| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies
|
Cacho, F.
|
|
2007
|
47 |
2-3 |
p. 161-167
7 p.
|
artikel
|
| 2 |
Advanced numerical prototyping methods in modern engineering applications – Optimisation for micro-electronic package reliability
|
Wymysłowski, A.
|
|
2007
|
47 |
2-3 |
p. 280-289
10 p.
|
artikel
|
| 3 |
Advanced structural similarity rules for the BGA package family
|
van Driel, W.D.
|
|
2007
|
47 |
2-3 |
p. 205-214
10 p.
|
artikel
|
| 4 |
Analysis of Cu/low-k bond pad delamination by using a novel failure index
|
van Gils, M.A.J.
|
|
2007
|
47 |
2-3 |
p. 179-186
8 p.
|
artikel
|
| 5 |
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
|
Van Steenberge, Nele
|
|
2007
|
47 |
2-3 |
p. 215-222
8 p.
|
artikel
|
| 6 |
A new two-dimensional threshold voltage model for cylindrical, fully-depleted, surrounding-gate (SG) MOSFETs
|
Chiang, T.K.
|
|
2007
|
47 |
2-3 |
p. 379-383
5 p.
|
artikel
|
| 7 |
Application of simulation-based decision making in product development of an RF module
|
Lindgren, Mats
|
|
2007
|
47 |
2-3 |
p. 302-309
8 p.
|
artikel
|
| 8 |
A threshold-voltage model of SiGe-channel pMOSFET without Si cap layer
|
Zou, X.
|
|
2007
|
47 |
2-3 |
p. 391-394
4 p.
|
artikel
|
| 9 |
Carbon/polyesterimide thick-film resistive composites – Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties
|
Dziedzic, Andrzej
|
|
2007
|
47 |
2-3 |
p. 354-362
9 p.
|
artikel
|
| 10 |
Correlation between chemistry of polymer building blocks and microelectronics reliability
|
Bressers, H.J.L.
|
|
2007
|
47 |
2-3 |
p. 290-294
5 p.
|
artikel
|
| 11 |
Creep of thermally aged SnAgCu-solder joints
|
Wiese, S.
|
|
2007
|
47 |
2-3 |
p. 223-232
10 p.
|
artikel
|
| 12 |
Dependability evaluation of Altera FPGA-based embedded systems subjected to SEUs
|
Zarandi, Hamid R.
|
|
2007
|
47 |
2-3 |
p. 461-470
10 p.
|
artikel
|
| 13 |
Dynamic responses and solder joint reliability under board level drop test
|
Luan, Jing-en
|
|
2007
|
47 |
2-3 |
p. 450-460
11 p.
|
artikel
|
| 14 |
Dynamic void formation in a DD-copper-structure with different metallization geometry
|
Weide-Zaage, Kirsten
|
|
2007
|
47 |
2-3 |
p. 319-325
7 p.
|
artikel
|
| 15 |
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn–3.5Ag wave soldered solder joints
|
Andersson, C.
|
|
2007
|
47 |
2-3 |
p. 266-272
7 p.
|
artikel
|
| 16 |
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
|
Yang, D.G.
|
|
2007
|
47 |
2-3 |
p. 233-239
7 p.
|
artikel
|
| 17 |
Effect of stress voltages on voltage acceleration and lifetime projections for ultra-thin gate oxides
|
Abadeer, W.W.
|
|
2007
|
47 |
2-3 |
p. 395-400
6 p.
|
artikel
|
| 18 |
Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000°C and temperature for minimum low-K interfacial oxide for high-K dielectric on Si
|
Lau, W.S.
|
|
2007
|
47 |
2-3 |
p. 429-433
5 p.
|
artikel
|
| 19 |
Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction
|
Watanabe, Kazufumi
|
|
2007
|
47 |
2-3 |
p. 409-418
10 p.
|
artikel
|
| 20 |
Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices
|
Khatir, Z.
|
|
2007
|
47 |
2-3 |
p. 422-428
7 p.
|
artikel
|
| 21 |
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
|
Roellig, Mike
|
|
2007
|
47 |
2-3 |
p. 187-195
9 p.
|
artikel
|
| 22 |
FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress–voiding
|
Orain, S.
|
|
2007
|
47 |
2-3 |
p. 295-301
7 p.
|
artikel
|
| 23 |
Influence of substrate thickness on thermal impedance of microelectronic structures
|
Vermeersch, B.
|
|
2007
|
47 |
2-3 |
p. 437-443
7 p.
|
artikel
|
| 24 |
Inkjettable conductive adhesive for use in microelectronics and microsystems technology
|
Kolbe, Jana
|
|
2007
|
47 |
2-3 |
p. 331-334
4 p.
|
artikel
|
| 25 |
Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards
|
Immonen, Marika P.
|
|
2007
|
47 |
2-3 |
p. 363-371
9 p.
|
artikel
|
| 26 |
Investigations of the influence of dicing techniques on the strength properties of thin silicon
|
Schoenfelder, Stephan
|
|
2007
|
47 |
2-3 |
p. 168-178
11 p.
|
artikel
|
| 27 |
Isotropic conductive adhesives: Future trends, possibilities and risks
|
Morris, James E.
|
|
2007
|
47 |
2-3 |
p. 328-330
3 p.
|
artikel
|
| 28 |
Low-distortion 4th order programmable Butterworth filter
|
Teresa Sanz, M.
|
|
2007
|
47 |
2-3 |
p. 471-476
6 p.
|
artikel
|
| 29 |
Low voltage stress induced leakage current and time to breakdown in ultra-thin (1.2–2.3nm) oxides
|
Petit, C.
|
|
2007
|
47 |
2-3 |
p. 401-408
8 p.
|
artikel
|
| 30 |
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
|
Gonda, V.
|
|
2007
|
47 |
2-3 |
p. 248-251
4 p.
|
artikel
|
| 31 |
Novel shear tools for viscoelastic characterization of packaging polymers
|
van’t Hof, C.
|
|
2007
|
47 |
2-3 |
p. 240-247
8 p.
|
artikel
|
| 32 |
Numerical approach to characterization of thermally conductive adhesives
|
Fałat, Tomasz
|
|
2007
|
47 |
2-3 |
p. 342-346
5 p.
|
artikel
|
| 33 |
Numerical modeling of warpage induced in QFN array molding process
|
Yang, D.G.
|
|
2007
|
47 |
2-3 |
p. 310-318
9 p.
|
artikel
|
| 34 |
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections
|
de Vries, J.W.C.
|
|
2007
|
47 |
2-3 |
p. 444-449
6 p.
|
artikel
|
| 35 |
Organic thin film transistors with HfO2 high-k gate dielectric grown by anodic oxidation or deposited by sol–gel
|
Tardy, J.
|
|
2007
|
47 |
2-3 |
p. 372-377
6 p.
|
artikel
|
| 36 |
Performance trends of Si-based RF transistors
|
Schwierz, F.
|
|
2007
|
47 |
2-3 |
p. 384-390
7 p.
|
artikel
|
| 37 |
Polytronic 2005
|
Dziedzic, Andrzej
|
|
2007
|
47 |
2-3 |
p. 327-
1 p.
|
artikel
|
| 38 |
Problems of PCB microvias filling by conductive paste
|
Kisiel, Ryszard
|
|
2007
|
47 |
2-3 |
p. 335-341
7 p.
|
artikel
|
| 39 |
Reliability assessment of the metallized film capacitors from degradation data
|
Zhao, Jianyin
|
|
2007
|
47 |
2-3 |
p. 434-436
3 p.
|
artikel
|
| 40 |
Reliability of SnPb and Pb-free flip–chips under different test conditions
|
Spraul, M.
|
|
2007
|
47 |
2-3 |
p. 252-258
7 p.
|
artikel
|
| 41 |
Reliability study of ultrathin oxide films subject to irradiation-then-stress treatment using conductive atomic force microscopy
|
Wu, You-Lin
|
|
2007
|
47 |
2-3 |
p. 419-421
3 p.
|
artikel
|
| 42 |
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology
|
Lee, Chang-Chun
|
|
2007
|
47 |
2-3 |
p. 196-204
9 p.
|
artikel
|
| 43 |
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages
|
Vandevelde, Bart
|
|
2007
|
47 |
2-3 |
p. 259-265
7 p.
|
artikel
|
| 44 |
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
|
Wymysłowski, Artur
|
|
2007
|
47 |
2-3 |
p. 159-160
2 p.
|
artikel
|
| 45 |
Thermal simulation of UV laser ablation of polyimide
|
Gordon, Péter
|
|
2007
|
47 |
2-3 |
p. 347-353
7 p.
|
artikel
|
| 46 |
Virtual qualification of moisture induced failures of advanced packages
|
van Gils, M.A.J.
|
|
2007
|
47 |
2-3 |
p. 273-279
7 p.
|
artikel
|
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