Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers
|
Chen, K.M. |
|
2008 |
48 |
3 |
p. 408-415 8 p. |
artikel |
20 |
Reliability functions estimated from commonly used yield models
|
Kim, Kyungmee O. |
|
2008 |
48 |
3 |
p. 481-489 9 p. |
artikel |
21 |
Suppression of Ge–O and Ge–N bonding at Ge–HfO2 and Ge–TiO2 interfaces by deposition onto plasma-nitrided passivated Ge substrates: Integration issues Ge gate stacks into advanced devices
|
Lee, S. |
|
2008 |
48 |
3 |
p. 364-369 6 p. |
artikel |
22 |
Thermal transient characteristics of die attach in high power LED PKG
|
Kim, Hyun-Ho |
|
2008 |
48 |
3 |
p. 445-454 10 p. |
artikel |