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                             104 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A CAD assisted design and optimisation methodology for over-voltage ESD protection circuits 2004
 44 9-11 p. 1885-1890
6 p.
 artikel
2 A case study of ESD failures at random levels: analysis, explanation and solution 2004
 44 9-11 p. 1823-1827
5 p.
 artikel
3 AFM-based scanning capacitance techniques for deep sub-micron semiconductor failure analysis 2004
 44 9-11 p. 1615-1619
5 p.
 artikel
4 A laser-based instrument for measuring strain in electronic packages using coherent fibre-bundles 2004
 44 9-11 p. 1693-1697
5 p.
 artikel
5 Analysis and optimisation through innovative driving strategy of high power IGBT performances/EMI reduction trade-off for converter systems in railway applications Busatto, G.
 2004
 44 9-11 p. 1443-1448
6 p.
 artikel
6 Analysis of PowerMOSFET chips failed in thermal instability 2004
 44 9-11 p. 1419-1424
6 p.
 artikel
7 Analysis of the layout impact on electric fields in interconnect structures using finite element method 2004
 44 9-11 p. 1867-1871
5 p.
 artikel
8 Analysis of wire bond and metallization degradation mechanisms in DMOS power transistors stressed under thermal overload conditions 2004
 44 9-11 p. 1485-1490
6 p.
 artikel
9 A new approach to the modeling of oxide breakdown on CMOS circuits 2004
 44 9-11 p. 1519-1522
4 p.
 artikel
10 A new structure to monitor electrical transients during programming of EEPROM memory cells 2004
 44 9-11 p. 1745-1750
6 p.
 artikel
11 An improved isothermal electromigration test for Cu-damascene characterization 2004
 44 9-11 p. 1855-1860
6 p.
 artikel
12 A Novel Automatic Polishing Technique for Micro-Controllers with 45° off Si <100> Rotation 2004
 44 9-11 p. 1611-1614
4 p.
 artikel
13 A study of an abnormal ESD failure mechanism and threshold voltage caused by ESD current zapping sequence 2004
 44 9-11 p. 1829-1834
6 p.
 artikel
14 Author index 2004
 44 9-11 p. I-III
nvt p.
 artikel
15 Automated Diagnosis and Probing Flow for Fast Fault Localization in IC 2004
 44 9-11 p. 1553-1558
6 p.
 artikel
16 Characterization and fatigue damage simulation in SAC solder joints 2004
 44 9-11 p. 1287-1292
6 p.
 artikel
17 Characterization and Modelling of Moisture Driven Interface Failures 2004
 44 9-11 p. 1317-1322
6 p.
 artikel
18 Characterization of self-heating effects in semiconductor resistors during transmission line pulses 2004
 44 9-11 p. 1873-1878
6 p.
 artikel
19 Comparative study of thermal cycling and thermal shocks tests on electronic components reliability 2004
 44 9-11 p. 1343-1347
5 p.
 artikel
20 Compare of SOI and SOS LIGBT structure for the thermal conductivity and self-heating characteristics 2004
 44 9-11 p. 1479-1483
5 p.
 artikel
21 Comparison Between the Behaviour of Punch-Through and Non-Punch-Through Insulated Gate Bipolar Transistors Under High Temperature Reverse Bias Stress 2004
 44 9-11 p. 1461-1465
5 p.
 artikel
22 Creep as a reliability problem in MEMS 2004
 44 9-11 p. 1733-1738
6 p.
 artikel
23 Current crowding in faulty MOSFET: optical and electrical investigation 2004
 44 9-11 p. 1577-1581
5 p.
 artikel
24 2D Dopant Profiling on 4H Silicon Carbide P+N Junction by Scanning Capacitance and Scanning Electron Microscopy 2004
 44 9-11 p. 1681-1686
6 p.
 artikel
25 Degradation of electrical performance and floating body effect in ultra thin gate oxide FD-SOI n-MOSFETs by 7.5-MeV proton irradiation 2004
 44 9-11 p. 1721-1726
6 p.
 artikel
26 Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates 2004
 44 9-11 p. 1305-1310
6 p.
 artikel
27 Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages 2004
 44 9-11 p. 1293-1297
5 p.
 artikel
28 Effect of Pre-Existing Defects on Reliability Assessment of High-K Gate Dielectrics 2004
 44 9-11 p. 1509-1512
4 p.
 artikel
29 Effects of hot carrier and irradiation stresses on advanced excimer laser annealed polycrystalline silicon thin film transistors 2004
 44 9-11 p. 1631-1636
6 p.
 artikel
30 Effects of hot carrier stress on the RF performance in SOI MOSFETs 2004
 44 9-11 p. 1637-1642
6 p.
 artikel
31 Electrostatic Effects on Semiconductor Tools 2004
 44 9-11 p. 1787-1792
6 p.
 artikel
32 Enhancement of breakdown voltage for Ni-SiC Schottky diodes utilizing field plate edge termination 2004
 44 9-11 p. 1473-1478
6 p.
 artikel
33 Evaluation of STI degradation using temperature dependence of leakage current in parasitic STI MOSFET 2004
 44 9-11 p. 1751-1755
5 p.
 artikel
34 Evidence for source side injection hot carrier effects on lateral DMOS transistors 2004
 44 9-11 p. 1621-1624
4 p.
 artikel
35 Experimental characterization of temperature distribution on Power MOS devices during Unclamped Inductive Switching 2004
 44 9-11 p. 1455-1459
5 p.
 artikel
36 Experimental measurements and 3D simulation of the parasitic lateral bipolar transistor triggering within a single finger gg-nMOS under ESD 2004
 44 9-11 p. 1775-1780
6 p.
 artikel
37 Extraction of the trap distribution responsible for SILCs in MOS structures from the measurements and simulations of DC and noise properties 2004
 44 9-11 p. 1497-1501
5 p.
 artikel
38 Fail / recover / fail (F/R/F) failure mechanisms new trend 2004
 44 9-11 p. 1571-1575
5 p.
 artikel
39 Failure analysis of RFIC amplifiers 2004
 44 9-11 p. 1599-1604
6 p.
 artikel
40 Failure Analysis of RuO2 Thick Film Chip Resistors 2004
 44 9-11 p. 1763-1767
5 p.
 artikel
41 Failure analysis of vertical cavity surface emission laser diodes 2004
 44 9-11 p. 1593-1597
5 p.
 artikel
42 Femtosecond Laser Ablation for Backside Silicon Thinning 2004
 44 9-11 p. 1605-1609
5 p.
 artikel
43 Field Failure Mechanism Investigation of GaAs based HBT Power Amplifier Mmodule (PAM) 2004
 44 9-11 p. 1393-1398
6 p.
 artikel
44 First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles 2004
 44 9-11 p. 1769-1773
5 p.
 artikel
45 Full ball shear metrology as defect detection and analysis tool for solder joint reliability assessment on direct immersion gold technology 2004
 44 9-11 p. 1281-1285
5 p.
 artikel
46 Gallium Artefacts on FIB-milled Silicon Samples 2004
 44 9-11 p. 1583-1588
6 p.
 artikel
47 High reliable high power diode for welding applications 2004
 44 9-11 p. 1437-1441
5 p.
 artikel
48 Hot carrier aging degradation phenomena in GaN based MESFETs 2004
 44 9-11 p. 1375-1380
6 p.
 artikel
49 How to study delamination in plastic encapsulated devices 2004
 44 9-11 p. 1311-1316
6 p.
 artikel
50 Impact of the space environmental conditions on the reliability of a MEMS COTS based system 2004
 44 9-11 p. 1739-1744
6 p.
 artikel
51 Implementation of TRE systems into Emission Microscopes 2004
 44 9-11 p. 1529-1534
6 p.
 artikel
52 Influence of the thermo-mechanical residual state on the power assembly modellization 2004
 44 9-11 p. 1331-1335
5 p.
 artikel
53 Integrated thermo-mechanical design and qualification of wafer backend structures 2004
 44 9-11 p. 1349-1354
6 p.
 artikel
54 Interactive and non-destructive verification of sram-descrambling with laser 2004
 44 9-11 p. 1669-1674
6 p.
 artikel
55 Investigation of IGBT turn-on failure under high applied voltage operation 2004
 44 9-11 p. 1431-1436
6 p.
 artikel
56 Investigation of SEU sensitivity of Xilinx Virtex II FPGA by pulsed laser fault injections 2004
 44 9-11 p. 1709-1714
6 p.
 artikel
57 Light Emission From Small Technologies. Are Silicon Based Detectors Reaching Their Limits? 2004
 44 9-11 p. 1715-1720
6 p.
 artikel
58 Localization of FET Device Performance with Thermal Laser Stimulation 2004
 44 9-11 p. 1699-1702
4 p.
 artikel
59 Locating hot carrier injection in n-type DeMOS transistors by Charge Pumping and 2D device simulations 2004
 44 9-11 p. 1625-1629
5 p.
 artikel
60 Low frequency noise as a reliability diagnostic tool in compound semiconductor transistors 2004
 44 9-11 p. 1361-1368
8 p.
 artikel
61 Low Frequency Noise Measurements for ESD Latent Defect Detection in High Reliability Applications 2004
 44 9-11 p. 1781-1786
6 p.
 artikel
62 Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems 2004
 44 9-11 p. 1559-1563
5 p.
 artikel
63 Metal migration in epoxy encapsulated ECL devices 2004
 44 9-11 p. 1323-1330
8 p.
 artikel
64 Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown 2004
 44 9-11 p. 1491-1496
6 p.
 artikel
65 MTF test system with AC based dynamic joule correction for electromigration tests on interconnects 2004
 44 9-11 p. 1849-1854
6 p.
 artikel
66 Multiple-time-instant 2D thermal mapping during a single ESD event 2004
 44 9-11 p. 1793-1798
6 p.
 artikel
67 New trends in the application of Scanning Probe Techniques in Failure Analysis 2004
 44 9-11 p. 1541-1546
6 p.
 artikel
68 Non destructive control of flip chip packages for space applications 2004
 44 9-11 p. 1355-1359
5 p.
 artikel
69 [No title] Ciappa, Mauro
 2004
 44 9-11 p. xi-
1 p.
 artikel
70 On the defects introduced by AC and DC hot carrier stress in SOI PD MOSFETs 2004
 44 9-11 p. 1643-1647
5 p.
 artikel
71 On the Use of Neural Networks to Solve the Reverse Modelling Problem for the Quantification of Dopant Profiles Extracted by Scanning Probe Microscopy Techniques 2004
 44 9-11 p. 1703-1708
6 p.
 artikel
72 On-wafer low frequency noise measurements of SiGe HBTs: Impact of technological improvements on 1/f noise 2004
 44 9-11 p. 1387-1392
6 p.
 artikel
73 Overcoming Fault Test Coverage with Time-Resolved Emission (TRE) Probing 2004
 44 9-11 p. 1535-1539
5 p.
 artikel
74 Partial Discharge Failure Analysis of AIN Substrates for IGBT Modules 2004
 44 9-11 p. 1425-1430
6 p.
 artikel
75 Passivation schemes to improve power devices HAST robustness 2004
 44 9-11 p. 1467-1471
5 p.
 artikel
76 Plasma Charging Damage Reduction in IC Processing by A Self-balancing Interconnect 2004
 44 9-11 p. 1503-1507
5 p.
 artikel
77 Quantitative 3D reconstruction from BS imaging 2004
 44 9-11 p. 1547-1552
6 p.
 artikel
78 Reduced Hot Carrier Effects in Self-Aligned Ground-Plane FDSOI MOSFET’s 2004
 44 9-11 p. 1649-1654
6 p.
 artikel
79 Reliability Challenges with Ultra-Low k Interlevel Dielectrics 2004
 44 9-11 p. 1835-1841
7 p.
 artikel
80 Reliability determination of aluminium electrolytic capacitors by the mean of various methods. Application to the protection system of the LHC 2004
 44 9-11 p. 1757-1762
6 p.
 artikel
81 Reliability Evaluation and Redesign of LNA 2004
 44 9-11 p. 1727-1732
6 p.
 artikel
82 Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology 2004
 44 9-11 p. 1843-1848
6 p.
 artikel
83 Reliability Investigation of Gallium Nitride HEMT 2004
 44 9-11 p. 1369-1373
5 p.
 artikel
84 Reliability of High-K Dielectrics and Its Dependence on Gate Electrode and Interfacial / High-K Bi-Layer Structure 2004
 44 9-11 p. 1513-1518
6 p.
 artikel
85 Reliability of Low-Cost PCB Interconnections for Telecommunication Applications 2004
 44 9-11 p. 1299-1304
6 p.
 artikel
86 Reliability of power electronic devices against cosmic radiation-induced failure 2004
 44 9-11 p. 1399-1406
8 p.
 artikel
87 Reliability study of Power RF LDMOS for Radar Application 2004
 44 9-11 p. 1449-1454
6 p.
 artikel
88 Semiconductors in high temperature applications – a future trend in automotive industry 2004
 44 9-11 p. 1413-1417
5 p.
 artikel
89 Standard and C-AFM tests to study the post-BD gate oxide conduction of MOS devices after current limited stresses 2004
 44 9-11 p. 1523-1528
6 p.
 artikel
90 Statistical simulation of gate dielectric wearout, leakage, and breakdown 2004
 44 9-11 p. 1879-1884
6 p.
 artikel
91 Study and validation of a power-rail ESD clamp in BiCMOS process with a reduced temperature dependency of its leakage current 2004
 44 9-11 p. 1799-1804
6 p.
 artikel
92 Study of influence of failure modes on lifetime distribution prediction of 1.55 μm DFB Laser diodes using weak drift of monitored parameters during ageing tests 2004
 44 9-11 p. 1337-1342
6 p.
 artikel
93 Study of the ESD defects impact on ICs reliability 2004
 44 9-11 p. 1811-1815
5 p.
 artikel
94 Study on electrostatic discharge (ESD) reliability improvement of ZnO-based multilayered chip varistor(MLV) 2004
 44 9-11 p. 1565-1569
5 p.
 artikel
95 Temperature-dependent breakdown and hot carrier stress of PHEMTs 2004
 44 9-11 p. 1381-1385
5 p.
 artikel
96 Testing of Ultra Low Voltage VLSI Chips using the Superconducting Single-Photon Detector (SSPD) 2004
 44 9-11 p. 1663-1668
6 p.
 artikel
97 The Failure Analysis of High Voltage Tolerance IO Buffer under ESD 2004
 44 9-11 p. 1805-1810
6 p.
 artikel
98 The Impact of CMOS technology scaling on MOSFETs second breakdown: Evaluation of ESD robustness 2004
 44 9-11 p. 1817-1822
6 p.
 artikel
99 The Role of the Parasitic BJT Parameters on the Reliability of New Generation Power MOSFET during Heavy Ion Exposure 2004
 44 9-11 p. 1407-1411
5 p.
 artikel
100 Time dependent dielectric breakdown in a low-k interlevel dielectric 2004
 44 9-11 p. 1861-1865
5 p.
 artikel
101 Time Resolved Photon Emission Processing Flow for IC Analysis 2004
 44 9-11 p. 1655-1662
8 p.
 artikel
102 Transient interferometric mapping of smart power SOI ESD protection devices under TLP and vf-TLP stress 2004
 44 9-11 p. 1687-1692
6 p.
 artikel
103 Understanding the effects of NIR laser stimulation on NMOS transistor 2004
 44 9-11 p. 1675-1680
6 p.
 artikel
104 VCO phase noise improvement through direct passive component modification in the FIB 2004
 44 9-11 p. 1589-1592
4 p.
 artikel
                             104 gevonden resultaten
 
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