| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A MAIC approach to TFT-LCD panel quality improvement
|
Chen, K.S.
|
|
2006
|
46 |
7 |
p. 1189-1198
10 p.
|
artikel
|
| 2 |
Balancing temperature dependence of on-wafer SOS inductors
|
Karjalainen, Päivi H.
|
|
2006
|
46 |
7 |
p. 1071-1079
9 p.
|
artikel
|
| 3 |
Constructing IP cores’ transparency paths for SoC test access using greedy search
|
Xing, Jianhui
|
|
2006
|
46 |
7 |
p. 1199-1208
10 p.
|
artikel
|
| 4 |
Definition of curve fitting parameter to study tunneling and trapping of electrons in Si/ultra-thin SiO2/metal structures
|
Filip, V.
|
|
2006
|
46 |
7 |
p. 1027-1034
8 p.
|
artikel
|
| 5 |
Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure
|
Yamashita, M.
|
|
2006
|
46 |
7 |
p. 1113-1118
6 p.
|
artikel
|
| 6 |
Drop impact reliability testing for lead-free and lead-based soldered IC packages
|
Chong, Desmond Y.R.
|
|
2006
|
46 |
7 |
p. 1160-1171
12 p.
|
artikel
|
| 7 |
Effects of bonding force on contact pressure and frictional energy in wire bonding
|
Ding, Yong
|
|
2006
|
46 |
7 |
p. 1101-1112
12 p.
|
artikel
|
| 8 |
Evaluation of board-level reliability of electronic packages under consecutive drops
|
Yeh, Chang-Lin
|
|
2006
|
46 |
7 |
p. 1172-1182
11 p.
|
artikel
|
| 9 |
Experimental study and life prediction on high cycle vibration fatigue in BGA packages
|
Liu, Xia
|
|
2006
|
46 |
7 |
p. 1128-1138
11 p.
|
artikel
|
| 10 |
Failure analysis and solutions to overcome latchup failure event of a power controller IC in bulk CMOS technology
|
Chen, Shih-Hung
|
|
2006
|
46 |
7 |
p. 1042-1049
8 p.
|
artikel
|
| 11 |
Major factors to the solder joint strength of ENIG layer in FC BGA package
|
Lee, Dong-Jun
|
|
2006
|
46 |
7 |
p. 1119-1127
9 p.
|
artikel
|
| 12 |
Microstructure evolution of the Sn–Ag–y%Cu interconnect
|
Lu, Henry Y.
|
|
2006
|
46 |
7 |
p. 1058-1070
13 p.
|
artikel
|
| 13 |
Modeling and simulation of resistivity of nanometer scale copper
|
Yarimbiyik, A. Emre
|
|
2006
|
46 |
7 |
p. 1050-1057
8 p.
|
artikel
|
| 14 |
[No title]
|
Stojcev, Mile
|
|
2006
|
46 |
7 |
p. 1214-1215
2 p.
|
artikel
|
| 15 |
Optimizing the controller IC for micro HDD process based on Taguchi methods
|
Hung, Y.H.
|
|
2006
|
46 |
7 |
p. 1183-1188
6 p.
|
artikel
|
| 16 |
Stability of the warpage in a PBGA package subjected to hygro-thermal loading
|
Chien, Chi-Hui
|
|
2006
|
46 |
7 |
p. 1139-1147
9 p.
|
artikel
|
| 17 |
Stabilized emission from micro-field emitter for electron microscopy
|
Chen, L.
|
|
2006
|
46 |
7 |
p. 1209-1213
5 p.
|
artikel
|
| 18 |
Test structure assembly for bump bond yield measurement on high density flip chip technologies
|
Ullán, M.
|
|
2006
|
46 |
7 |
p. 1095-1100
6 p.
|
artikel
|
| 19 |
The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump
|
Kim, Dae Whan
|
|
2006
|
46 |
7 |
p. 1087-1094
8 p.
|
artikel
|
| 20 |
The post-damage behavior of a MOS tunnel emitter transistor
|
Tyaginov, S.E.
|
|
2006
|
46 |
7 |
p. 1035-1041
7 p.
|
artikel
|
| 21 |
Thermally induced deformation of solder joints in real packages: Measurement and analysis
|
Lu, Hua
|
|
2006
|
46 |
7 |
p. 1148-1159
12 p.
|
artikel
|
| 22 |
Tin whisker formation of lead-free plated leadframes
|
Kim, K.S.
|
|
2006
|
46 |
7 |
p. 1080-1086
7 p.
|
artikel
|
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