| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
AC analysis of an inverter amplifier using minimum-length trapezoidal association of transistors
|
Girardi, Alessandro
|
|
2004
|
44 |
4 |
p. 665-671
7 p.
|
artikel
|
| 2 |
A frequency-domain approach to interconnect crosstalk simulation and minimization
|
Ernesto Rayas-Sánchez, José
|
|
2004
|
44 |
4 |
p. 673-681
9 p.
|
artikel
|
| 3 |
Analysis and design of amplifiers and comparators in CMOS 0.35 μm technology
|
Cortes, Fernando Paixão
|
|
2004
|
44 |
4 |
p. 657-664
8 p.
|
artikel
|
| 4 |
Architectural design of a programmable cell for the implementation of a filter bank on FPGA
|
Louzao, J
|
|
2004
|
44 |
4 |
p. 683-695
13 p.
|
artikel
|
| 5 |
Bias-HAST on tape ball grid array (TBGA) test pattern
|
Yeung, N.H.
|
|
2004
|
44 |
4 |
p. 595-602
8 p.
|
artikel
|
| 6 |
Book review: Intellectual property protection in VLSI designs: Theory and practice, Hardcover, pp. 183, plus XIX, 106 euro, Kluwer Academic Publishers, Boston, 2003, ISBN 1-4020-7320-8
|
Qu, Gang
|
|
2004
|
44 |
4 |
p. 705-706
2 p.
|
artikel
|
| 7 |
Effects of radiation and charge trapping on the reliability of high-κ gate dielectrics
|
Felix, J.A
|
|
2004
|
44 |
4 |
p. 563-575
13 p.
|
artikel
|
| 8 |
Evaluation of MUMPS polysilicon structures for thermal flow sensors
|
León, I.
|
|
2004
|
44 |
4 |
p. 651-655
5 p.
|
artikel
|
| 9 |
Integrating thick copper/Black Diamond™ layer in CMOS interconnect process for RF passive components
|
Lihui, Guo
|
|
2004
|
44 |
4 |
p. 581-585
5 p.
|
artikel
|
| 10 |
Interfacial properties and reliability of SiO2 grown on 6H-SiC in dry O2 plus trichloroethylene
|
Lai, P.T.
|
|
2004
|
44 |
4 |
p. 577-580
4 p.
|
artikel
|
| 11 |
Latchup in voltage tolerant circuits: a new phenomenon
|
Salcedo-Suñer, Jorge
|
|
2004
|
44 |
4 |
p. 549-562
14 p.
|
artikel
|
| 12 |
Metallization of microvias by sputter-deposition
|
Uusluoto, Teija
|
|
2004
|
44 |
4 |
p. 587-593
7 p.
|
artikel
|
| 13 |
[No title]
|
Santana, Juan
|
|
2004
|
44 |
4 |
p. 649-
1 p.
|
artikel
|
| 14 |
Numerical analysis of the warpage problem in TSOP
|
Cho, Kyoungsoon
|
|
2004
|
44 |
4 |
p. 621-626
6 p.
|
artikel
|
| 15 |
Parallel color space converters for JPEG image compression
|
Agostini, Luciano Volcan
|
|
2004
|
44 |
4 |
p. 697-703
7 p.
|
artikel
|
| 16 |
Power estimation and optimization for VLIW-based embedded systems; Vittorio Zaccaria, Mariagiovanna Sami, Donatella Sciuto, Cristina Silvano. Hardcover, pp. 203, plus XXIV, 107 euro. Kluwer Academic Publishers, Boston, 2003. ISBN 1-4020-7377-1
|
Stojcev, Mile
|
|
2004
|
44 |
4 |
p. 707-708
2 p.
|
artikel
|
| 17 |
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints
|
Seppälä, A.
|
|
2004
|
44 |
4 |
p. 639-648
10 p.
|
artikel
|
| 18 |
The impact of moisture in mold compound preforms on the warpage of PBGA packages
|
Lin, T.Y
|
|
2004
|
44 |
4 |
p. 603-609
7 p.
|
artikel
|
| 19 |
Thermo-mechanical finite element analysis in a multichip build up substrate based package design
|
Zhang, Xiaowu
|
|
2004
|
44 |
4 |
p. 611-619
9 p.
|
artikel
|
| 20 |
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application
|
Kuo, Chia-Tai
|
|
2004
|
44 |
4 |
p. 627-638
12 p.
|
artikel
|
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