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                             38 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A mid-value select voter Krstic, M.D.
 2005
 45 3-4 p. 733-738
6 p.
 artikel
2 Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile Cortés, I.
 2005
 45 3-4 p. 493-498
6 p.
 artikel
3 A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure Vanstreels, K.
 2005
 45 3-4 p. 753-759
7 p.
 artikel
4 A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II—Latchup Voldman, Steven H.
 2005
 45 3-4 p. 437-455
19 p.
 artikel
5 A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections Tsang, C.F.
 2005
 45 3-4 p. 517-525
9 p.
 artikel
6 Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications Radovanović, Saša
 2005
 45 3-4 p. 705-710
6 p.
 artikel
7 Bipolar SCR ESD devices Vashchenko, V.A.
 2005
 45 3-4 p. 457-471
15 p.
 artikel
8 Characterization of bump arrays at RF/microwave frequencies Ndip, Ivan N.
 2005
 45 3-4 p. 551-558
8 p.
 artikel
9 Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry Joo, Jinwon
 2005
 45 3-4 p. 637-646
10 p.
 artikel
10 Chemical and diffusion-controlled curing kinetics of an underfill material He, Yi
 2005
 45 3-4 p. 689-695
7 p.
 artikel
11 Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides Suehle, J.S.
 2005
 45 3-4 p. 419-426
8 p.
 artikel
12 Electrothermal characterization of silicon-on-glass VDMOSFETs Nenadović, N.
 2005
 45 3-4 p. 541-550
10 p.
 artikel
13 Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate Waris, Tuomas F.
 2005
 45 3-4 p. 665-673
9 p.
 artikel
14 Evaluation of parasitic capacitances for interconnection buses crossing in different layers Jarosz, A.
 2005
 45 3-4 p. 761-765
5 p.
 artikel
15 Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation Lim, Ji-hyuk
 2005
 45 3-4 p. 473-478
6 p.
 artikel
16 Flip chip attachment on flexible LCP substrate using an ACF Frisk, L.
 2005
 45 3-4 p. 583-588
6 p.
 artikel
17 Gate dielectric breakdown in the time-scale of ESD events Weir, Bonnie E.
 2005
 45 3-4 p. 427-436
10 p.
 artikel
18 Hybrid reliability assessment for packaging prototyping Lu, Hua
 2005
 45 3-4 p. 597-609
13 p.
 artikel
19 Impact of gate-leakage currents on CMOS circuit performance Marras, Alessandro
 2005
 45 3-4 p. 499-506
8 p.
 artikel
20 Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies Goguenheim, D.
 2005
 45 3-4 p. 487-492
6 p.
 artikel
21 Improving reliability of beveled power semiconductor devices passivated by SIPOS Wang, Ying
 2005
 45 3-4 p. 535-539
5 p.
 artikel
22 Intermediate wafer level bonding and interface behavior Pan, C.T.
 2005
 45 3-4 p. 657-663
7 p.
 artikel
23 Low voltage SILC and P- and N-MOSFET gate oxide reliability Petit, C.
 2005
 45 3-4 p. 479-485
7 p.
 artikel
24 Measuring process capability based on C PK with gauge measurement errors Pearn, W.L.
 2005
 45 3-4 p. 739-751
13 p.
 artikel
25 Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique Islam, T.
 2005
 45 3-4 p. 697-703
7 p.
 artikel
26 MOS current divider based PGA Sanz, M. Teresa
 2005
 45 3-4 p. 727-732
6 p.
 artikel
27 100 μm Pitch flip chip on foil assemblies with adhesive interconnections de Vries, J.
 2005
 45 3-4 p. 527-534
8 p.
 artikel
28 Novel concepts for reliability technology Ryu, Dongsu
 2005
 45 3-4 p. 611-622
12 p.
 artikel
29 Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards Siau, Sam
 2005
 45 3-4 p. 675-687
13 p.
 artikel
30 Response surface models for efficient, modular estimation of solder joint reliability in area array packages Zhang, L.
 2005
 45 3-4 p. 623-635
13 p.
 artikel
31 Review of add-on process modules for high-frequency silicon technology Burghartz, J.N.
 2005
 45 3-4 p. 409-418
10 p.
 artikel
32 SiLK™ etch optimization and electrical characterization for 0.13 μm interconnects Murthy, Ramana
 2005
 45 3-4 p. 507-516
10 p.
 artikel
33 Study of anisotropic conductive adhesive joint behavior under 3-point bending Rizvi, M.J.
 2005
 45 3-4 p. 589-596
8 p.
 artikel
34 Systematic evaluation of thermal interface materials—a case study in high power amplifier design Maguire, Luke
 2005
 45 3-4 p. 711-725
15 p.
 artikel
35 The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces Kim, K.S.
 2005
 45 3-4 p. 647-655
9 p.
 artikel
36 Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E Tao, Yi
 2005
 45 3-4 p. 559-566
8 p.
 artikel
37 Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs Shimoto, Tadanori
 2005
 45 3-4 p. 567-574
8 p.
 artikel
38 Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly Lai, Yi-Shao
 2005
 45 3-4 p. 575-582
8 p.
 artikel
                             38 gevonden resultaten
 
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