no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
Applications of temperature phase measurements to IC testing
|
Altet, J. |
|
2004 |
44 |
1 |
p. 95-103 9 p. |
article |
2 |
A review of electrostatic discharge (ESD) in advanced semiconductor technology
|
Voldman, Steven H. |
|
2004 |
44 |
1 |
p. 33-46 14 p. |
article |
3 |
Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications
|
Rasul, Jad S. |
|
2004 |
44 |
1 |
p. 135-140 6 p. |
article |
4 |
Design and simulation of micromechanical thermal converter for RF power sensor microsystem
|
Jakovenko, Jiri |
|
2004 |
44 |
1 |
p. 141-148 8 p. |
article |
5 |
Design criteria for low distortion in feedback OPAMP circuits; Bjornar Hernes, Trond Saether, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 160, plus XXV, 110 €. ISBN 1-4020-7356-9
|
Stojcev, Mile |
|
2004 |
44 |
1 |
p. 181-182 2 p. |
article |
6 |
Effects of electrical stress on mid-gap interface trap density and capture cross sections in n-MOSFETs characterized by pulsed interface probing measurements
|
Kwon, Hyuck In |
|
2004 |
44 |
1 |
p. 47-51 5 p. |
article |
7 |
Electron transport through broken down ultra-thin SiO2 layers in MOS devices
|
Miranda, Enrique |
|
2004 |
44 |
1 |
p. 1-23 23 p. |
article |
8 |
Fatigue analysis of high-speed photodiode submodule by using FEM
|
Kim, K.S. |
|
2004 |
44 |
1 |
p. 167-171 5 p. |
article |
9 |
Flip-chip packaging solution for CMOS image sensor device
|
Kim, Jong-heon |
|
2004 |
44 |
1 |
p. 155-161 7 p. |
article |
10 |
Hole injection enhanced hot-carrier degradation in PMOSFETs used for systems on chip applications with 6.5–2 nm thick gate-oxides
|
Bravaix, A. |
|
2004 |
44 |
1 |
p. 65-77 13 p. |
article |
11 |
Implementation of self-checking two-level combinational logic on FPGA and CPLD circuits
|
Stojčev, Mile K |
|
2004 |
44 |
1 |
p. 173-178 6 p. |
article |
12 |
Influence of mobility model on extraction of stress dependent source–drain series resistance
|
De Souza, M.M. |
|
2004 |
44 |
1 |
p. 25-32 8 p. |
article |
13 |
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis
|
Tee, Tong Yan |
|
2004 |
44 |
1 |
p. 105-114 10 p. |
article |
14 |
New distributed model of NPT IGBT dedicated to power circuits design
|
Bonnet, G. |
|
2004 |
44 |
1 |
p. 79-88 10 p. |
article |
15 |
Origin of 1/f noise in lateral PNP bipolar transistors
|
Zhao, Enhai |
|
2004 |
44 |
1 |
p. 89-94 6 p. |
article |
16 |
Simulation of partially and near fully depleted SOI MOSFET devices and circuits using SPICE compatible physical subcircuit model
|
Imam, Mohamed A. |
|
2004 |
44 |
1 |
p. 53-63 11 p. |
article |
17 |
Single-equation model for low and high voltage soft breakdown conduction
|
Miranda, E. |
|
2004 |
44 |
1 |
p. 163-166 4 p. |
article |
18 |
System on chip design languages; Anne Mignotte, Eugenio Villar, Lynn Horobin, editors, Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 283, plus IX, 141 €. ISBN 1-4020-7046-2
|
Stojcev, Mile |
|
2004 |
44 |
1 |
p. 179- 1 p. |
article |
19 |
The effect of model building on the accuracy of fatigue life predictions in electronic packages
|
Towashiraporn, P. |
|
2004 |
44 |
1 |
p. 115-127 13 p. |
article |
20 |
Thermal distribution calculations for block level placement in embedded systems
|
Patrikar, Rajendra M. |
|
2004 |
44 |
1 |
p. 129-134 6 p. |
article |
21 |
Thermosonic flip-chip bonding for SAW filter
|
Tomioka, Taizo |
|
2004 |
44 |
1 |
p. 149-154 6 p. |
article |