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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
104 results found
no
title
author
magazine
year
volume
issue
page(s)
type
1
A CAD assisted design and optimisation methodology for over-voltage ESD protection circuits
2004
44
9-11
p. 1885-1890
6 p.
article
2
A case study of ESD failures at random levels: analysis, explanation and solution
2004
44
9-11
p. 1823-1827
5 p.
article
3
AFM-based scanning capacitance techniques for deep sub-micron semiconductor failure analysis
2004
44
9-11
p. 1615-1619
5 p.
article
4
A laser-based instrument for measuring strain in electronic packages using coherent fibre-bundles
2004
44
9-11
p. 1693-1697
5 p.
article
5
Analysis and optimisation through innovative driving strategy of high power IGBT performances/EMI reduction trade-off for converter systems in railway applications
Busatto, G.
2004
44
9-11
p. 1443-1448
6 p.
article
6
Analysis of PowerMOSFET chips failed in thermal instability
2004
44
9-11
p. 1419-1424
6 p.
article
7
Analysis of the layout impact on electric fields in interconnect structures using finite element method
2004
44
9-11
p. 1867-1871
5 p.
article
8
Analysis of wire bond and metallization degradation mechanisms in DMOS power transistors stressed under thermal overload conditions
2004
44
9-11
p. 1485-1490
6 p.
article
9
A new approach to the modeling of oxide breakdown on CMOS circuits
2004
44
9-11
p. 1519-1522
4 p.
article
10
A new structure to monitor electrical transients during programming of EEPROM memory cells
2004
44
9-11
p. 1745-1750
6 p.
article
11
An improved isothermal electromigration test for Cu-damascene characterization
2004
44
9-11
p. 1855-1860
6 p.
article
12
A Novel Automatic Polishing Technique for Micro-Controllers with 45° off Si <100> Rotation
2004
44
9-11
p. 1611-1614
4 p.
article
13
A study of an abnormal ESD failure mechanism and threshold voltage caused by ESD current zapping sequence
2004
44
9-11
p. 1829-1834
6 p.
article
14
Author index
2004
44
9-11
p. I-III
nvt p.
article
15
Automated Diagnosis and Probing Flow for Fast Fault Localization in IC
2004
44
9-11
p. 1553-1558
6 p.
article
16
Characterization and fatigue damage simulation in SAC solder joints
2004
44
9-11
p. 1287-1292
6 p.
article
17
Characterization and Modelling of Moisture Driven Interface Failures
2004
44
9-11
p. 1317-1322
6 p.
article
18
Characterization of self-heating effects in semiconductor resistors during transmission line pulses
2004
44
9-11
p. 1873-1878
6 p.
article
19
Comparative study of thermal cycling and thermal shocks tests on electronic components reliability
2004
44
9-11
p. 1343-1347
5 p.
article
20
Compare of SOI and SOS LIGBT structure for the thermal conductivity and self-heating characteristics
2004
44
9-11
p. 1479-1483
5 p.
article
21
Comparison Between the Behaviour of Punch-Through and Non-Punch-Through Insulated Gate Bipolar Transistors Under High Temperature Reverse Bias Stress
2004
44
9-11
p. 1461-1465
5 p.
article
22
Creep as a reliability problem in MEMS
2004
44
9-11
p. 1733-1738
6 p.
article
23
Current crowding in faulty MOSFET: optical and electrical investigation
2004
44
9-11
p. 1577-1581
5 p.
article
24
2D Dopant Profiling on 4H Silicon Carbide P+N Junction by Scanning Capacitance and Scanning Electron Microscopy
2004
44
9-11
p. 1681-1686
6 p.
article
25
Degradation of electrical performance and floating body effect in ultra thin gate oxide FD-SOI n-MOSFETs by 7.5-MeV proton irradiation
2004
44
9-11
p. 1721-1726
6 p.
article
26
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates
2004
44
9-11
p. 1305-1310
6 p.
article
27
Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages
2004
44
9-11
p. 1293-1297
5 p.
article
28
Effect of Pre-Existing Defects on Reliability Assessment of High-K Gate Dielectrics
2004
44
9-11
p. 1509-1512
4 p.
article
29
Effects of hot carrier and irradiation stresses on advanced excimer laser annealed polycrystalline silicon thin film transistors
2004
44
9-11
p. 1631-1636
6 p.
article
30
Effects of hot carrier stress on the RF performance in SOI MOSFETs
2004
44
9-11
p. 1637-1642
6 p.
article
31
Electrostatic Effects on Semiconductor Tools
2004
44
9-11
p. 1787-1792
6 p.
article
32
Enhancement of breakdown voltage for Ni-SiC Schottky diodes utilizing field plate edge termination
2004
44
9-11
p. 1473-1478
6 p.
article
33
Evaluation of STI degradation using temperature dependence of leakage current in parasitic STI MOSFET
2004
44
9-11
p. 1751-1755
5 p.
article
34
Evidence for source side injection hot carrier effects on lateral DMOS transistors
2004
44
9-11
p. 1621-1624
4 p.
article
35
Experimental characterization of temperature distribution on Power MOS devices during Unclamped Inductive Switching
2004
44
9-11
p. 1455-1459
5 p.
article
36
Experimental measurements and 3D simulation of the parasitic lateral bipolar transistor triggering within a single finger gg-nMOS under ESD
2004
44
9-11
p. 1775-1780
6 p.
article
37
Extraction of the trap distribution responsible for SILCs in MOS structures from the measurements and simulations of DC and noise properties
2004
44
9-11
p. 1497-1501
5 p.
article
38
Fail / recover / fail (F/R/F) failure mechanisms new trend
2004
44
9-11
p. 1571-1575
5 p.
article
39
Failure analysis of RFIC amplifiers
2004
44
9-11
p. 1599-1604
6 p.
article
40
Failure Analysis of RuO2 Thick Film Chip Resistors
2004
44
9-11
p. 1763-1767
5 p.
article
41
Failure analysis of vertical cavity surface emission laser diodes
2004
44
9-11
p. 1593-1597
5 p.
article
42
Femtosecond Laser Ablation for Backside Silicon Thinning
2004
44
9-11
p. 1605-1609
5 p.
article
43
Field Failure Mechanism Investigation of GaAs based HBT Power Amplifier Mmodule (PAM)
2004
44
9-11
p. 1393-1398
6 p.
article
44
First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles
2004
44
9-11
p. 1769-1773
5 p.
article
45
Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology
2004
44
9-11
p. 1281-1285
5 p.
article
46
Gallium Artefacts on FIB-milled Silicon Samples
2004
44
9-11
p. 1583-1588
6 p.
article
47
High reliable high power diode for welding applications
2004
44
9-11
p. 1437-1441
5 p.
article
48
Hot carrier aging degradation phenomena in GaN based MESFETs
2004
44
9-11
p. 1375-1380
6 p.
article
49
How to study delamination in plastic encapsulated devices
2004
44
9-11
p. 1311-1316
6 p.
article
50
Impact of the space environmental conditions on the reliability of a MEMS COTS based system
2004
44
9-11
p. 1739-1744
6 p.
article
51
Implementation of TRE systems into Emission Microscopes
2004
44
9-11
p. 1529-1534
6 p.
article
52
Influence of the thermo-mechanical residual state on the power assembly modellization
2004
44
9-11
p. 1331-1335
5 p.
article
53
Integrated thermo-mechanical design and qualification of wafer backend structures
2004
44
9-11
p. 1349-1354
6 p.
article
54
Interactive and non-destructive verification of sram-descrambling with laser
2004
44
9-11
p. 1669-1674
6 p.
article
55
Investigation of IGBT turn-on failure under high applied voltage operation
2004
44
9-11
p. 1431-1436
6 p.
article
56
Investigation of SEU sensitivity of Xilinx Virtex II FPGA by pulsed laser fault injections
2004
44
9-11
p. 1709-1714
6 p.
article
57
Light Emission From Small Technologies. Are Silicon Based Detectors Reaching Their Limits?
2004
44
9-11
p. 1715-1720
6 p.
article
58
Localization of FET Device Performance with Thermal Laser Stimulation
2004
44
9-11
p. 1699-1702
4 p.
article
59
Locating hot carrier injection in n-type DeMOS transistors by Charge Pumping and 2D device simulations
2004
44
9-11
p. 1625-1629
5 p.
article
60
Low frequency noise as a reliability diagnostic tool in compound semiconductor transistors
2004
44
9-11
p. 1361-1368
8 p.
article
61
Low Frequency Noise Measurements for ESD Latent Defect Detection in High Reliability Applications
2004
44
9-11
p. 1781-1786
6 p.
article
62
Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems
2004
44
9-11
p. 1559-1563
5 p.
article
63
Metal migration in epoxy encapsulated ECL devices
2004
44
9-11
p. 1323-1330
8 p.
article
64
Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown
2004
44
9-11
p. 1491-1496
6 p.
article
65
MTF test system with AC based dynamic joule correction for electromigration tests on interconnects
2004
44
9-11
p. 1849-1854
6 p.
article
66
Multiple-time-instant 2D thermal mapping during a single ESD event
2004
44
9-11
p. 1793-1798
6 p.
article
67
New trends in the application of Scanning Probe Techniques in Failure Analysis
2004
44
9-11
p. 1541-1546
6 p.
article
68
Non destructive control of flip chip packages for space applications
2004
44
9-11
p. 1355-1359
5 p.
article
69
[No title]
Ciappa, Mauro
2004
44
9-11
p. xi-
1 p.
article
70
On the defects introduced by AC and DC hot carrier stress in SOI PD MOSFETs
2004
44
9-11
p. 1643-1647
5 p.
article
71
On the Use of Neural Networks to Solve the Reverse Modelling Problem for the Quantification of Dopant Profiles Extracted by Scanning Probe Microscopy Techniques
2004
44
9-11
p. 1703-1708
6 p.
article
72
On-wafer low frequency noise measurements of SiGe HBTs: Impact of technological improvements on 1/f noise
2004
44
9-11
p. 1387-1392
6 p.
article
73
Overcoming Fault Test Coverage with Time-Resolved Emission (TRE) Probing
2004
44
9-11
p. 1535-1539
5 p.
article
74
Partial Discharge Failure Analysis of AIN Substrates for IGBT Modules
2004
44
9-11
p. 1425-1430
6 p.
article
75
Passivation schemes to improve power devices HAST robustness
2004
44
9-11
p. 1467-1471
5 p.
article
76
Plasma Charging Damage Reduction in IC Processing by A Self-balancing Interconnect
2004
44
9-11
p. 1503-1507
5 p.
article
77
Quantitative 3D reconstruction from BS imaging
2004
44
9-11
p. 1547-1552
6 p.
article
78
Reduced Hot Carrier Effects in Self-Aligned Ground-Plane FDSOI MOSFET’s
2004
44
9-11
p. 1649-1654
6 p.
article
79
Reliability Challenges with Ultra-Low k Interlevel Dielectrics
2004
44
9-11
p. 1835-1841
7 p.
article
80
Reliability determination of aluminium electrolytic capacitors by the mean of various methods. Application to the protection system of the LHC
2004
44
9-11
p. 1757-1762
6 p.
article
81
Reliability Evaluation and Redesign of LNA
2004
44
9-11
p. 1727-1732
6 p.
article
82
Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology
2004
44
9-11
p. 1843-1848
6 p.
article
83
Reliability Investigation of Gallium Nitride HEMT
2004
44
9-11
p. 1369-1373
5 p.
article
84
Reliability of High-K Dielectrics and Its Dependence on Gate Electrode and Interfacial / High-K Bi-Layer Structure
2004
44
9-11
p. 1513-1518
6 p.
article
85
Reliability of Low-Cost PCB Interconnections for Telecommunication Applications
2004
44
9-11
p. 1299-1304
6 p.
article
86
Reliability of power electronic devices against cosmic radiation-induced failure
2004
44
9-11
p. 1399-1406
8 p.
article
87
Reliability study of Power RF LDMOS for Radar Application
2004
44
9-11
p. 1449-1454
6 p.
article
88
Semiconductors in high temperature applications – a future trend in automotive industry
2004
44
9-11
p. 1413-1417
5 p.
article
89
Standard and C-AFM tests to study the post-BD gate oxide conduction of MOS devices after current limited stresses
2004
44
9-11
p. 1523-1528
6 p.
article
90
Statistical simulation of gate dielectric wearout, leakage, and breakdown
2004
44
9-11
p. 1879-1884
6 p.
article
91
Study and validation of a power-rail ESD clamp in BiCMOS process with a reduced temperature dependency of its leakage current
2004
44
9-11
p. 1799-1804
6 p.
article
92
Study of influence of failure modes on lifetime distribution prediction of 1.55 μm DFB Laser diodes using weak drift of monitored parameters during ageing tests
2004
44
9-11
p. 1337-1342
6 p.
article
93
Study of the ESD defects impact on ICs reliability
2004
44
9-11
p. 1811-1815
5 p.
article
94
Study on electrostatic discharge (ESD) reliability improvement of ZnO-based multilayered chip varistor(MLV)
2004
44
9-11
p. 1565-1569
5 p.
article
95
Temperature-dependent breakdown and hot carrier stress of PHEMTs
2004
44
9-11
p. 1381-1385
5 p.
article
96
Testing of Ultra Low Voltage VLSI Chips using the Superconducting Single-Photon Detector (SSPD)
2004
44
9-11
p. 1663-1668
6 p.
article
97
The Failure Analysis of High Voltage Tolerance IO Buffer under ESD
2004
44
9-11
p. 1805-1810
6 p.
article
98
The Impact of CMOS technology scaling on MOSFETs second breakdown: Evaluation of ESD robustness
2004
44
9-11
p. 1817-1822
6 p.
article
99
The Role of the Parasitic BJT Parameters on the Reliability of New Generation Power MOSFET during Heavy Ion Exposure
2004
44
9-11
p. 1407-1411
5 p.
article
100
Time dependent dielectric breakdown in a low-k interlevel dielectric
2004
44
9-11
p. 1861-1865
5 p.
article
101
Time Resolved Photon Emission Processing Flow for IC Analysis
2004
44
9-11
p. 1655-1662
8 p.
article
102
Transient interferometric mapping of smart power SOI ESD protection devices under TLP and vf-TLP stress
2004
44
9-11
p. 1687-1692
6 p.
article
103
Understanding the effects of NIR laser stimulation on NMOS transistor
2004
44
9-11
p. 1675-1680
6 p.
article
104
VCO phase noise improvement through direct passive component modification in the FIB
2004
44
9-11
p. 1589-1592
4 p.
article
104 results found
Koninklijke Bibliotheek -
National Library of the Netherlands