| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A/D converter based on a new memory cell implemented using the switched current technique
|
Śniatała, Paweł
|
|
2004
|
44 |
5 |
p. 861-867
7 p.
|
artikel
|
| 2 |
An example of fault site localization on a 0.18 μm CMOS device with combination of front and backside techniques
|
Yamada, Yoshiteru
|
|
2004
|
44 |
5 |
p. 771-778
8 p.
|
artikel
|
| 3 |
A power-constrained design strategy for CMOS tuned low noise amplifiers
|
Mitrea, O.
|
|
2004
|
44 |
5 |
p. 877-883
7 p.
|
artikel
|
| 4 |
A testing method for assessing solder joint reliability of FCBGA packages
|
Wang, Jinlin
|
|
2004
|
44 |
5 |
p. 833-840
8 p.
|
artikel
|
| 5 |
Conduction mechanisms in MOS gate dielectric films
|
Yang, B.L.
|
|
2004
|
44 |
5 |
p. 709-718
10 p.
|
artikel
|
| 6 |
Digitally programmable CMOS transconductor for very high frequency
|
Otı́n, Aránzazu
|
|
2004
|
44 |
5 |
p. 869-875
7 p.
|
artikel
|
| 7 |
Effect of microwave preheating on the bonding performance of flip chip on flex joint
|
Islam, R.A.
|
|
2004
|
44 |
5 |
p. 815-821
7 p.
|
artikel
|
| 8 |
Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences
|
Vairagar, A.V
|
|
2004
|
44 |
5 |
p. 747-754
8 p.
|
artikel
|
| 9 |
Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements
|
Fritz, Mark A.
|
|
2004
|
44 |
5 |
p. 787-796
10 p.
|
artikel
|
| 10 |
Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system
|
Shi, X.Q.
|
|
2004
|
44 |
5 |
p. 841-852
12 p.
|
artikel
|
| 11 |
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging
|
Tan, C.W.
|
|
2004
|
44 |
5 |
p. 823-831
9 p.
|
artikel
|
| 12 |
Mechanical loading of flip chip joints before underfill: the impact on yield and reliability
|
Stepniak, Frank
|
|
2004
|
44 |
5 |
p. 805-814
10 p.
|
artikel
|
| 13 |
On the reliability of ZrO2 films for VLSI applications
|
Caputo, Domenico
|
|
2004
|
44 |
5 |
p. 739-745
7 p.
|
artikel
|
| 14 |
Photo-CVD process for ultra thin SiO2 films
|
Sánchez, V.
|
|
2004
|
44 |
5 |
p. 885-888
4 p.
|
artikel
|
| 15 |
Reliability issues for flip-chip packages
|
Ho, Paul S.
|
|
2004
|
44 |
5 |
p. 719-737
19 p.
|
artikel
|
| 16 |
Statistical analysis for test lands positioning and PCB deformation during electrical testing
|
Han, L.
|
|
2004
|
44 |
5 |
p. 853-859
7 p.
|
artikel
|
| 17 |
Study on thermomechanical reliability of a tunable light modulator
|
Mo, Zhimin
|
|
2004
|
44 |
5 |
p. 779-785
7 p.
|
artikel
|
| 18 |
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
|
Manessis, Dionysios
|
|
2004
|
44 |
5 |
p. 797-803
7 p.
|
artikel
|
| 19 |
Thermal design and experimental validation for optical transmitters
|
Shi, Peter Z.F.
|
|
2004
|
44 |
5 |
p. 755-769
15 p.
|
artikel
|
Tijdschrift beschrijving