| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects
|
Yan, M.Y.
|
|
2006
|
46 |
8 |
p. 1392-1395
4 p.
|
artikel
|
| 2 |
Analogue electronic circuit diagnosis based on ANNs
|
Litovski, Vančo
|
|
2006
|
46 |
8 |
p. 1382-1391
10 p.
|
artikel
|
| 3 |
Application of polyimide to bending-mode microactuators with Ni/Fe and Fe/Pt magnet
|
Pan, C.T.
|
|
2006
|
46 |
8 |
p. 1369-1381
13 p.
|
artikel
|
| 4 |
Compound semiconductor activation energy in humidity
|
Roesch, William J.
|
|
2006
|
46 |
8 |
p. 1238-1246
9 p.
|
artikel
|
| 5 |
Design of a novel chip on glass package solution for CMOS image sensor device
|
Chen, Ching-Yang
|
|
2006
|
46 |
8 |
p. 1326-1334
9 p.
|
artikel
|
| 6 |
Design of field-plate terminated 4H-SiC Schottky diodes using high-k dielectrics
|
Kumta, A.
|
|
2006
|
46 |
8 |
p. 1295-1302
8 p.
|
artikel
|
| 7 |
Determining factors affecting ESD failure voltage using DOE
|
Whitman, Charles
|
|
2006
|
46 |
8 |
p. 1228-1237
10 p.
|
artikel
|
| 8 |
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages
|
Lai, Yi-Shao
|
|
2006
|
46 |
8 |
p. 1357-1368
12 p.
|
artikel
|
| 9 |
Evaluation of SiGe:C HBT intrinsic reliability using conventional and step stress methodologies
|
Gaw, Craig
|
|
2006
|
46 |
8 |
p. 1272-1278
7 p.
|
artikel
|
| 10 |
Historical review of compound semiconductor reliability
|
Roesch, William J.
|
|
2006
|
46 |
8 |
p. 1218-1227
10 p.
|
artikel
|
| 11 |
2006 IEEE International Integrated Reliability Workshop (IIRW)
|
|
|
2006
|
46 |
8 |
p. 1400-
1 p.
|
artikel
|
| 12 |
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
|
Ratchev, Petar
|
|
2006
|
46 |
8 |
p. 1315-1325
11 p.
|
artikel
|
| 13 |
[No title]
|
Stojcev, Mile
|
|
2006
|
46 |
8 |
p. 1398-1399
2 p.
|
artikel
|
| 14 |
[No title]
|
Stojcev, Mile
|
|
2006
|
46 |
8 |
p. 1396-1397
2 p.
|
artikel
|
| 15 |
[No title]
|
Ersland, Peter
|
|
2006
|
46 |
8 |
p. 1217-
1 p.
|
artikel
|
| 16 |
Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling
|
Chen, H.T.
|
|
2006
|
46 |
8 |
p. 1348-1356
9 p.
|
artikel
|
| 17 |
On-chip electrostatic discharge protection for CMOS gas sensor systems-on-a-chip (SoC)
|
Salcedo, Javier A.
|
|
2006
|
46 |
8 |
p. 1285-1294
10 p.
|
artikel
|
| 18 |
Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies
|
Kangasvieri, T.
|
|
2006
|
46 |
8 |
p. 1335-1347
13 p.
|
artikel
|
| 19 |
Reliability investigation and characterization of failure modes in Schottky diodes
|
Somisetty, Shivarajiv
|
|
2006
|
46 |
8 |
p. 1254-1260
7 p.
|
artikel
|
| 20 |
Reliability of large periphery GaN-on-Si HFETs
|
Singhal, S.
|
|
2006
|
46 |
8 |
p. 1247-1253
7 p.
|
artikel
|
| 21 |
Reliability results of HBTs with an InGaP emitter
|
Whitman, Charles S.
|
|
2006
|
46 |
8 |
p. 1261-1271
11 p.
|
artikel
|
| 22 |
Reliability studies of barrier layers for Cu/PAE low-k interconnects
|
Nguyen, H.S.
|
|
2006
|
46 |
8 |
p. 1309-1314
6 p.
|
artikel
|
| 23 |
Study of dc conduction mechanisms in dysprosium–manganese oxide insulator thin films grown on Si substrates
|
Dakhel, A.A.
|
|
2006
|
46 |
8 |
p. 1303-1308
6 p.
|
artikel
|
| 24 |
Wear out failure mechanisms in aluminium and gold based LDMOS RF power applications
|
van der Wel, P.J.
|
|
2006
|
46 |
8 |
p. 1279-1284
6 p.
|
artikel
|
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