| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Adhesion of arbitrary-shaped thin-film microstructures
|
Bhate, Dhruv
|
|
2007
|
47 |
12 |
p. 2014-2024
11 p.
|
artikel
|
| 2 |
Advanced electronic prognostics through system telemetry and pattern recognition methods
|
Lopez, Leon
|
|
2007
|
47 |
12 |
p. 1865-1873
9 p.
|
artikel
|
| 3 |
A maintenance planning and business case development model for the application of prognostics and health management (PHM) to electronic systems
|
Sandborn, Peter A.
|
|
2007
|
47 |
12 |
p. 1889-1901
13 p.
|
artikel
|
| 4 |
Analysis of interior degradation of a laser waveguide using an OBIC monitor
|
Takeshita, Tatsuya
|
|
2007
|
47 |
12 |
p. 2135-2140
6 p.
|
artikel
|
| 5 |
An experimental study of the thermally activated processes in polycrystalline silicon thin film transistors
|
Michalas, L.
|
|
2007
|
47 |
12 |
p. 2058-2064
7 p.
|
artikel
|
| 6 |
A straightforward analytical method for extraction of semiconductor device transient thermal parameters
|
Masana, F.N.
|
|
2007
|
47 |
12 |
p. 2122-2128
7 p.
|
artikel
|
| 7 |
Board level drop test and simulation of leaded and lead-free BGA-PCB assembly
|
Qu, Xin
|
|
2007
|
47 |
12 |
p. 2197-2204
8 p.
|
artikel
|
| 8 |
Concept of smart integrated life consumption monitoring system for electronics
|
Rouet, Vincent
|
|
2007
|
47 |
12 |
p. 1921-1927
7 p.
|
artikel
|
| 9 |
Coupled electro-thermal simulation of a DC/DC converter
|
Vellvehi, Miquel
|
|
2007
|
47 |
12 |
p. 2114-2121
8 p.
|
artikel
|
| 10 |
Deformation analysis in microstructures and micro-devices
|
Liu, Zhanwei
|
|
2007
|
47 |
12 |
p. 2226-2230
5 p.
|
artikel
|
| 11 |
Drop simulation/experimental verification and shock resistance improvement of TFT–LCD monitors
|
Pan, Min-Chun
|
|
2007
|
47 |
12 |
p. 2249-2259
11 p.
|
artikel
|
| 12 |
Dynamic behavior of resistive faults in nanometer technology
|
Kunchwar, Mayuri
|
|
2007
|
47 |
12 |
p. 2141-2146
6 p.
|
artikel
|
| 13 |
Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging
|
Koo, Ja-Myeong
|
|
2007
|
47 |
12 |
p. 2169-2178
10 p.
|
artikel
|
| 14 |
Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
|
Peng, Weiqun
|
|
2007
|
47 |
12 |
p. 2161-2168
8 p.
|
artikel
|
| 15 |
Effects of width scaling and layout variation on dual damascene copper interconnect electromigration
|
Lin, M.H.
|
|
2007
|
47 |
12 |
p. 2100-2108
9 p.
|
artikel
|
| 16 |
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion
|
van der Sluis, O.
|
|
2007
|
47 |
12 |
p. 1975-1982
8 p.
|
artikel
|
| 17 |
Electrical measurements of voltage stressed Al2O3/GaAs MOSFET
|
Tang, Z.
|
|
2007
|
47 |
12 |
p. 2082-2087
6 p.
|
artikel
|
| 18 |
Electronic prognostics – A case study using global positioning system (GPS)
|
Brown, Douglas W.
|
|
2007
|
47 |
12 |
p. 1874-1881
8 p.
|
artikel
|
| 19 |
Electronic prognostics for switched mode power supplies
|
Goodman, Douglas
|
|
2007
|
47 |
12 |
p. 1902-1906
5 p.
|
artikel
|
| 20 |
Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules
|
Rooney, Daniel T.
|
|
2007
|
47 |
12 |
p. 2152-2160
9 p.
|
artikel
|
| 21 |
Evaluation of solder joint strengths under ball impact test
|
Lai, Yi-Shao
|
|
2007
|
47 |
12 |
p. 2179-2187
9 p.
|
artikel
|
| 22 |
Facing the challenge of designing for Cu/low-k reliability
|
van Driel, W.D.
|
|
2007
|
47 |
12 |
p. 1969-1974
6 p.
|
artikel
|
| 23 |
Fatigue and thermal fatigue damage analysis of thin metal films
|
Zhang, G.P.
|
|
2007
|
47 |
12 |
p. 2007-2013
7 p.
|
artikel
|
| 24 |
Feature extraction and damage-precursors for prognostication of lead-free electronics
|
Lall, Pradeep
|
|
2007
|
47 |
12 |
p. 1907-1920
14 p.
|
artikel
|
| 25 |
Finite-element model-based fault diagnosis, a case study of a ceramic pressure sensor structure
|
Zarnik, Marina Santo
|
|
2007
|
47 |
12 |
p. 1950-1957
8 p.
|
artikel
|
| 26 |
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
|
Nakadaira, Yoshikuni
|
|
2007
|
47 |
12 |
p. 1928-1949
22 p.
|
artikel
|
| 27 |
High-temperature performance of state-of-the-art triple-gate transistors
|
Akarvardar, K.
|
|
2007
|
47 |
12 |
p. 2065-2069
5 p.
|
artikel
|
| 28 |
Impact of board and component metallizations on microstructure and reliability of lead-free solder joints
|
Zbrzezny, A.R.
|
|
2007
|
47 |
12 |
p. 2205-2214
10 p.
|
artikel
|
| 29 |
Influence of matrix viscoelastic properties on thermal conductivity of TCA – Numerical approach
|
Falat, Tomasz
|
|
2007
|
47 |
12 |
p. 1989-1996
8 p.
|
artikel
|
| 30 |
Introduction to special section on electronic systems prognostics and health management
|
Sandborn, Peter
|
|
2007
|
47 |
12 |
p. 1847-1848
2 p.
|
artikel
|
| 31 |
Isothermal aging effects on flex cracking of multilayer ceramic capacitors with standard and flexible terminations
|
Keimasi, Mohammadreza
|
|
2007
|
47 |
12 |
p. 2215-2225
11 p.
|
artikel
|
| 32 |
Life cycle cost impact of using prognostic health management (PHM) for helicopter avionics
|
Scanff, E.
|
|
2007
|
47 |
12 |
p. 1857-1864
8 p.
|
artikel
|
| 33 |
Low frequency noise in nMOSFETs with subnanometer EOT hafnium-based gate dielectrics
|
Magnone, P.
|
|
2007
|
47 |
12 |
p. 2109-2113
5 p.
|
artikel
|
| 34 |
Measuring the through-plane elastic modulus of thin polymer films in situ
|
van Soestbergen, M.
|
|
2007
|
47 |
12 |
p. 1983-1988
6 p.
|
artikel
|
| 35 |
Metal gates and gate-deposition-induced defects in Ta2O5 stack capacitors
|
Atanassova, E.
|
|
2007
|
47 |
12 |
p. 2088-2093
6 p.
|
artikel
|
| 36 |
Microstructural considerations for ultrafine lead free solder joints
|
Huang, Zhiheng
|
|
2007
|
47 |
12 |
p. 1997-2006
10 p.
|
artikel
|
| 37 |
Multiple high-voltage pulse stressing of conventional thick-film resistors
|
Stanimirović, I.
|
|
2007
|
47 |
12 |
p. 2242-2248
7 p.
|
artikel
|
| 38 |
[No title]
|
Stojcev, Mile
|
|
2007
|
47 |
12 |
p. 2287-2288
2 p.
|
artikel
|
| 39 |
[No title]
|
Stojcev, Mile
|
|
2007
|
47 |
12 |
p. 2282-2283
2 p.
|
artikel
|
| 40 |
[No title]
|
Stojcev, Mile
|
|
2007
|
47 |
12 |
p. 2289-2290
2 p.
|
artikel
|
| 41 |
[No title]
|
Stojcev, Mile
|
|
2007
|
47 |
12 |
p. 2284-2286
3 p.
|
artikel
|
| 42 |
Polarity asymmetry of stress and charge trapping behavior of thin Hf- and Zr-silicate layers
|
Paskaleva, A.
|
|
2007
|
47 |
12 |
p. 2094-2099
6 p.
|
artikel
|
| 43 |
Predicting the process induced warpage of electronic packages using the P–V–T–C equation and the Taguchi method
|
Teng, Shiang-Yu
|
|
2007
|
47 |
12 |
p. 2231-2241
11 p.
|
artikel
|
| 44 |
Prognostics implementation of electronics under vibration loading
|
Gu, Jie
|
|
2007
|
47 |
12 |
p. 1849-1856
8 p.
|
artikel
|
| 45 |
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device
|
Yamada, Y.
|
|
2007
|
47 |
12 |
p. 2147-2151
5 p.
|
artikel
|
| 46 |
Simplified terrain identification and component fatigue damage estimation model for use in a health and usage monitoring system
|
Heine, Richard
|
|
2007
|
47 |
12 |
p. 1882-1888
7 p.
|
artikel
|
| 47 |
Simulation and fabrication of magnetic rotary microgenerator with multipolar Nd/Fe/B magnet
|
Pan, C.T.
|
|
2007
|
47 |
12 |
p. 2129-2134
6 p.
|
artikel
|
| 48 |
Stress induced gate–drain leakage current in ultra-thin gate oxide
|
Petit, C.
|
|
2007
|
47 |
12 |
p. 2070-2081
12 p.
|
artikel
|
| 49 |
Study of the electrolyte-insulator-semiconductor field-effect transistor (EISFET) with applications in biosensor design
|
Waleed Shinwari, M.
|
|
2007
|
47 |
12 |
p. 2025-2057
33 p.
|
artikel
|
| 50 |
Testing process precision for truncated normal distributions
|
Pearn, W.L.
|
|
2007
|
47 |
12 |
p. 2275-2281
7 p.
|
artikel
|
| 51 |
The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages
|
Wang, Jinlin
|
|
2007
|
47 |
12 |
p. 1958-1966
9 p.
|
artikel
|
| 52 |
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
|
Wymysłowski, Artur
|
|
2007
|
47 |
12 |
p. 1967-1968
2 p.
|
artikel
|
| 53 |
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition
|
Yeh, Chang-Lin
|
|
2007
|
47 |
12 |
p. 2188-2196
9 p.
|
artikel
|
| 54 |
Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages
|
Perkins, Andy
|
|
2007
|
47 |
12 |
p. 2260-2274
15 p.
|
artikel
|
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