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                             41 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A quantitative method of reliability estimation for surface mount solder joints based on heating factor Q η Tao, Bo
2006
46 5-6 p. 864-872
9 p.
artikel
2 A reliability-driven placement procedure based on thermal-force model Lee, Jing
2006
46 5-6 p. 973-983
11 p.
artikel
3 CFCET: A hardware-based control flow checking technique in COTS processors using execution tracing Rajabzadeh, Amir
2006
46 5-6 p. 959-972
14 p.
artikel
4 Characterisation of the Al2O3 films deposited by ultrasonic spray pyrolysis and atomic layer deposition methods for passivation of 4H–SiC devices Wolborski, Maciej
2006
46 5-6 p. 743-755
13 p.
artikel
5 Characteristics of current crowding in flip-chip solder bumps Lai, Yi-Shao
2006
46 5-6 p. 915-922
8 p.
artikel
6 Comparative studies of Pt and Ir schottky contacts on undoped Al0.36Ga0.64N Guhel, Y.
2006
46 5-6 p. 786-793
8 p.
artikel
7 Critical dimension control in photolithography based on the yield by a simulation program Kang, H.Y.
2006
46 5-6 p. 1006-1012
7 p.
artikel
8 Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging Pan, M.Y.
2006
46 5-6 p. 763-767
5 p.
artikel
9 Distributed collaborative design of IP components in the TRMS environment Siekierska, K.
2006
46 5-6 p. 1019-1024
6 p.
artikel
10 Effect of wafer thinning methods towards fracture strength and topography of silicon die Jiun, Hoh Huey
2006
46 5-6 p. 836-845
10 p.
artikel
11 Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection Chen, Xu
2006
46 5-6 p. 774-785
12 p.
artikel
12 ESD protection solutions for high voltage technologies Keppens, Bart
2006
46 5-6 p. 677-688
12 p.
artikel
13 Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device Morita, Yasuyuki
2006
46 5-6 p. 923-929
7 p.
artikel
14 Feasibility study of the application of voltage contrast to printed circuit board Tan, Cher Ming
2006
46 5-6 p. 939-948
10 p.
artikel
15 Gate oxide failures due to anomalous stress from HBM ESD testers Duvvury, Charvaka
2006
46 5-6 p. 656-665
10 p.
artikel
16 High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal aging Yoon, Jeong-Won
2006
46 5-6 p. 905-914
10 p.
artikel
17 Implementation of plug-and-play ESD protection in 5.5GHz 90nm RF CMOS LNAs—Concepts, constraints and solutions Thijs, S.
2006
46 5-6 p. 702-712
11 p.
artikel
18 Improvement in high-temperature degradation by isotropic conductive adhesives including Ag–Sn alloy fillers Yamashita, M.
2006
46 5-6 p. 850-858
9 p.
artikel
19 Integrated CMOS GSM baseband channel selecting filters realized using switched capacitor finite impulse response technique Dąbrowski, A.
2006
46 5-6 p. 949-958
10 p.
artikel
20 Interfacial thermal stresses in solder joints of leadless chip resistors Ghorbani, H.R.
2006
46 5-6 p. 873-884
12 p.
artikel
21 Introduction to special section on selected papers from EOS/ESD Symposium 2004 Iyer, Natarajan Mahadeva
2006
46 5-6 p. 655-
1 p.
artikel
22 Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser element Jilesen, J.
2006
46 5-6 p. 984-993
10 p.
artikel
23 Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems Aubel, Oliver
2006
46 5-6 p. 768-773
6 p.
artikel
24 Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders Chen, W.-M.
2006
46 5-6 p. 896-904
9 p.
artikel
25 Life margin assessment with Physics of Failure Tools application to BGA packages Foucher, B.
2006
46 5-6 p. 1013-1018
6 p.
artikel
26 Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technology Yang, Zunxian
2006
46 5-6 p. 805-810
6 p.
artikel
27 New insights into board level drop impact Wong, E.H.
2006
46 5-6 p. 930-938
9 p.
artikel
28 [No title] Stojcev, Mile
2006
46 5-6 p. 1025-1026
2 p.
artikel
29 On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials Lai, Yi-Shao
2006
46 5-6 p. 859-863
5 p.
artikel
30 Physical fundamentals of external transient latch-up and corrective actions Domański, K.
2006
46 5-6 p. 689-701
13 p.
artikel
31 Reliability and performance limitations in SiC power devices Singh, Ranbir
2006
46 5-6 p. 713-730
18 p.
artikel
32 Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection Zhang, Guang-Ming
2006
46 5-6 p. 811-821
11 p.
artikel
33 Statistical analysis of tin whisker growth Fang, Tong
2006
46 5-6 p. 846-849
4 p.
artikel
34 Stress analysis and bending tests for GaAs wafers Dreyer, W.
2006
46 5-6 p. 822-835
14 p.
artikel
35 Study of CDM specific effects for a smart power input protection structure Etherton, M.
2006
46 5-6 p. 666-676
11 p.
artikel
36 Study of RF N− LDMOS critical electrical parameter drifts after a thermal and electrical ageing in pulsed RF Maanane, H.
2006
46 5-6 p. 994-1000
7 p.
artikel
37 Study of the power capability of LDMOS and the improved methods Sun, Zhilin
2006
46 5-6 p. 1001-1005
5 p.
artikel
38 The effect of die attach voiding on the thermal resistance of chip level packages Fleischer, Amy S.
2006
46 5-6 p. 794-804
11 p.
artikel
39 Transient fracturing of solder joints subjected to displacement-controlled impact loads Yeh, Chang-Lin
2006
46 5-6 p. 885-895
11 p.
artikel
40 Understanding threshold voltage in undoped-body MOSFETs: An appraisal of various criteria Sánchez, F.J. Garcı́a
2006
46 5-6 p. 731-742
12 p.
artikel
41 Vertically high-density interconnection for mobile application Katahira, Takayoshi
2006
46 5-6 p. 756-762
7 p.
artikel
                             41 gevonden resultaten
 
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