nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A fast mechanical test technique for life time estimation of micro-joints
|
Khatibi, G. |
|
2008 |
48 |
11-12 |
p. 1822-1830 9 p. |
artikel |
2 |
A low power MEMS gas sensor based on nanocrystalline ZnO thin films for sensing methane
|
Bhattacharyya, P. |
|
2008 |
48 |
11-12 |
p. 1772-1779 8 p. |
artikel |
3 |
An automated approach for locating multiple faulty LUTs in an FPGA
|
Nandha Kumar, T. |
|
2008 |
48 |
11-12 |
p. 1900-1906 7 p. |
artikel |
4 |
A novel approach to characterization of progressive breakdown in high-k/metal gate stacks
|
Pagano, R. |
|
2008 |
48 |
11-12 |
p. 1759-1764 6 p. |
artikel |
5 |
A review of board level solder joints for mobile applications
|
Wong, E.H. |
|
2008 |
48 |
11-12 |
p. 1747-1758 12 p. |
artikel |
6 |
Calendar
|
|
|
2008 |
48 |
11-12 |
p. I-II nvt p. |
artikel |
7 |
Consideration of temperature and current stress testing on flip chip solder interconnects
|
Yeo, Alfred |
|
2008 |
48 |
11-12 |
p. 1847-1856 10 p. |
artikel |
8 |
Diffusion barrier performance of Zr–N/Zr bilayered film in Cu/Si contact system
|
Wang, Ying |
|
2008 |
48 |
11-12 |
p. 1800-1803 4 p. |
artikel |
9 |
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint
|
Kim, Jong-Woong |
|
2008 |
48 |
11-12 |
p. 1882-1889 8 p. |
artikel |
10 |
Effect of the pre-gate oxide cleaning temperature on the reliability of GOI and devices performances in deep submicron CMOS technology
|
Chiang, Y.T. |
|
2008 |
48 |
11-12 |
p. 1786-1790 5 p. |
artikel |
11 |
Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation
|
Sen, Banani |
|
2008 |
48 |
11-12 |
p. 1765-1768 4 p. |
artikel |
12 |
Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint
|
Yoon, Jeong-Won |
|
2008 |
48 |
11-12 |
p. 1864-1874 11 p. |
artikel |
13 |
Electrical characteristics of MOSFETs with La2O3/Y2O3 gate stack
|
Ahmet, Parhat |
|
2008 |
48 |
11-12 |
p. 1769-1771 3 p. |
artikel |
14 |
Finite element model verification for packaged printed circuit board by experimental modal analysis
|
Lee, Ying-Chih |
|
2008 |
48 |
11-12 |
p. 1837-1846 10 p. |
artikel |
15 |
Improved sensing characteristics of MISiC Schottky-diode hydrogen sensor by using HfO2 as gate insulator
|
Tang, W.M. |
|
2008 |
48 |
11-12 |
p. 1780-1785 6 p. |
artikel |
16 |
Improved upper contacts PMMA on P3HT PTFTS using photolithographic processes
|
Mejia, I. |
|
2008 |
48 |
11-12 |
p. 1795-1799 5 p. |
artikel |
17 |
Influence of underfill materials on the reliability of coreless flip chip package
|
Chuang, Chun-Chih |
|
2008 |
48 |
11-12 |
p. 1875-1881 7 p. |
artikel |
18 |
Inside front cover - Editorial board
|
|
|
2008 |
48 |
11-12 |
p. IFC- 1 p. |
artikel |
19 |
Investigation of charge trapping/de-trapping induced operation lifetime degradation in triple SuperFlash® memory cell
|
Cao, Zigui |
|
2008 |
48 |
11-12 |
p. 1809-1814 6 p. |
artikel |
20 |
Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method
|
Yoon, Jeong-Won |
|
2008 |
48 |
11-12 |
p. 1857-1863 7 p. |
artikel |
21 |
Model for life prediction of fatigue–creep interaction
|
Valentín, R. |
|
2008 |
48 |
11-12 |
p. 1831-1836 6 p. |
artikel |
22 |
On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes
|
Goswami, Arindam |
|
2008 |
48 |
11-12 |
p. 1815-1821 7 p. |
artikel |
23 |
Self-testing of fully differential multistage circuits using common-mode excitation
|
Toczek, Wojciech |
|
2008 |
48 |
11-12 |
p. 1890-1899 10 p. |
artikel |
24 |
Significantly improving sub-90nm CMOSFET performances with notch-gate enhanced high tensile-stress contact etch stop layer
|
Hsu, Chia-Wei |
|
2008 |
48 |
11-12 |
p. 1791-1794 4 p. |
artikel |
25 |
The degradation mechanisms in high voltage pLEDMOS transistor with thick gate oxide
|
Wu, Hong |
|
2008 |
48 |
11-12 |
p. 1804-1808 5 p. |
artikel |